1. A multi-chip module, comprising:
a housing having a plurality of shelves on an interior thereof, at least one shelf of the plurality being disposed at a different level than at least one other vertically adjacent shelf of the plurality and positioned laterally inwardly of and parallel to the at least one other adjacent shelf of the plurality; and
a plurality of individual packages, each individual package encapsulating a semiconductor die electrically coupled to a plurality of package leads extending to a package exterior;
wherein the plurality of individual packages are disposed within the housing interior, a plurality of conductive pads attached to the housing, located directly on surfaces of the shelves and coupled to a plurality of traces in the housing are electrically coupled to at least some of the package leads of each package and at least one of the plurality of individual packages is directly supported on conductive pads located on the surface of the at least one shelf of the plurality to which package leads thereof are electrically coupled and at least one other of the plurality of individual packages is directly supported on conductive pads located on the surface of the at least one other adjacent shelf of the plurality to which leads thereof are electrically coupled over the at least one of the plurality of individual packages.
2. The multi-chip module of claim 1, wherein at least one of the individual packages encapsulates a semiconductor die comprising a memory die.
3. The multi-chip module of claim 1, wherein at least one of the individual packages encapsulates a semiconductor die comprising a device selected from the group consisting of dynamic random access memories (DRAMs) and static random access memories (SRAMs).
4. The multi-chip module of claim 1, wherein at least one of the individual packages encapsulates a semiconductor die comprising a microprocessor (MPU).
5. The multi-chip module of claim 1, wherein at least one of the individual packages encapsulates a semiconductor die comprising a microprocessor (MPU) and at least another of the individual packages encapsulates a semiconductor die comprising a memory device.
6. The multi-chip module of claim 1, wherein the plurality of package leads of each individual package are electrically coupled to the plurality of conductive pads of the housing by a structure selected from the group consisting of solder, wire bonds and tape automated bonds.
7. The multi-chip module of claim 1, wherein the plurality of package leads of at least one individual package and the conductive pads are electrically coupled by a conductive polymer disposed therebetween.
8. The multi-chip module of claim 1, wherein the plurality of package leads of at least one individual package and the conductive pads are electrically coupled by a conductive epoxy disposed therebetween.
9. The multi-chip module of claim 1, wherein at least some of the plurality of individual packages exhibit a package configuration consisting of thin small outline packages (TSOPs).
10. The multi-chip module of claim 1, wherein the housing comprises a hermetically sealed housing.
11. The multi-chip module of claim 1, wherein the housing comprises a unitary structure including a base and side walls extending transversely thereto and defines a recess containing the plurality of individual packages.
12. The multi-chip module of claim 11, wherein the housing comprises a lid covering a mouth of the recess.
13. The multi-chip module of claim 1, wherein at least some of the plurality of individual packages are disposed substantially mutually laterally adjacent within the housing.
14. A multi-chip module, comprising:
a plurality of individual packages, each individual package encapsulating a semiconductor; and
a housing comprising a unitary structure including a base and side walls extending transversely thereto and defining a recess containing the plurality of individual packages and comprising a plurality of conductive pads in electrical communication with a plurality of leads on an exterior of the housing, the semiconductor die of each individual package being electrically coupled to some of the plurality of conductive pads of the housing, wherein the plurality of leads on the exterior of the housing comprises one of surface mount configured leads and through-hole configured leads;
wherein at least some of the plurality of individual packages are disposed substantially mutually adjacently within the housing, parallel to a plane of the base; and
a lid disposed over a mouth of the recess.
15. The multi-chip module of claim 14, wherein at least one of the individual packages encapsulates a semiconductor die comprising a memory die.
16. The multi-chip module of claim 14, wherein at least one of the individual packages encapsulates a semiconductor die comprising a device selected from the group consisting of dynamic random access memories (DRAMs) and static random access memories (SRAMs).
17. The multi-chip module of claim 14, wherein at least one of the individual packages encapsulates a semiconductor die comprising a microprocessor (MPU).
18. The multi-chip module of claim 14, wherein at least one of the individual packages encapsulates a semiconductor die comprising a microprocessor (MPU) and at least another of the individual packages encapsulates a semiconductor die comprising a memory device.
19. The multi-chip module of claim 14, wherein at least some of the plurality of individual packages exhibit a package configuration consisting of thin small outline packages (TSOPs).
20. The multi-chip module of claim 14, wherein the housing comprises a hermetically sealed housing.
21. The multi-chip module of claim 14, wherein at least some of the plurality of individual packages are disposed in a stack.
22. The multi-chip module of claim 1, wherein at least one of the individual packages comprises a plastic substantially completely encapsulating a semiconductor die.
23. The multi-chip module of claim 1, wherein at least some of the plurality of individual packages are connected with a material comprising one of a nonconductive epoxy, an organic resin, a polyimide, and a nonconductive polymer.
24. The multi-chip module of claim 1, wherein the at least one and the at least one other individual packages are respectively directly supported on the at least one shelf and the at least one other shelf by the plurality of package leads of each respective package.
25. The multi-chip module of claim 1, wherein the plurality of shelves comprises a first level of shelves having at least two opposing shelves and a second level of shelves having at least two opposing shelves, and wherein a distance between the opposing shelves of the first level of shelves is greater than a distance between the opposing shelves of the second level.
26. The multi-chip module of claim 14, wherein at least one of the individual packages comprises a plastic encapsulating a semiconductor die.
27. The multi-chip module of claim 14, wherein the plurality of leads on the exterior of the housing comprises one of surface mount SOJ leads and through-hole DIP leads.
28. A multi-chip module, comprising:
at least one semiconductor die package, the at least one semiconductor die package comprising a semiconductor die, a material comprising a plastic encapsulating the semiconductor die, and a plurality of package leads electrically coupled to the semiconductor die and extending to an exterior of the material comprising a plastic;
a multi-chip module housing including a base and sidewalls extending transversely thereto comprising a cavity containing the at least one semiconductor die package, the housing cavity having a depth transverse to the base sufficient to accommodate only a single semiconductor die package therein and configured for receiving at least a portion of the at least one semiconductor package, the housing further including a substantially planar lid extending over the cavity, secured to the sidewalls and configured to seal the at least one semiconductor package within the housing; and
a plurality of conductive pads contained within the housing and in electrical communication with an exterior of the housing, wherein the plurality of package leads of the at least one semiconductor die package are mounted to the plurality of conductive pads.
29. The multi-chip module of claim 28, wherein the semiconductor die of the at least one semiconductor die package comprises a memory die.
30. The multi-chip module of claim 29, wherein the semiconductor die comprises a device selected from the group consisting of dynamic random access memories (DRAMs) and static random access memories (SRAMs).
31. The multi-chip module of claim 28, wherein the plurality of package leads of the at least one semiconductor die package are attached to the plurality of conductive pads with one of solder, conductive epoxy, and a conductive polymer.
32. The multi-chip module of claim 28, wherein the at least one semiconductor die package comprises a thin small outline package (TSOP).
33. The multi-chip module of claim 28, wherein the plurality of package leads of the at least one semiconductor die package comprise one of straight leads, gull-wing leads, or J leads.
34. The multi-chip module of claim 28, wherein the multi-chip module housing comprises a plastic.
35. The multi-chip module of claim 28, wherein the multi-chip module housing comprises a hermetically sealed housing.
36. The multi-chip module of claim 28, wherein the at least one semiconductor package comprises a first semiconductor die package and a second semiconductor die package, and wherein the first semiconductor die package and the second semiconductor die package are connected to opposing sides of a material.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A business card information management system, comprising:
a server; and
a plurality of portable devices communicatably connected to the server,
wherein the server comprises a storage unit storing:
a personal table in which a record containing a user ID and business card information of a user corresponding to the user ID is stored for each of a plurality of users of the plurality of portable devices;
an acquaintance table which is associated with one of records of the personal table corresponding to a certain user of the plurality of users, the acquaintance table having at least one record containing a user ID of one of the plurality of users other than the certain user; and
a meeting table which is associated with one of the at least one record of the acquaintance table corresponding to one of the plurality of users other than the certain user, the meeting table having at least one record containing meeting data representing a date and time of a meeting,
wherein the server further comprises an addition unit configured such that in response to receipt of the meeting data representing a date and time of a meeting from one of the plurality of portable devices, the addition unit adds a new record to the meeting table and to store the meeting data in the new record,
wherein each of the plurality portable devices comprises:
a data exchange unit configured to exchange user IDs with another one of the plurality of the portable devices;
a date and time obtaining unit configured to obtain a date and time as the meeting data in response to exchange of user IDs by the data exchange unit; and
a transmission unit configured to transmit the meeting data, a portable device’s own user ID and another user’s ID obtained from another one of the plurality of the portable devices by the data exchange unit, to the server, in response to exchange of user IDs by the data exchange unit.
2. The business card information management system according to claim 1, wherein:
the acquaintance tables has a plurality of records each of which contains a user ID of one of the plurality of users other than the certain user; and
the meeting table is associated with one of the plurality of records of the acquaintance table, and has a plurality of records each of which contains the meeting data.
3. The business card information management system according to claim 1,
wherein each of the plurality portable devices further comprises a position detection unit configured to detect a portable device’s position and to provides the detected position for the transmission unit as meeting place data,
wherein:
the transmission unit transmits additionally the meeting place data to the server in response to exchange of user IDs by the data exchange unit; and
the addition unit of the server stores additionally the meeting place data received from the portable device in the new record of the meeting table when the meeting data is stored in the new record of the meeting table.
4. The business card information management system according to claim 3,
at least one of the record of the acquaintance table and the record of the meeting table has an area in which a memo inputted through a user operation is stored.
5. The business card information management system according to claim 1,
wherein each of the plurality portable devices comprises:
a motion sensor that detects a portable device’s motion;
a storing unit;
a registration unit configured to register the portable device’s motion detected by the motion sensor in the storing unit as secret information;
a prohibition unit configured to prohibit operations of the portable device;
a release unit configured to release prohibition of the operations of the portable device in response to matching between the secret information registered by the registration unit and a motion of the portable device newly detected by the motion sensor.
6. The business card information management system according to claim 1,
wherein each of the portable devices further comprises:
a motion sensor that detects a portable device’s motion; and
an environment sensor that detects an environmental condition of the portable device as environmental information,
wherein the data exchange unit exchanges user IDs with another one of the plurality of the portable devices in response to the motion detected by the motion sensor and the environmental information being satisfying respective predetermined conditions.
7. The business card information management system according to claim 1,
wherein the data exchange unit of each of the portable device comprises:
an ID transmission unit configured to generate a unique access ID and to transmit the access ID and the user ID of the portable device to a target device of data exchange by the data exchange unit; and
an ID receipt unit configured to receive an access ID and a user ID of the target device of data exchange from the target device of data exchange,
wherein the portable device further comprises:
a selection unit configured to accept a user operation for selecting a range of disclosure of business card information regarding a user of the portable device;
a disclosure request unit configured to transmit information representing the access ID generated by the ID transmission unit and the range of disclosure selected through the selection unit, to the server;
a business card information request unit configured to transmit a request for business card information of the target device of data exchange to the server by transmitting the access ID and the user ID of the target device of data exchange to the server; and
a business card information receiving unit configured to receive the business card information which is transmitted from the server as a response to the request by the business card information request unit,
wherein the server comprises:
a disclosure range storing control unit configured such that in response to receipt of the access ID and the range of disclosure from a certain portable device, the disclosure range storing control unit stores the received access ID and the range of disclosure in the storage unit while associating the received access ID with the received range of disclosure; and
a business card information transmission unit configured such that in response to receipt of a request for business card information of a user of the certain portable device from a portable device of another user as a transmission target, the business card information transmission unit obtains, from the storage unit, the range of disclosure associated with the access ID transmitted from the transmission target, obtains, from the personal table, the business card information of the user corresponding to the certain portable device based on the user ID corresponding to the certain portable device within the obtained range of disclosure, and transmits the obtained business card information to the transmission target.
8. The business card information management system according to claim 1,
wherein the server further comprises:
a acquaintance checking unit configured such that in response to receipt of a user ID of a check target user who is one of the plurality of users other than the certain user from the portable device of the certain user, the acquaintance checking unit searches the acquaintance table for a user ID corresponding to the check target user;
an acquaintance information search unit configured such that in response to existence of the user ID of the check target user in the acquaintance table checked by the acquaintance checking table, the acquaintance information search unit searches the personal table for a record corresponding to the check target user; and
a detailed information transmission unit configured such that in response to the record corresponding to the check target user being searched by the acquaintance information search unit in the personal table, the detailed information transmission unit transmits information in the record of the personal table searched by the acquaintance information search unit and information in a record of the meeting table associated with the record of which existence in the acquaintance table is checked by the acquaintance checking unit, to the portable device of the certain user,
wherein each of the plurality of portable devices comprises:
a display unit configured to display the information transmitted from the server.
9. The business card information management system according to claim 1,
wherein the business card information of the user includes at least a name of the user corresponding to the user ID.
10. The business card information management system according to claim 1, wherein the data exchange unit exchanges the user IDs by a data communication.
11. The business card information management system according to claim 10, wherein the data communication comprises a wireless communication.
12. The business card information management system according to claim 1, wherein the addition unit stores the meeting data in the new record based on a portable device’s own user ID and another user’s ID which are transmitted by the transmission unit together with the meeting data.
13. The business card information management system according to claim 12,
wherein, if the acquaintance table does not include a record related to a record of the personal table corresponding to a portable device’s own user ID and containing another US’s ID, the addition unit adds a new record, which is related to the record of the portable device’s own user ID and containing the another user’s ID, to the acquaintance table, and creates a meeting table related to the new record containing the another user’s ID, the addition unit adding a record to the created meeting table and adding the meeting data to the added record of the meeting table.