1. An electronic device, comprising:
an element formed in a wafer;
a frame member, composed of a first resin and installed over said wafer to surround a functional unit of said element; and
a resin layer, composed of a second resin, and provided around a perimeter of said frame member so that a gap is present between said frame member and said resin layer,
wherein the frame member does not overlap with the resin layer when viewed from a direction normal to a topmost surface of the wafer,
wherein the gap is a void space having no material therein, and
wherein said functional unit of said element is exposed in a space surrounded by said frame member, said space extending to at least an upper surface of said frame member.
2. The electronic device as set forth in claim 1, further comprising a low adhesion layer disposed in at least side surface of said frame member, said low adhesion layer having higher adhesion for said second resin than said first resin.
3. The electronic device as set forth in claim 1, wherein said low adhesion layer is an oxide film created by oxidizing a surface layer of said frame member.
4. The electronic device as set forth in claim 1, wherein
a dimensional area of an upper surface of said frame member is larger than a dimensional area of a lower surface of said frame member.
5. The electronic device as set forth in claim 4, wherein a width in a cross-sectional geometry of said frame member is decreased toward the lower section.
6. The electronic device as set forth in claim 1, wherein all portions of the resin layer are disposed outside the perimeter of said frame member.
7. The electronic device as set forth in claim 1, wherein the resin layer does not overlap with the functional unit when viewed from a direction normal to the topmost surface of the wafer.
8. The electronic device as set forth in claim 1, wherein the frame member does not overlap with the functional unit when viewed from a direction normal to the topmost surface of the wafer.
9. The electronic device as set forth in claim 1, wherein a linear expansion coefficient of the frame member is different from a linear expansion coefficient of the resin layer.
10. The electronic device as set forth in claim 1, wherein the gap is configured to allow thermal expansion and thermal shrinkage of the frame member and the resin layer.
11. The electronic device as set forth in claim 1, wherein the gap is configured to substantially eliminate stress exerted by the resin layer to the frame member due to thermal expansion and thermal shrinkage of the frame member and the resin layer.
12. The electronic device as set forth in claim 1, wherein an topmost surface of the frame member is not more than 0.05 mm higher than an topmost surface of the resin layer in a direction normal to the topmost surface of the wafer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for visualizing shear wave propagation in a medium, the method comprising:
(a) introducing a shear wave from a shear wave source into the medium, the shear wave having a shear wave frequency and a shear wave phase velocity;
(b) detecting a propagation of the shear wave through the medium by using an ultrasound probe to produce an ultrasound signal;
(c) introducing a vibration into the ultrasound signal at a second frequency;
(d) from the ultrasound signal having the vibration, deriving a modulation wave which represents a propagation of the shear wave relative to the ultrasound probe, the modulation wave having a modulation wave phase velocity which varies as a difference between the shear wave frequency and the second frequency; and
(e) producing an image representing the shear wave propagation from the modulation wave derived in step (d).
2. The method of claim 1, wherein step (e) comprises producing an image in real time of the modulation wave.
3. The method of claim 2, wherein step (e) further comprises estimating, from the image of the modulation wave, a local vibration phase at each pixel of the image of the modulation wave.
4. The method of claim 3, wherein a plurality of said images in real time of the modulation wave are produced, and wherein the local vibration phase is estimated from a Fourier transform carried out at a time trace of each pixel from the plurality of images of the modulation wave.
5. The method of claim 3, wherein step (e) further comprises performing a phase unwrapping on the local vibration phase to produce a smooth phase surface.
6. The method of claim 5, wherein step (e) further comprises performing a noise reduction on the smooth phase surface.
7. The method of claim 5, wherein step (e) further comprises converting the smooth phase surface to a wave pattern with an artificially increased spatial density.
8. The method of claim 1, wherein step (c) comprises physically vibrating the ultrasound probe at the second frequency.
9. The method of claim 8, wherein step (b) comprises applying a layer of ultrasound gel between the medium and the ultrasound probe such that the ultrasound probe is acoustically coupled to the medium through the ultrasound gel as the ultrasound probe vibrates.
10. The method of claim 1, wherein step (c) comprises electronically producing an equivalent virtual vibration in the ultrasound signal.
11. The method of claim 1, wherein step (a) comprises introducing multiple shear waves into the medium.
12. A system for visualizing shear wave propagation in a medium, the system comprising:
a shear wave source for introducing a shear wave into the medium, the shear wave having a shear wave frequency and a shear wave phase velocity;
an ultrasound probe for detecting a propagation of the shear wave through the medium to produce an ultrasound signal, a vibration at a second frequency being introduced into the ultrasound signal;
an image processing device, in communication with the ultrasound probe, for deriving, from the ultrasound signal having the vibration, a modulation wave which represents a propagation of the shear wave relative to the ultrasound probe, the modulation wave having a modulation wave phase velocity which varies as a difference between the shear wave frequency and the second frequency, and producing an image representing the shear wave propagation from the modulation wave; and
an image output device for outputting the image.
13. The system of claim 12, wherein the image output device comprises a display.
14. The system of claim 12, wherein the image processing device produces an image in real time of the modulation wave.
15. The system of claim 14, wherein the image processing device estimates, from the image of the modulation wave, a local vibration phase at each pixel of the image of the modulation wave.
16. The system of claim 15, wherein a plurality of said images in real time of the modulation wave are produced, and wherein the local vibration phase is estimated from a Fourier transform carried out at a time trace of each pixel from the plurality of images of the modulation wave.
17. The system of claim 15, wherein the image processing device estimates the local vibration phase by performing a phase unwrapping on the local vibration phase to produce a smooth phase surface.
18. The system of claim 16, wherein the image processing device performs a noise reduction on the smooth phase surface.
19. The system of claim 17, wherein the image processing device converts the smooth phase surface to a wave pattern with an artificially increased spatial density.
20. The system of claim 12, wherein the ultrasound probe is physically vibrated at the second frequency.
21. The system of claim 12, wherein an equivalent virtual vibration is electronically produced in the ultrasound signal.
22. The system of claim 12, wherein the shear wave source introduces multiple shear waves into the medium.
23. A method for visualizing shear wave propagation in a medium, the method comprising:
(a) introducing a shear wave from a shear wave source into the medium, the shear wave having a shear wave frequency and a shear wave phase velocity;
(b) detecting a propagation of the shear wave through the medium by using an ultrasound probe to produce an ultrasound signal;
(c) introducing, at a second frequency, at least one of (i) a vibration into the ultrasound signal and (ii) a second shear wave into the medium;
(d) from the ultrasound signal, deriving a modulation wave which represents a propagation of the shear wave relative to the ultrasound probe, the modulation wave having a modulation wave phase velocity which varies as a difference between the shear wave frequency and the second frequency; and
(e) producing an image representing the shear wave propagation from the modulation wave derived in step (d), wherein step (e) comprises:
(i) producing an image in real time of the modulation wave; and
(ii) estimating, from the image of the modulation wave, a local vibration phase at each pixel of the image of the modulation wave.
24. The method of claim 23, wherein the local vibration phase is estimated from a Fourier transform carried out at each pixel of the image of the modulation wave.
25. The method of claim 23, wherein step (e) further comprises performing a phase unwrapping on the local vibration phase to produce a smooth phase surface.
26. The method of claim 25, wherein step (e) further comprises performing a noise reduction on the smooth phase surface.
27. The method of claim 25, wherein step (e) further comprises converting the smooth phase surface to a wave pattern with an artificially increased spatial density.
28. A system for visualizing shear wave propagation in a medium, the system comprising:
a shear wave source for introducing a shear wave into the medium, the shear wave having a shear wave frequency and a shear wave phase velocity;
an ultrasound probe for detecting a propagation of the shear wave through the medium to produce an ultrasound signal;
means for introducing, at a second frequency, at least one of (i) a vibration into the ultrasound signal and (ii) a second shear wave into the medium;
an image processing device, in communication with the ultrasound probe, for deriving, from the ultrasound signal having the vibration, a modulation wave which represents a propagation of the shear wave relative to the ultrasound probe, the modulation wave having a modulation wave phase velocity which varies as a difference between the shear wave frequency and the second frequency, and producing an image representing the shear wave propagation from the modulation wave; and
an image output device for outputting the image, wherein the image processing device produces an image in real time of the modulation wave and estimates, from the image of the modulation wave, a local vibration phase at each pixel of the image of the modulation wave.
29. The system of claim 28, wherein the local vibration phase is estimated from a Fourier transform carried out at each pixel of the image of the modulation wave.
30. The system of claim 28, wherein the image processing device estimates the local vibration phase by performing a phase unwrapping on the local vibration phase to produce a smooth phase surface.
31. The system of claim 30, wherein the image processing device performs a noise reduction on the smooth phase surface.
32. The system of claim 31, wherein the image processing device converts the smooth phase surface to a wave pattern with an artificially increased spatial density.