1. A method of making a semiconductor device, comprising:
providing a conductive layer;
forming a plurality of conductive z-interconnect structures including an inner stress-relief core over the conductive layer; and
disposing a semiconductor die between the conductive z-interconnect structures.
2. The method of claim 1, wherein forming the inner stress relief core includes forming a plurality of polymer balls within the conductive z-interconnect structures.
3. The method of claim 2, further including forming the polymer balls in a prolate spheroid shape.
4. The method of claim 1, further including:
depositing an encapsulant around the conductive z-interconnect structures; and
forming a build-up interconnect layer over a surface of the encapsulant and electrically connected to the conductive z-interconnect structures.
5. The method of claim 4, further including forming an integrated passive device in the build-up interconnect layer.
6. The method of claim 5, further including configuring the integrated passive device to operate as a capacitor, resistor or inductor.
7. A method of making a semiconductor device, comprising providing a first conductive z-interconnect structure including an inner stress-relief core and disposing a semiconductor die adjacent to the first conductive z-interconnect structure.
8. The method of claim 7, wherein providing the inner stress-relief core includes forming a polymer ball within the first conductive z-interconnect structure.
9. The method of claim 8, further including forming the polymer ball in a prolate spheroid shape.
10. The method of claim 7, further including forming a second conductive z-interconnect structure including an inner stress-relief core over the semiconductor die.
11. The method of claim 7, further including:
depositing an encapsulant around the first conductive z-interconnect structure; and
forming a build-up interconnect layer over a surface of the encapsulant and electrically connected to the first conductive z-interconnect structure.
12. The method of claim 11, further including forming an integrated passive device in the build-up interconnect layer.
13. The method of claim 12, further including configuring the integrated passive device to operate as a capacitor, resistor or inductor.
14. A semiconductor device, comprising:
a conductive layer;
a plurality of conductive z-interconnect structures including an inner stress-relief core formed over the conductive layer; and
a semiconductor die disposed between the conductive z-interconnect structures.
15. The semiconductor device of claim 14, wherein the inner stress-relief core includes a polymer ball.
16. The semiconductor device of claim 15, wherein the polymer ball includes a prolate spheroid shape.
17. The semiconductor device of claim 14, further including:
an encapsulant deposited around the conductive z-interconnect structures; and
a build-up interconnect layer formed over a surface of the encapsulant and electrically connected to the conductive z-interconnect structures.
18. The semiconductor device of claim 17, further including an integrated passive device formed in the build-up interconnect layer.
19. The semiconductor device of claim 18, wherein the integrated passive device is configured to operate as a capacitor, resistor or inductor.
20. A semiconductor device, comprising a first conductive z-interconnect structure including an inner stress-relief core and a semiconductor die disposed adjacent to the first conductive z-interconnect structure.
21. The semiconductor device of claim 20, wherein the inner stress-relief core includes a polymer ball.
22. The semiconductor device of claim 21, wherein the polymer ball includes a prolate spheroid shape.
23. The semiconductor device of claim 20, further including a second conductive z-interconnect structure including an inner stress-relief core formed over the semiconductor die.
24. The semiconductor device of claim 20, further including:
an encapsulant deposited around the first conductive z-interconnect structure; and
a build-up interconnect layer formed over a surface of the encapsulant and electrically connected to the first conductive z-interconnect structure.
25. The semiconductor device of claim 24, further including an integrated passive device formed in the build-up interconnect layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An adverse condition detection apparatus operable to detect an adverse condition and generate a visual alarm signal to indicate the presence of the adverse condition, the apparatus comprising:
an adverse condition sensor operable to detect the adverse condition and generate a detection signal;
a control unit coupled to the adverse condition sensor for receiving the detection signal, the control unit being operable to control the generation of both the visual alarm signal and an audible alarm signal during the generation of the detection signal;
an audible indicator coupled to the control unit, wherein the control unit activates the audible indicator to generate an audible alarm signal upon detection of the adverse condition; and
a visual indicator coupled to the control unit, the visual indicator being operable to generate the visual alarm signal upon detection of the adverse condition, wherein the visual indicator includes at least two LED’s that each emit light of a different color, the LED’s being selectively operated such that the visual alarm signal visually simulates the type of adverse condition being detected.
2. The apparatus of claim 1 wherein the visual indicator is a color LCD screen.
3. The apparatus of claim 1 wherein each of the LED’s is a multi-color LED.
4. The apparatus of claim 1 wherein only one of the visual indicators is operated at a time by the control unit.
5. The apparatus of claim 4 wherein each of the visual indicators are selectively operated by the control unit for individual activation periods, wherein the visual alarm signal includes a plurality of sequential activation periods during which only one of the visual indicators is operated at a time.
6. The apparatus of claim 1 wherein the visual indicators comprise a yellow LED, an orange LED and a red LED.
7. The apparatus of claim 6 wherein the visual indicators are selectively operated by the control unit in a pattern to visually simulate the appearance of a flame.
8. The apparatus of claim 1 wherein the audible alarm signal includes a plurality of alarm pulses each separated by an off period, wherein the control unit operates the visual indicator only during the off periods of the alarm signal.
9. The apparatus of claim 8 wherein each of the visual indicators is operated by the control unit for an activation period, wherein the activation period is shorter than the off period between the alarm pulses of the alarm signal such that multiple activation periods occur during each off period of the audible alarm signal.
10. The apparatus of claim 1 wherein the control unit includes a stored operational sequence for the activation of the visual indicators, wherein the visual indicators are selectively activated based upon the stored operational sequence.
11. The apparatus of claim 1 wherein the adverse condition detection apparatus includes a housing for enclosing the adverse condition sensor, the control unit and the visual indicators, wherein the visual indicators can be seen from the exterior of the housing.
12. A method of operating an adverse condition detection apparatus to generate a visual alarm signal that visually stimulates the type of adverse condition detected by the apparatus, the method comprising the steps of:
providing an adverse condition sensor operable to generate a detection signal upon sensing the presence of the adverse condition;
receiving the detection signal in a control unit of the apparatus;
providing at least two visual indicators coupled to the control unit, the combination of visual indicators being selectively operable to emit light of at least two different colors;
selectively activating and deactivating the visual indicators in a simulation pattern to create the visual alarm signal, wherein the simulation pattern visually simulates the type of adverse condition being detected.
13. The method of claim 12 wherein the adverse condition sensor is a smoke sensor.
14. The method of claim 13 wherein the visual indicators comprise a red LED, an orange LED, and a yellow LED.
15. The method of claim 12 further comprising the step of storing an operational sequence in the control unit, the operational sequence defining the sequence of operation of the visual indicators by the control unit.
16. The method of claim 15 wherein the control unit activates only one of the visual indicators at a time.
17. The method of claim 16 wherein each of the visual indicators is activated for an activation period, wherein the visual alarm signal includes a plurality of sequential activation periods during which only one of the visual indicators is activated.
18. The method of claim 13 wherein the operational sequence controls the operation of the visual indicators to simulate the appearance of a flame.
19. A method of operating an adverse condition detection apparatus having an adverse condition sensor operable to detect an adverse condition, the method comprising the steps of:
providing a control unit coupled to the sensor to receive a detection signal upon the sensor detecting the adverse condition;
activating an audible indicator to generate an audible alarm signal upon receipt of the detection signal by the control unit; and
selectively activating and deactivating at least two visual indicators in a pattern that visually simulates the type of adverse condition being sensed, wherein the combination of the visual indicators are operable to generate at least two different colors of light.
20. The method of claim 19 further comprising the step of storing an operational sequence in the control unit, the operational sequence defining the sequence of operation of the visual indicators by the control unit.
21. The method of claim 19 wherein each of the visual indicators is operable by the control unit for an activation period, wherein the operational sequence includes a stored sequence of activation periods.
22. The method of claim 20 wherein only one of the visual indicators is operable at a time by the control unit.
23. The method of claim 2 wherein the audible alarm signal includes a series of alarm pulses each separated by an off period, wherein the visual indicators are activated by the control unit only during the off period of the audible alarm signal.