1-20. (canceled)
21. A device for use with a probe sensor assembly in a system for sensing a physiological parameter of a patient, the device comprising an adhesive layer and first and second windows, the adhesive layer having adhesive on at least a portion thereof, the first and second windows being formed in the adhesive layer and configured to be matingly engageable with apertures of the probe sensor assembly, wherein the first and second windows comprise respective first and second surfaces that engage and disengage the apertures of the probe sensor assembly.
22. The device of claim 21, wherein at least one of the first and second windows is formed as a ring.
23. A system for sensing a physiological parameter of a patient comprising:
a probe assembly having a light emitter, a light detector, and first and second apertures for the light emitter and light detector, respectively; and
an adhesive layer having first and second windows operably attached thereto, the adhesive layer having adhesive on at least a portion thereof, and said windows having surfaces to engage and disengage with said apertures of said probe assembly.
24. The system of claim 23, wherein at least one of said windows is formed as a ring.
25. A method of providing a system for sensing a physiological parameter of a patient, comprising:
providing at least one probe assembly having a light emitter, a light detector, and first and second apertures for the light emitter and the light detector; and
providing a plurality of adhesive layers, each adhesive layer having first and second windows respectively, each adhesive layer having adhesive on at least a portion thereof, the respective first and second windows being operably attached to each respective adhesive layer and configured to be matingly engageable with the first and second apertures of the at least one probe assembly, wherein the respective first and second windows comprise respective first and second surfaces to engage and disengage the first and second apertures of the at least one probe assembly.
26. The method of claim 25, further comprising positioning at least one of the plurality of adhesive layers on an appendage of a patient.
27. The method of claim 25, further comprising attaching the respective first and second windows of the least one of the plurality of adhesive layers to the respective first and second apertures of the at least one probe assembly.
28. The method of claim 25, further comprising sensing at least one signal transmitted through an appendage of a patient.
29. The method of claim 25, further comprising disengaging the respective first and second windows of at least one of the plurality of adhesive layers from the respective first and second apertures of the at least one probe assembly.
30. A device for use with a probe sensor assembly in a system for sensing a physiological parameter of a patient, the device comprising an adhesive member and first and second coupling members, the adhesive member having adhesive on at least a portion thereof, the first and second coupling members operably attached to the adhesive member and configured to be matingly engageable with housings of a probe sensor assembly, wherein the first and second coupling members comprise respective first and second engagement features that engage and disengage the housings of the probe sensor assembly.
31. The device of claim 30, wherein at least one of the first and second engagement features is formed as a ring.
32. A system for sensing a physiological parameter of a patient comprising:
a probe assembly having a light emitter, a light detector, and first and second housings for the light emitter and light detector, respectively; and
an adhesive member having first and second coupling members operably attached thereto, the adhesive member having adhesive on at least a portion thereof, and said coupling members having engagement features to engage and disengage with said housings of said probe assembly.
33. The system of claim 32, wherein at least one of said coupling members is formed as a ring.
34. A method of providing a system for sensing a physiological parameter of a patient, comprising:
providing at least one probe assembly having a light emitter, a light detector, and first and second housings for the light emitter and the light detector; and
providing a plurality of adhesive members, each adhesive member having first and second coupling members respectively, each adhesive member having adhesive on at least a portion thereof, the respective first and second coupling members being operably attached to each respective adhesive member and configured to be matingly engageable with the first and second housings of the at least one probe assembly, wherein the respective first and second coupling members comprise respective first and second engagement features to engage and disengage the first and second housings of the at least one probe assembly.
35. The method of claim 34, further comprising positioning at least one of the plurality of adhesive members on an appendage of a patient.
36. The method of claim 34, further comprising attaching the respective first and second coupling members of the least one of the plurality of adhesive members to the respective first and second housings of the at least one probe assembly.
37. The method of claim 34, further comprising sensing at least one signal transmitted through an appendage of a patient.
38. The method of claim 34, further comprising disengaging the respective first and second coupling members of at least one of the plurality of adhesive members from the respective first and second housings of the at least one probe assembly.
39. A device for use with a reusable probe sensor assembly in a system for sensing a physiological parameter of a patient, the device comprising a disposable bandage apparatus and first and second probe couplers, the bandage apparatus having adhesive on at least a portion thereof, the first and second probe couplers being operably attached to the bandage apparatus and configured to be matingly engageable with probe housings of the reusable probe sensor assembly, wherein the first and second probe couplers comprise respective first and second locking features that engage and disengage the probe housings of the reusable probe sensor assembly.
40. The device of claim 39, wherein at least one of the first and second locking features comprises at least one component comprising one or more of a ring, a groove, a notch, or a contoured portion of a receptacle.
41. A system for sensing a physiological parameter of a patient comprising:
a probe assembly having a light emitter, a light detector, and first and second modular housings for the light emitter and light detector, respectively; and
a disposable bandage apparatus having first and second modular receptacles operably attached thereto, the bandage apparatus having adhesive on at least a portion thereof, and said modular receptacles having locking features to engage and disengage with said modular housings of said probe assembly.
42. The system of claim 41, wherein at least one of said locking features comprises at least one component comprising one or more of a ring, a groove, a notch, or a contoured portion of a receptacle.
43. A method of providing a system for sensing a physiological parameter of a patient having reusable and disposable components, comprising:
providing at least one reusable probe assembly having a light emitter, a light detector, and first and second modular probe housings for the light emitter and the light detector; and
providing a plurality of disposable bandages, each disposable bandage having first and second probe couplers respectively, each disposable bandage having adhesive on at least a portion thereof, the respective first and second probe couplers being operably attached to each respective disposable bandage and configured to be matingly engageable with the first and second modular probe housings of the at least one reusable probe assembly, wherein the respective first and second probe couplers comprise respective first and second locking features to engage and disengage the first and second modular probe housings of the at least one reusable probe assembly.
44. The method of claim 43, further comprising positioning at least one of the plurality of disposable bandages on an appendage of a patient.
45. The method of claim 43, further comprising engaging the respective first and second probe couplers of the least one of the plurality of disposable bandages with the respective first and second modular probe housings of the at least one reusable probe assembly.
46. The method of claim 43, further comprising sensing at least one signal transmitted through an appendage of a patient.
47. The method of claim 43, further comprising disengaging the respective first and second probe couplers of at least one of the plurality of disposable bandages from the respective first and second modular probe housings of the at least one reusable probe assembly.
48. The method of claim 43, further comprising disposing of at least one of the plurality of disposable bandages.
49. The method of claim 43, further comprising reusing the at least one reusable probe assembly.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1.-16. (canceled)
17. An optoelectronic semiconductor chip comprising:
a multiplicity of active regions arranged at a distance from one another, and
a reflective layer arranged at an underside of the multiplicity of active regions, wherein
at least one of the active regions has a main extension direction,
one of the active regions has a core region formed with a first semiconductor material,
the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region,
the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region, and
the reflective layer reflects electromagnetic radiation generated during operation in the active layer.
18. The optoelectronic semiconductor chip according to claim 17, wherein
the active regions are based on a nitride compound semiconductor material,
the first semiconductor material is deposited epitaxially onto a growth substrate, and the optoelectronic semiconductor chip is free of the growth substrate,
a growth direction of the first semiconductor material is substantially parallel to the main extension direction,
at least a large portion of the active regions have a length determined in the main extension direction and have a diameter determined in a plane perpendicular to the main extension direction, and the ratio of length to diameter is at least three,
at least a large portion of the active regions have a current spreading layer covering the cover layer at least in directions transversely with respect to the main extension direction, and the current spreading layer is transmissive to electromagnetic radiation generated during operation in the active layer,
the current spreading layer is formed with a transparent conductive oxide,
the current spreading layer extends over at least a large portion of the length of the active region,
an insulation material is arranged between the multiplicity of active regions, and the insulation material is transmissive to electromagnetic radiation generated during operation in the active layer and the insulation material surrounds the active regions at least in directions transversely with respect to the main extension direction,
the insulation material directly adjoins the current spreading layer at least in places,
the reflective layer directly adjoins the insulation material in places, and
at least a large portion of the active regions have a passivation layer at their underside facing the reflective layer, said passivation layer directly adjoining the reflective layer and the core region of the active region.
19. The optoelectronic semiconductor chip according to claim 17, wherein the first semiconductor material is epitaxially deposited onto a growth substrate, and the optoelectronic semiconductor chip is free of the growth substrate.
20. The optoelectronic semiconductor chip according to claim 17, wherein a growth direction of the first semiconductor material is substantially parallel to the main extension direction.
21. The optoelectronic semiconductor chip according to claim 17, wherein the active region has a length determined in the main extension direction, the active region has a diameter determined in a plane being perpendicular to the main extension direction, and the ratio of length to diameter is at least three.
22. The optoelectronic semiconductor chip according to claim 17, wherein the active region has a current spreading layer covering the cover layer at least in directions transversely with respect to the main extension direction, wherein the current spreading layer is transmissive to electromagnetic radiation generated during operation in the active layer.
23. The optoelectronic semiconductor chip according to claim 22, wherein the current spreading layer is formed with a transparent conductive oxide.
24. The optoelectronic semiconductor chip according to claim 22, wherein the active region has a length determined in the main extension direction and the current spreading layer extends over at least a large portion of the length of the active region.
25. The optoelectronic semiconductor chip according to claim 17, wherein an insulation material is arranged between the multiplicity of active regions, and the insulation material is transmissive to electromagnetic radiation generated during operation in the active layer and the insulation material surrounds the active regions at least in directions transversely with respect to the main extension direction.
26. The optoelectronic semiconductor chip according to claim 25, wherein the insulation material directly adjoins an outer surface of the active region at least in places.
27. The optoelectronic semiconductor chip according to claim 25, wherein the active region has a current spreading layer covering the cover layer at least in directions transversely with respect to the main extension direction and the insulation material directly adjoins the current spreading layer at least in places.
28. The optoelectronic semiconductor chip according to claim 25, wherein the reflective layer directly adjoins the insulation material in places.
29. The optoelectronic semiconductor chip according to claim 17, wherein a mask layer is arranged at that side of the multiplicity of active regions facing away from the reflective layer, and the mask layer has, for each of the active regions, an opening through which the first semiconductor material penetrates.
30. The optoelectronic semiconductor chip according to claim 29, wherein the mask layer is transmissive to electromagnetic radiation generated during operation in the active layer.
31. The optoelectronic semiconductor chip according to claim 17, wherein a coupling-out layer is arranged at a side of the multiplicity of active regions facing away from the reflective layer, said coupling-out layer being formed with the first semiconductor material.
32. The optoelectronic semiconductor chip according to claim 29, wherein
a coupling-out layer is arranged at a side of the multiplicity of active regions facing away from the reflective layer, said coupling-out layer being formed with the first semiconductor material, and
the first semiconductor material of the coupling-out layer connects to the first semiconductor material in the core regions of the active regions through the openings in the mask layer.
33. The optoelectronic semiconductor chip according to claim 17, wherein the active region has a passivation layer at its underside facing the reflective layer, said passivation layer directly adjoining the reflective layer and the core region of the active region.
34. An optoelectronic semiconductor chip comprising:
a multiplicity of active regions arranged at a distance from one another, and
a reflective layer arranged at an underside of the multiplicity of active regions, wherein
at least one of the active regions has a main extension direction,
one of the active regions has a core region formed with a first semiconductor material,
the active region has an active layer covering the core region at least in directions transversely with respect to the main extension direction of the active region,
the active region has a cover layer formed with a second semiconductor material and covers the active layer at least in directions transversely with respect to the main extension direction of the active region,
the reflective layer reflects electromagnetic radiation generated during operation in the active layer,
at least a large portion of the active regions have a current spreading layer covering the cover layer at least in directions transversely with respect to the main extension direction, and the current spreading layer is transmissive to electromagnetic radiation generated during operation in the active layer, and
an insulation material is arranged between the multiplicity of active regions, and the insulation material is transmissive to electromagnetic radiation generated during operation in the active layer and the insulation material surrounds the active regions at least in directions transversely with respect to the main extension direction.