1. A water-based ink set for ink-jet recording comprising a magenta ink and a red ink, wherein
the magenta ink is a light magenta ink having a lightness (L*) of about 50 or more in the L*a*b* colorimetric system.
2. The water-based ink set for ink-jet recording according to claim 1, wherein
a normal magenta ink having a lightness (L*) of less than about 50 in the L*a*b* colorimetric system is not included in the ink set.
3. The water-based ink set for ink-jet recording according to claim 1, wherein
the light magenta ink has the lightness (L*) in a range of from about 50 to about 65 in the L*a*b* colorimetric system.
4. The water-based ink set for ink-jet recording according to claim 1, wherein
the light magenta ink has a hue angle (h) in a range of from about 335\xb0 to about 360\xb0 or in a range of from about 0\xb0 to about 5\xb0 in the L*a*b* colorimetric system.
5. The water-based ink set for ink-jet recording according to claim 1, wherein
the light magenta ink has a chroma (C*) in a range of from about 80 to about 90 in the L*a*b* colorimetric system.
6. The water-based ink set for ink-jet recording according to claim 1, wherein
the red ink has a lightness (L*) of about 50 or less in the L*a*b* colorimetric system.
7. The water-based ink set for ink-jet recording according to claim 1, wherein
the red ink has the lightness (L*) in a range of from about 25 to about 50 in the L*a*b* colorimetric system.
8. The water-based ink set for ink-jet recording according to claim 1, wherein
the red ink has a hue angle (h) in a range of from about 20\xb0 to 35\xb0 in the L*a*b* colorimetric system.
9. The water-based ink set for ink-jet recording according to claim 1, wherein
the red ink has a chroma (C*) in a range of from about 80 to about 90 in the L*a*b* colorimetric system.
10. The water-based ink set for ink-jet recording according to claim 1, further comprising a yellow ink andor a cyan ink.
11. The water-based ink set for ink-jet recording according to claim 10, further comprising a blue ink andor a green ink, and wherein
the cyan ink is a light cyan ink having a lightness (L*) of about 60 or more in the L*a*b* colorimetric system.
12. The water-based ink set for ink-jet recording according to claim 11, wherein
a normal cyan ink having a lightness (L*) of less than about 60 in the L*a*b* colorimetric system is not included in the ink set.
13. The water-based ink set for ink-jet recording according to claim 11, wherein
the light cyan ink has a lightness (L*) in a range of from about 60 to about 85 in the L*a*b* colorimetric system.
14. The water-based ink set for ink-jet recording according to claim 11, wherein
the light cyan ink has a hue angle (h) in a range of from about 215\xb0 to about 255\xb0 in the L*a*b* colorimetric system.
15. The water-based ink set for ink-jet recording according to claim 11, wherein
the light cyan ink has a chroma (C*) in a range of from about 40 to about 70 in the L*a*b* colorimetric system.
16. The water-based ink set for ink-jet recording according to claim 11, wherein
the blue ink has a lightness (L*) of about 45 or less in the L*a*b* colorimetric system.
17. The water-based ink set for ink-jet recording according to claim 11, wherein
the blue ink has the lightness (L*) in a range of from about 35 to about 45 in the L*a*b* colorimetric system.
18. The water-based ink set for ink-jet recording according to claim 11, wherein
the blue ink has a hue angle (h) in a range of from about 270\xb0 to about 285\xb0 in the L*a*b* colorimetric system.
19. The water-based ink set for ink-jet recording according to claim 11, wherein
the blue ink has a chroma (C*) in a range of from about 70 to about 80 in the L*a*b* colorimetric system.
20. The water-based ink set for ink-jet recording according to claim 11, wherein
the green ink has a lightness (L*) of about 60 or less in the L*a*b* colorimetric system.
21. The water-based ink set for ink-jet recording according to claim 11, wherein
the green ink has the lightness (L*) in a range of from about 35 to about 60 in the L*a*b* colorimetric system.
22. The water-based ink set for ink-jet recording according to claim 11, wherein
the green ink has a hue angle (h) in a range of from about 175\xb0 to less than about 215\xb0 in the L*a*b* colorimetric system.
23. The water-based ink set for ink-jet recording according to claim 11, wherein
the green ink has a chroma (C*) in a range of from about 60 to about 80 in the L*a*b* colorimetric system.
24. The water-based ink set for ink-jet recording according to claim 1, further comprising a black ink.
25. The water-based ink set for ink-jet recording according to claim 10, further comprising a black ink.
26. The water-based ink set for ink-jet recording according to claim 11, further comprising a black ink.
27. An ink-jet recording method employing the water-based ink set according to claim 1.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacture of a package-on-package system comprising:
providing a package substrate;
attaching a semiconductor die to the package substrate;
forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and
creating through vias by applying solder into the through openings.
2. The method as claimed in claim 1 wherein:
providing the package substrate includes forming the package substrate that extends from an end edge to an opposite edge of the package-on-package system; and
forming an encapsulant includes creating through openings located on one side of the package substrate.
3. The method as claimed in claim 1 wherein:
providing the package substrate includes forming the package substrate incorporating tie bars extending to edges of the package-on-package system; and
forming and encapsulant includes creating through openings located on one side of the tie bars.
4. The method as claimed in claim 1 wherein providing the package substrate includes forming the package substrate incorporating a package carrier and substrate connections.
5. The method as claimed in claim 1 wherein providing a package substrate includes forming the package substrate incorporating substrate connections and dummy patterns.
6. A method of manufacture of a package-on-package system comprising:
providing a package substrate with substrate connections;
attaching a semiconductor die to the package substrate;
connecting the semiconductor die to the substrate connections in the package substrate using electrical interconnects;
molding an encapsulant around the semiconductor die using a mold with pins to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface, wherein the pins define through openings extending from the top exposed surface through the bottom exposed surface; and
creating through vias by applying solder through a stencil plate with openings aligned to the through openings.
7. The method as claimed in claim 6 wherein:
providing the package substrate includes forming the package substrate that extends from an end edge to an opposite edge of the package-on-package system; and
molding an encapsulant including creating through openings located on either side of the package substrate.
8. The method as claimed in claim 6 wherein:
providing the package substrate includes forming the package substrate incorporating tie bars extending to edges of the package-on-package system; and
molding and encapsulant includes creating through openings located on either side of the tie bars.
9. The method as claimed in claim 6 wherein providing the package substrate includes a package substrate incorporating a package carrier and substrate connections, and further comprising dissolving the package carrier following molding the encapsulant.
10. The method as claimed in claim 6 wherein providing a package substrate includes forming the package substrate incorporating a package carrier, substrate connections, and dummy patterns, and further comprising dissolving the package carrier following molding the encapsulant.
11. A package-on-package system comprising:
a package substrate;
a semiconductor die attached to the package substrate;
an encapsulant surrounding at least portions of the package substrate and the semiconductor die, the encapsulant having a bottom exposed surface coplanar with the bottom surface of the package substrate and a top exposed surface; and
through vias extending from the top exposed surface to a bottom exposed surface of the encapsulant.
12. The system as claimed in claim 11 wherein:
the package substrate extends from an end edge to opposite edge of the package-on-package system; and
the through vias are located on one side of the package substrate.
13. The system as claimed in claim 11 wherein:
the package substrate includes tie bars extending to the edges of the package-on-package system; and
the through vias are located on one side of the tie bars.
14. The system as claimed in claim 11 wherein the package substrate includes a package carrier and substrate connections.
15. The system as claimed in claim 11 wherein the package substrate includes substrate connections and dummy patterns.
16. The system as claimed in claim 11 further comprising:
substrate connections defined in the package substrate;
electrical interconnects for connecting the semiconductor die to the substrate connections in the package substrate; and
wherein:
the encapsulant is a molding compound.
17. The system as claimed in claim 16 wherein:
the package substrate extends from an end edge to an opposite edge of the package-on-package system; and
the through vias are located on either side of the package substrate.
18. The system as claimed in claim 16 wherein:
the package substrate includes tie bars extending to the edges of the package-on-package system and an offset between the tie bars; and
the through vias are located on either side of the tie bars.
19. The system as claimed in claim 16 wherein:
the package substrate includes a package carrier and substrate connections; and
the package carrier is a sacrificial plate.
20. The system as claimed in claim 16 wherein:
the package substrate includes a package carrier, substrate connections and dummy patterns; and
the package carrier is a sacrificial plate.