1. A heat-sensitive material for a heat-sensitive decomposition structure used in a sprinkler head of a compression type that uses a low-melting point alloy for said heat-sensitive decomposition structure characterized in that said heat-sensitive material comprises an alloy composed of Sn in an amount of 0.1-2.0% by mass, Bi in an amount of 31-37% by mass and In for balance.
2. A heat-sensitive material for a heat-sensitive decomposition structure used in a sprinkler head in accordance with claim 1, wherein said heat sensitive material is further added with at least one or more element(s) for improving the strength in a total amount no more than 2.0% by mass, said at least one or more element(s) being selected from a group of elements consisting of Cu in an amount of 0.1-1.0% by mass, Sb in an amount of 0.2-2.0% by mass, Ge in an amount of 0.1-1.0% by mass, Ag in an amount of 0.1-0.7% by mass, Au in an amount of 0.1-0.6% by mass, Zn in an amount of 0.2-0.6% by mass, La group in an amount of 0.01-0.1% by mass, and Ni in an amount of 0.02-0.1% by mass.
3. A sprinkler head adapted for a yield temperature in a range of 70-75\xb0 C., which uses a heat-sensitive material in accordance with claim 1.
4. A heat-sensitive material for a heat-sensitive decomposition structure used in a sprinkler head of a compression type that uses a low-melting point alloy for said heat-sensitive decomposition structure characterized in that said heat-sensitive material comprises an alloy composed of Zn in an amount of 0.05-0.4% by mass, Bi in an amount of 47-55% by mass and In for balance.
5. A heat-sensitive material for a heat-sensitive decomposition structure used in a sprinkler head in accordance with claim 4, wherein said heat-sensitive material is further added with at least one or more element(s) for improving the strength in a total amount no more than 2.0% by mass, said at least one or more element(s) being selected from a group of elements consisting of Cu in an amount of 0.1-1.0% by mass, Sb in an amount of 0.2-2.0% by mass, Ge in an amount of 0.1-1.0% by mass, Ag in an amount of 0.1-0.7% by mass, Au in an amount of 0.1-0.6% by mass, Zn in an amount of 0.2-0.6% by mass, La group in an amount of 0.01-0.1% by mass, and Ni in an amount of 0.02-0.1% by mass.
6. A sprinkler head adapted for a yield temperature in a range of 90-95\xb0 C., which uses a heat-sensitive material in accordance with claim 4.
7. A sprinkler head adapted for a yield temperature in a range of 70-75\xb0 C., which uses a heat-sensitive material in accordance with claim 2.
8. A sprinkler head adapted for a yield temperature in a range of 90-95\xb0 C., which uses a heat-sensitive material in accordance with claim 5.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A positive resist composition comprising:
(A) a resin which contains all of the repeating units represented by formulae (I), (II) and (III), and becomes soluble in an alkali developer by the action of an acid; and
(B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation:
wherein
A represents a group capable of decomposing and leaving by the action of an acid,
each R1 independently represents a hydrogen atom or a methyl group,
R2 represents a phenyl group or a cyclohexyl group,
m represents 1 or 2, and
n represents an integer of 0 to 2.
2. The positive resin composition as claimed in claim 1, wherein
the repeating unit represented by formula (I) is a structure represented by formula (I)-a:
3. The positive resist composition as claimed in claim 1, wherein
the repeating unit represented by formula (II) is a structure represented by formula (II)-a:
wherein R1 represents a hydrogen atom or a methyl group.
4. The positive resist composition as claimed in claim 1, wherein
R2 in formula (III) is a phenyl group.
5. The positive resist composition as claimed in claim 1, wherein
the mass average molecular weight of the resin as the component (A) is 10,000 or more.
6. A pattern forming method comprising steps of forming a resist film from the resist composition claimed in claim 1, and exposing and developing the resist film.