1. An axial fan assembly comprising:
a motor including an output shaft rotatable about a central axis;
a shroud coupled to the motor, the shroud including a substantially annular outlet bell centered on the central axis;
an axial fan including
a hub coupled to the output shaft for rotation about the central axis;
a plurality of blades extending radially outwardly from the hub and arranged about the central axis;
a substantially circular band coupled to the tips of the blades; and
a plurality of leakage stators positioned radially outwardly from the band and adjacent the outlet bell, the leakage stators arranged about the central axis;
wherein the outlet bell includes a radially-innermost surface, a radially-outermost surface, and an end surface adjacent the radially-innermost surface, wherein the leakage stators are positioned between the radially-innermost surface and the radially-outermost surface, wherein the band includes an axially-extending, radially-innermost surface, an axially-extending, radially-outermost surface, and an end surface adjacent the axially-extending, radially-innermost surface and the axially-extending, radially-outermost surface, wherein the respective end surfaces of the band and the outlet bell are spaced by an axial gap, and wherein a ratio of the axial gap to a maximum blade diameter is about 0 to about 0.01, wherein the axially-extending, radially-outermost surface of the band is spaced radially inwardly of the radially-innermost surface of the outlet bell by a radial gap, and wherein a ratio of the radial gap to the maximum blade diameter is about 0.01 to about 0.02.
2. The axial fan assembly of claim 1, wherein the hub includes a radially-outermost surface defining a hub radius (Rhub), wherein the axially-extending, radially-innermost surface of the band defines a band radius (Rband), wherein the radially-outermost surface of the outlet bell defines an outlet radius (Rout), wherein the outlet bell is axially spaced from a downstream blockage by a length dimension (L), wherein a blockage factor is defined by the formula:
BlockageFactor
=
R
band
2
–
R
hub
2
2
\xd7
L
\xd7
R
out
wherein the ratio of the axial gap to the maximum blade diameter is about 0 to about 0.01, and the ratio of the radial gap to the maximum blade diameter is about 0.01 to about 0.02 when the blockage factor is greater than or equal to about 0.83.
3. The axial fan assembly of claim 1, wherein each of the blades includes
a root;
a tip;
a leading edge between the root and the tip; and
a trailing edge between the root and the tip;
wherein each of the blades defines a blade radius between the blade tips and the central axis, and wherein each of the blades defines a decreasing skew angle within the outer 20% of the blade radius.
4. The axial fan assembly of claim 3, wherein the skew angle of the blades continuously decreases over the outer 20% of the blade radius.
5. The axial fan assembly of claim 1, wherein each of the blades includes
a root;
a tip;
a leading edge between the root and the tip; and
a trailing edge between the root and the tip;
wherein each of the blades defines a blade radius between the blade tips and the central axis, wherein a ratio of blade pitch to average blade pitch increases from a lowest value to a highest value within the outer 20% of the blade radius, and wherein the highest value is about 30% to about 75% greater than the lowest value.
6. The axial fan assembly of claim 5, wherein the ratio of blade pitch to average blade pitch increases from a lowest value to a highest value within the outer 10% of the blade radius, and wherein the highest value within the outer 10% of the blade radius is about 20% to about 60% greater than the lowest value within the outer 10% of the blade radius.
7. The axial fan assembly of claim 1, wherein each of the blades includes
a root;
a tip;
a leading edge between the root and the tip; and
a trailing edge between the root and the tip;
wherein each of the blades defines a blade radius between the blade tips and the central axis, and wherein each of the blades defines an increasing rake within the outer 20% of the blade radius.
8. The axial fan assembly of claim 7, wherein the rake increases continuously over the outer 20% of the blade radius.
9. The axial fan assembly of claim 7, wherein a ratio of rake to maximum blade diameter comprises a non-dimensional blade rake, wherein a rate of change of the non-dimensional blade rake with respect to a non-dimensional radius over the outer 20% of the blade radius is about 0.08 to about 0.18.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor package comprising:
a circuit board having an opening and at which a wire pattern is formed;
a metal structure including an upper metal member formed to cover a portion of the circuit board, sidewall metal members extending from the upper metal member and insertable through the opening of the circuit board, and a lower metal member extending from the sidewall metal members and locatable relative to the opening; and
a semiconductor chip electrically connectable to the wire pattern and attachable to the lower metal member.
2. The semiconductor package as set forth in claim 1, wherein the circuit board comprises organic material.
3. The semiconductor package as set forth in claim 1, further comprising at least one of conductive pins, solder balls or lands electrically connected to the wire pattern of the circuit board.
4. The semiconductor package as set forth in claim 1, further comprising a hermetic sealing member to fill a space formed by the semiconductor chip, the sidewall metal members and the lower metal member of the metal structure,
wherein the semiconductor chip has a plurality of mirrors in its surface.
5. The semiconductor package as set forth in claim 1, wherein the upper metal member has a rectangular frame shape having an opening to expose the opening of the circuit board;
the lower metal member has a rectangular shape; and
the sidewall metal members are comprised of two sidewall metal members spaced apart from each other and extending from an inner wall of the opening of the upper metal member to connect to opposite two sides of the rectangular shaped lower metal member.
6. The semiconductor package as set forth in claim 1, wherein the upper metal member has a rectangular frame shape having an opening to expose the opening of the circuit board;
the lower metal member has a rectangular shape; and
the sidewall metal members are comprised of at least two sidewall metal members spaced apart from each and other extending from an inner wall of the opening of the upper metal member to connect to opposite at least two corners of the rectangular shaped lower metal member.
7. The semiconductor package as set forth in claim 1, wherein the upper metal member comprises four metal members spaced apart from one another;
the lower metal member has a rectangular shape; and
the sidewall metal members are comprised of four spaced sidewall metal members each extending from a corresponding one of the four upper metal members to connect to corresponding four corners of the rectangular shaped lower metal member.
8. The semiconductor package as set forth in claim 1, wherein the upper metal member comprises two metal members spaced apart from one another;
the lower metal member has a rectangular shape; and
the sidewall metal members are comprised of two spaced sidewall metal members each extending from respective ones of the two metal members of the upper metal member to connect to respective ones of opposite two sides of the rectangular shaped lower metal member.
9. A semiconductor package comprising:
a circuit board having a first opening and at which a wire pattern is formed;
a metal structure having an upper metal member attached to a first portion of the circuit board to expose a second portion of the circuit board, and having a projection insertable into the first opening of the circuit board; and
a semiconductor chip attached to the projection and electrically connectable to the second portion of the circuit board.
10. The semiconductor package as set forth in claim 9, wherein the metal structure comprises an upper metal member attachable on the circuit board to expose a portion of the circuit board adjacent to the first opening, a lower metal member seated relative to the first opening, and sidewall metal members extending from the upper metal member into the first opening and connect to the lower metal member; the sidewall metal members and the lower metal member comprise the projection; and the semiconductor chip is attached to the lower metal member.
11. The semiconductor package as set forth in claim 10, wherein the circuit board is made of organic material.
12. The semiconductor package as set forth in claim 10, further comprising at least one of conductive pins, solder balls, or lands electrically connected to the wire pattern of the circuit board.
13. The semiconductor package as set forth in claim 10, further comprising a hermetic sealing member to fill a space formed by the semiconductor chip, the sidewall metal members and the lower metal member of the metal structure, and
wherein the semiconductor chip has a plurality of mirrors on its surface.
14. The semiconductor package as set forth in claim 10, wherein the first opening of the circuit board and the lower metal member of the metal structure have a rectangular shape;
the upper metal member of the metal structure has a rectangular frame shape for defining a rectangular shaped second opening and is located on the circuit board to expose a portion of the circuit board adjacent to opposite two sides of the first opening; and
the sidewall metal members of the metal structure extend from two opposite sides of the second opening to connect to corresponding opposite two sides of the rectangular shaped lower metal member.
15. The semiconductor package as set forth in claim 10, wherein the first opening of the circuit board and the lower metal member of the metal structure have a rectangular shape;
the upper metal member of the metal structure has a rectangular frame shape defining a rectangular shaped second opening locatable on the circuit board to expose a portion of the circuit board adjacent to four sides of the first opening; and
the sidewall metal members of the metal structure extend from four corners of the second opening to be connected to corresponding four corners of the rectangular shaped lower metal member.
16. The semiconductor package as set forth in claim 10, wherein the first opening of the circuit board and the lower metal member of the metal structure have a rectangular shape;
the upper metal member of the metal structure has a rectangular frame shape for defining a rectangular shaped second opening locatable on the circuit board to expose a portion of the circuit board adjacent to four sides of the first opening; and
the sidewall metal members of the metal structure extend from two corners of the second opening to connect to corresponding two corners of the rectangular shaped lower metal member.
17. The semiconductor package as set forth in claim 10, wherein the first opening of the circuit board and the lower metal member of the metal structure have a rectangular shape;
the upper metal member of the metal structure comprises spaced four upper metal members to cover the circuit board adjacent to four corners of the first opening; and
the sidewall metal member comprises four sidewall metal members extending from the spaced four upper metal members to connect to corresponding four corners of the lower metal member.
18. The semiconductor package as set forth in claim 10, wherein the first opening of the circuit board and the lower metal member of the metal structure have a rectangular shape;
the upper metal member of the metal structure comprises spaced two upper metal members to cover the circuit board adjacent to corresponding opposite two sides of the first opening of the circuit board; and
the sidewall metal members extend from the two upper metal members to connect to corresponding opposite two sides of the rectangular shaped lower metal member.
19. A semiconductor package comprising:
a rectangular frame shaped circuit board having a rectangular shaped opening and at which a wire pattern is formed;
a metal structure comprising a frame shaped upper metal member attachable to the circuit board to expose a portion of the circuit board adjacent to the opening, a rectangular shaped lower metal member locatable relative to the opening of the circuit board, and sidewall connecting members to connect an inner side of the frame shaped upper metal member to a periphery of the lower metal member; and
a semiconductor chip attachable to the lower metal member and electrically connectable to the portion of the circuit board exposed by the upper metal member.
20. The semiconductor package as set forth in claim 19, wherein the upper metal member has a rectangular frame shape; and
the sidewall connecting members comprise spaced two sidewall metal members to connect corresponding opposite two inner sides of the rectangular frame shaped upper metal member with corresponding opposite two sides of the lower metal member.
21. The semiconductor package as set forth in claim 19, wherein the upper metal member has a rectangular frame shape; and
the sidewall connecting members comprise spaced at least two sidewall metal members to connect corresponding at least two corners of the rectangular frame shaped upper metal member with corresponding at least two corners of the lower metal member.
22. A semiconductor package comprising:
a generally planar circuit board having a first side facing a first direction and a second side facing a second direction opposite the first direction;
a metal structure having a first generally planar surface area facing the first direction and having a second generally planar surface area facing the second direction, the second generally planar surface area coupled face-to-face with a first portion of the first side of the circuit board while leaving exposed a second portion of the first side of the circuit board; and
a semiconductor chip attached to the first generally planar surface of the metal structure and in relation to the second portion of the first side of the circuit board for electrical connection thereto.
23. A semiconductor package as set forth in claim 22, wherein the circuit board includes an opening and the metal structure includes a projection insertable into the opening, the projection comprising the first generally planar surface area.
24. A semiconductor package as set forth in claim 22, wherein the first generally planar surface area is a rectangular area.
25. A semiconductor package as set forth in claim 22, wherein the second generally planar surface area comprises at least two spaced areas.
26. A semiconductor package as set forth in claim 22, wherein the second generally planar surface area comprises a continuous frame shaped area.
27. The semiconductor package as set forth in claim 22, further comprising at least one of conductive pins, solder balls, and lands electrically connected to the circuit board and conductively accessible at the second side of the circuit board.
28. The semiconductor package as set forth in claim 22, wherein the circuit board comprises a bonding region at the second portion of the first side of the circuit board and the semiconductor is electrically connectable to the wiring pattern.