1. A semiconductor device comprising:
a package substrate having electrode pads formed on a first surface thereof for being respectively electrically connected to electrodes of a semiconductor chip, and having external connecting pads formed on a second surface thereof and being electrically connected to the electrode pads;
said semiconductor chip placed on the first surface of the package substrate and having the electrodes thereof respectively electrically connected to the electrode pads of the package substrate;
post-like surface side terminals each having a plurality of protrusions formed around a side face thereof, each end portion of each said post-like surface side terminal being of a diameter that gradually increases towards an end of the terminal corresponding to the end portion, one end of each said surface side terminal being electrically connected to the electrode pads of the package substrate, each said post-like surface side terminal being of a height that is between twice and three times of a thickness of said semiconductor chip; and
a sealing resin layer sealing the semiconductor chip and surrounding the surface side terminals from the side faces thereof, such that the other end of each surface side terminal is exposed from a surface of the sealing resin layer.
2. The semiconductor device according to claim 1, wherein the surface side terminals are vertical to the first surface of the package substrate.
3. The semiconductor device according to claim 1, wherein the surface side terminals are cylindrical or conical.
4. The semiconductor device according to claim 1, wherein the surface side terminals are formed by etching a metal film laminated over the package substrate plural times each time removing a portion of the metal film from a top thereof.
5. The semiconductor device according to claim 1, wherein the protrusions of the surface side terminals are formed by side etching the metal film during the etching of the metal film.
6. The semiconductor device according to claim 1, further including:
redistribution wiring pads formed on the surface of the sealing resin layer, and
connecting wirings formed on the surface of the sealing resin layer and electrically connecting the other ends of the surface side terminals and the redistribution wiring pads.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-7. (canceled)
8. A system for determining a policy change for an outcome related to an opportunity, the system comprising:
a monitoring engine to monitor factors and outcomes associated with opportunities stored in a customer relationship management (CRM) system;
an extracting engine to extract the factors and the outcomes associated with the opportunities stored in the CRM system into a queryable database;
an applying engine to apply a weight to the factors and the outcomes;
an analyzing engine to analyze, via the queryable database, the factors and the outcomes associated with the opportunities to identify patterns related to the outcomes of the opportunities; and
a determining engine to determine, based on the patterns related to the outcomes of the opportunities, a policy change to improve the outcomes related to the opportunities.
9. The system of claim 8, in which the analyzing engine analyzes, via the queryable database, the factors and the outcomes associated with the opportunities to identify the patterns related to the outcomes of the opportunities by identifying the factors that are winning factors related to a profit gain.
10. The system of claim 9, in which the analyzing engine analyzes, via the queryable database, the factors and the outcomes associated with the opportunities to identify the patterns related to the outcomes of the opportunities further by identifying the factors that are losing factors related to a profit loss.
11. The system of claim 10, in which the analyzing engine analyzes, via the queryable database, the factors and the outcomes associated with the opportunities to identify the patterns related to the outcomes of the opportunities further by identifying the factors that are expenditures without improved sales.
12. The system of claim 8, in which the factors associated with the opportunities comprise products sold, sellers, customers, opportunity management, locations, currency, technology, timing, effort spent, costs, return on investment (ROI), or combinations thereof.
13. The system of claim 8, in which the outcomes associated with the opportunities comprise success based on obtained sales, failure based on missed sales, futile sales, or combinations thereof.
14. A computer program product for determining a policy change for an outcome related to an opportunity, comprising:
a tangible computer readable storage medium, said tangible computer readable storage medium comprising computer readable program code embodied therewith, said computer readable program code comprising program instructions that, when executed, causes a processor to:
extract factors and outcomes associated with opportunities stored in a customer relationship management (CRM) system into a queryable database;
apply a weight to the factors and the outcomes;
analyze, via the queryable database, the factors and the outcomes associated with the opportunities to identify patterns related to the outcomes of the opportunities; and
determine, based on the patterns related to the outcomes of the opportunities, a policy change to improve the outcomes related to the opportunities.
15. The product of claim 14, further comprising computer readable program code comprising program instructions that, when executed, cause said processor to monitor the factors and the outcomes associated with the opportunities stored in the CRM system.
16. The product of claim 14, further comprising computer readable program code comprising program instructions that, when executed, cause said processor to identify the factors that are winning factors related to a profit gain.
17. The product of claim 14, further comprising computer readable program code comprising program instructions that, when executed, cause said processor to identify the factors that are losing factors related to a profit loss.
18. The product of claim 14, further comprising computer readable program code comprising program instructions that, when executed, cause said processor to identify the factors that are expenditures without improved sales.
19. The product of claim 14, in which the factors associated with the opportunities comprise products sold, sellers, customers, opportunity management, locations, currency, technology, timing, effort spent, costs, return on investment (ROI), and combinations thereof.
20. The product of claim 14, in which the outcomes associated with the opportunities comprise success based on obtained sales, failure based on missed sales, futile sales, or combinations thereof.