1. A folding knife comprising:
a blade having a tip, a tang portion, the tang portion having an end opposite the tip and a tang side surface, the tang side surface having a recess;
a first handle side being bifurcated by a longitudinally extended slot into a first portion and a spring locking portion, the slot having an open end and a closed end opposite the open end, the spring locking portion of the first handle side having a spring locking end adjacent to the open end of the slot and a wear pin disposed in the spring locking end, the wear pin extending beyond the spring locking end and slightly below a plane of the spring locking portion and toward the blade, when closed the wear pin springably slides into the recess of the tank thereby maintain the closed position, and when the blade of the folding knife is rotated to the open position, the wear pin slides under the end of the tank thereby locking the blade in the open position;
a second handle side; and
a pivot bolt extending through the first portion of the first handle side proximate the open end of the slot, through the tang portion of the blade, and through the second handle side allowing the blade to pivot at the tang portion, the blade is parallel to the first handle side and the second handle side;
wherein the spring locking portion is biased toward the blade such that when the blade is rotated to a closed position, the spring locking portion is springably disposed in the recess of the tang, and to open the folding knife, the blade is rotated such that the spring locking end springably slides under the end of the tang thereby locking the blade in an open position.
2. The folding knife of claim 1, wherein the first handle side and the second handle side are made of aluminum.
3. The folding knife of claim 1, wherein the first handle side and the second handle side are made of zinc.
4. The folding knife of claim 1, wherein the first handle side and the second handle side are made of plastic.
5. The folding knife of claim 1, wherein the recess in the tang of the blade is a hole.
6. The folding knife of claim 1, wherein the recess in the tang of the blade is a substantially round concavity.
7. The folding knife of claim 1, further comprising an overbend screw disposed in the first portion of the first handle side, the overbend screw having a screw head extending across the slot and a portion of the spring locking portion of the first handle side thereby not allowing the spring locking portion to extend above the plane of the first portion.
8. The folding knife of claim 1, wherein the pivot bolt further comprises a bolt head that extends across the slot and a portion of the spring locking portion of the first handle side thereby not allowing the spring locking portion to extend above the plane of the first portion.
9. The folding knife of claim 1, wherein the wear pin is replaceable.
10. A folding knife, comprising:
a handle having a length and a slot disposed the length of the handle and open at a distal end, a portion of the handle on a first side of the slot is a handle side having a side bifurcated slot open proximate the distal end of the handle, in communication with the slot and the side slot is a spring locking portion that is biased toward the center of the slot and having a spring end proximate the distal end of the handle;
a blade disposed within the slot of the handle having a tang at one end and pivotally attached by a pivot bolt at the distal end of the handle at the tang, the tang having a tang end and a tang side, the tang side having a tang recess; and
a wear pin is disposed in the spring end of spring locking portion of the handle;
wherein when the blade is pivoted to an open position the wear pin of the spring locking portion springably slides under the tang end of the blade thereby locking the blade in the open position, and when the spring locking portion is released from under the tang end and the blade is pivoted to a closed position thereby disposing the blade within the handle, the wear pin is springably disposed into the tang recess thereby locking the blade in the closed position.
11. The folding knife of claim 10, wherein the handle is made of aluminum.
12. The folding knife of claim 10, wherein the handle is made of zinc.
13. The folding knife of claim 10, wherein the handle is made of plastic.
14. The folding knife of claim 10, wherein the tang recess is a hole.
15. The folding knife of claim 10, wherein the tang recess is a substantially round concavity.
16. The folding knife of claim 10, further comprising an overbend screw disposed in the handle side, the overbend screw having a screw head extending across the side slot to the spring locking portion thereby not allowing the spring locking portion to extend above a plane of the handle side.
17. The folding knife of claim 10, wherein the pivot bolt further comprises a bolt head that extends across the side slot and a portion of the spring locking portion thereby not allowing the spring locking portion to extend above a plane of the handle side.
18. The folding knife of claim 10, wherein the wear pin is replaceable.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A microelectronic assembly, comprising:
an interconnection substrate having a first surface, a second surface remote from the first surface in a vertical direction, conductive structure thereon, and terminals exposed at the second surface for connection with a component;
at least two logic chips overlying the first surface of the substrate, each logic chip having a plurality of signal contacts at a front surface thereof confronting the first surface of the interconnection substrate, the signal contacts of each logic chip being directly electrically connected to the signal contacts of the other logic chips through the conductive structure of the substrate for transfer of signals between the logic chips, the signals representing at least one of data or instructions, the logic chips being adapted to simultaneously execute a set of instructions of a given thread of a process, and each logic chip having a rear surface opposite the front surface; and
a memory chip having a front surface with contacts thereon, the front surface of the memory chip confronting the rear surface of each of the at least two logic chips, the contacts of the memory chip being directly electrically connected to the signal contacts of at least one of the at least two logic chips through the conductive structure of the substrate.
2. The microelectronic assembly as claimed in claim 1, further comprising an intermediate interposer substrate located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, the intermediate interposer substrate having at least one conductive via extending therethrough between opposing first and second surfaces thereof, wherein the conductive structure of the substrate includes the at least one conductive via.
3. The microelectronic assembly as claimed in claim 1, further comprising at least one solder connect extending from the front surface of the memory chip in the vertical direction and located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes the at least one solder connect.
4. The microelectronic assembly as claimed in claim 1, further comprising at least one conductive pillar extending from the interconnection substrate in the vertical direction and located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes the at least one conductive pillar, each conductive pillar being electrically connected to a respective conductive element exposed at the front surface of the memory chip by a conductive mass.
5. The microelectronic assembly as claimed in claim 1, further comprising at least one conductive post extending from the front surface of the memory chip in the vertical direction and located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes the at least one conductive post, each conductive post being electrically connected to a respective conductive element exposed at the first surface by a conductive mass.
6. The microelectronic assembly as claimed in claim 1, further comprising at least one conductive pillar extending from the interconnection substrate in the vertical direction and at least one conductive post extending from the front surface of the memory chip in the vertical direction, each of the conductive pillars and posts located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes the conductive pillars and posts, each conductive pillar being electrically connected to a respective conductive post by a conductive mass.
7. The microelectronic assembly as claimed in claim 1, wherein the interconnection substrate includes at least one raised surface extending above the first surface in the vertical direction, the at least one raised surface located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes at least one conductive contact of the at least one raised surface.
8. The microelectronic assembly as claimed in claim 7, wherein the at least one raised surface includes a plurality of stacked dielectric layers overlying the first surface of the interconnection substrate.
9. The microelectronic assembly as claimed in claim 1, further comprising an encapsulant having a substantially planar major surface, the encapsulant extending between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the major surface of the encapsulant is substantially co-planar with the rear surface of each of the first and second logic chips.
10. The microelectronic assembly as claimed in claim 9, wherein the encapsulant has at least one conductive via extending therethrough between the major surface and a second surface opposite the major surface, and the conductive structure of the substrate includes the at least one conductive via.
11. A microelectronic assembly, comprising:
an interconnection substrate having a first surface, a second surface remote from the first surface in a vertical direction, conductive structure thereon, and terminals exposed at the second surface for connection with a component;
at least two logic chips overlying the first surface of the substrate, the logic chips having adjacent parallel edges spaced apart by no more than 500 microns, each logic chip having a plurality of signal contacts at a front surface thereof confronting the first surface of the interconnection substrate, the signal contacts of each logic chip being directly electrically connected to the signal contacts of the other logic chips through the conductive structure of the substrate for transfer of signals between the logic chips, the signals representing at least one of data or instructions, the logic chips being adapted to simultaneously execute a set of instructions of a given thread of a process, and each logic chip having a rear surface opposite the front surface; and
a memory chip having a front surface with contacts thereon and a rear surface opposite the front surface, the front surface of the memory chip confronting the rear surface of at least one of the at least two logic chips, the contacts of the memory chip being directly electrically connected to the signal contacts of at least one of the at least two logic chips through the conductive structure of the substrate.
12. The microelectronic assembly as claimed in claim 11, further comprising at least one wire bond extending from the front surface of the memory chip to the first surface of the interconnection substrate, the at least one wire bond located between first and second logic chips of the at least two logic chips in a horizontal direction perpendicular to the vertical direction, wherein the conductive structure of the substrate includes the at least one wire bond.
13. The microelectronic assembly as claimed in claim 1 or claim 11, wherein the interconnection substrate has an effective CTE less than 10 ppm\xb0 C.
14. The microelectronic assembly as claimed in claim 13, further comprising a second substrate having a surface that faces the second surface of the interconnection substrate, the second substrate having contacts electrically connected with the terminals of the interconnection substrate, the second substrate having an effective CTE greater than or equal to 10 ppm\xb0 C. and having second terminals on a surface opposite the surface that faces the interconnection substrate.
15. The microelectronic assembly as claimed in claim 1 or claim 11, wherein the interconnection substrate has an effective CTE less than 7 ppm\xb0 C.
16. The microelectronic assembly as claimed in claim 1 or claim 11, wherein the at least two logic chips have substantially identical structure.
17. The microelectronic assembly as claimed in claim 1 or claim 11, wherein the conductive structure of the substrate includes a plurality of electrically conductive traces extending in a direction substantially parallel to the first surface.
18. The microelectronic assembly as claimed in claim 1 or claim 11, further comprising a heat spreader at least partially overlying a rear surface of at least one of the logic chips.
19. The microelectronic assembly as claimed in claim 18, wherein the heat spreader at least partially overlies the memory chip.
20. The microelectronic assembly as claimed in claim 19, wherein the memory chip has a first width in a horizontal direction perpendicular to the vertical direction and first and second logic chips of the at least two logic chips have a combined second width in the horizontal direction, the first width being less than the second width.
21. The microelectronic assembly as claimed in claim 20, wherein the heat spreader includes a pedestal portion extending beyond a lower surface thereof, the pedestal portion contacting the rear surface of at least one of the first and second logic chips.
22. The microelectronic assembly as claimed in claim 18, wherein the memory chip at least partially overlies an upper surface of the heat spreader.
23. The microelectronic assembly as claimed in claim 22, wherein the conductive structure of the substrate includes a lead extending through an opening in the heat spreader.
24. The microelectronic assembly as claimed in claim 22, further comprising a plurality of heat spreaders including said heat spreader, each of the plurality of heat spreaders at least partially overlying a rear surface of at least one of the logic chips, wherein the conductive structure of the substrate includes a lead extending between edges of two adjacent ones of the plurality of heat spreaders.
25. A system comprising a structure according to claim 1 or claim 11 and one or more other electronic components electrically connected to the structure.
26. A system as claimed in claim 25, further comprising a housing, said structure and said other electronic components being mounted to said housing.