1. A method for manufacturing a metal-ceramic composite structure having a base metal structure or component, which is on at least one side covered and joined with one or more ceramic tiles, said method comprising:
a) manufacturing one or more green bodies with cavities extending from a surface on one side of said green bodies into an interior of said green bodies and sintering said green bodies to receive one or more ceramic tiles with respective cavities;
b) arranging said one or more ceramic tiles in a cast mould, whereby the one or more ceramic tiles are used as a part of the cast mould;
c) pouring liquid metal into said cast mould at a temperature and pressure that said cavities of said one or more ceramic tiles are filled completely or to a great extent in order to fabricate at least one intermediate metal layer to be joined with said base metal structure or component; wherein the at least one intermediate metal layer is created with mechanical interlocks between said one or more ceramic tiles and said at least one intermediate metal layer;
d) after solidification of said poured-in metal, taking the resulting metal-ceramic structure with its mechanical interlocks between said one or more ceramic tiles and said at least one intermediate metal layer, out of said cast mould; and said one or more ceramic tiles with said at least one intermediate metal layer are then joined with said base metal structure or component.
2. The method as claimed in claim 1, wherein the metal used for said base metal structure or component, or said at least one intermediate metal layer, is a Ni-based superalloy.
3. The method as claimed in claim 1, wherein step (b) includes assembly and masking of the one or more ceramic tiles using soluble ceramics.
4. The method as claimed in claim 1, wherein said cavities in said one or more ceramic tiles are arranged in such a way that most of the ceramic at said mechanical interlocks is under compression during later use over the used temperature range.
5. The method as claimed in claim 1, wherein said base metal structure or component is a hot gas path part of a gas turbine.
6. The method according to claim 5, wherein said base metal structure or component is a stator heat shield.
7. The method according to claim 5, wherein said base metal structure or component is a combustor liner.
8. The method according to claim 5, wherein said base metal structure or component is a platform andor airfoil of a blade andor vane.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit device comprising:
core circuitry;
a first set of guard rings having a first dopant type, the first set of guard rings being around a periphery of the core circuitry, the first set of guard rings comprising a first guard ring and a second guard ring; and
a second set of guard rings having a second dopant type, the second dopant type being opposite to the first dopant type, wherein at least one guard ring of the second set of guard rings is around a periphery of at least one guard ring of the first set of guard rings, and the second set of guard rings comprises a third guard ring and a fourth guard ring.
2. The circuit device of claim 1, wherein the third guard ring is between the first guard ring and the second guard ring.
3. The circuit device of claim 1, further comprising fin structures in the first guard ring and the second guard ring.
4. The circuit device of claim 3, wherein adjacent fin structures in the first guard ring are spaced from each other in a first direction by a first distance.
5. The circuit device of claim 4, wherein adjacent fin structures in the first guard ring are spaced from each other in a second direction by a second distance less than the first distance, wherein the second direction is perpendicular to the first direction.
6. The circuit device of claim 4, wherein adjacent fin structures in the first guard ring are in contact with each other in a second direction, wherein the second direction is perpendicular to the first direction.
7. The circuit device of claim 3, wherein adjacent fin structures in the first guard ring are connected to each other by a connection line.
8. The circuit device of claim 7, wherein the connection line is connected to a reference voltage.
9. The circuit device of claim 3, wherein fin structures in the first guard ring are offset with respect to fin structures in the second guard ring.
10. The circuit device of claim 9, wherein a portion of a fin structure in the first guard ring overlaps with a portion of a fin structure in the second guard ring in a direction perpendicular to a spacing between adjacent fin structures in the first guard ring.
11. The circuit device of claim 10, wherein the portion of the fin structure in the first guard ring overlapping with the portion of the fin structure in the second guard ring ranges from 30% to 70%.
12. A guard ring structure comprising:
a first guard ring having a first dopant type;
a second guard ring having the first dopant type, the second guard ring being around the periphery of the first guard ring and contacting the first guard ring;
a third guard ring having a second dopant type, the second dopant type being opposite the first dopant type, wherein the third guard ring is around a periphery of the second guard ring and contacting the second guard ring; and
a fourth guard ring having the second dopant type, the fourth guard ring being around a periphery of the third guard ring and contacting the third guard ring.
13. The guard ring structure of claim 12, further comprising fin structures in the second guard ring and fin structures in the third guard ring.
14. The guard ring structure of claim 13, wherein a first fin structure in the second guard ring is aligned with a first fin structure in the third guard ring in a first direction.
15. The guard ring structure of claim 14, wherein a second fin structure in the second guard ring is offset with respect to a second fin structure in the third guard ring in a second direction, wherein the second direction is perpendicular to the first direction.
16. The guard ring structure of claim 14, wherein adjacent fin structures in the second guard ring are in contact with each other in the first direction.
17. The guard ring structure of claim 13, wherein adjacent fin structures in the second guard ring are spaced from each other in a first direction by a first distance, and adjacent fin structures in the third guard ring are spaced from each other in the first direction by a second distance different from the first distance.
18-20. (canceled)
21. A circuit device comprising:
core circuitry;
a first guard ring around a periphery of the core circuitry, wherein the first guard ring has a first dopant type, and the first guard ring comprises a first plurality of fin structures; and
a second guard ring around the first guard ring, wherein the second guard ring has a second dopant type, the second guard ring comprises a second plurality of fin structures, and each fin structure of the second plurality of fin structures is offset with respect to each fin structure of the first plurality of fin structures.
22. The circuit device of claim 21, wherein a first set of fin structures of the first plurality of fin structures along a first side of the core circuitry are in direct contact with each other, and a second set of fin structures of the first plurality of fin structures along a second side of the core circuitry perpendicular to the first side are spaced from each other.
23. The circuit device of claim 21, further comprising a third guard ring around the second guard ring, wherein the third guard ring has the first dopant type, and the third guard ring comprises a third plurality of fin structures.