1. A semiconductor device comprising:
a substrate on which is formed a plurality of leads; and
a semiconductor chip having a plurality of electrodes, the leads and the electrodes being mounted on the substrate in a manner to face each other and to be electrically connected,
wherein the plurality of leads includes a plurality of lead groups, each of which are formed of at least two first leads, and a plurality of second leads,
wherein each of the second leads is positioned between an adjacent pair of the lead groups,
wherein each of an outermost pair of the first leads of each of the lead groups includes a first portion and a second portion, the first portion of each of the outermost pair of the first leads being positioned at a first spacing apart and the second portion of each of the outermost pair of the first leads being positioned at a second spacing apart which is smaller than the first spacing, and
wherein each of the second leads is disposed in a manner to avoid a region that is sandwiched between the first portion of each of the adjacent pair of the lead groups and has a portion that is disposed in a region that is sandwiched between the second portion of each of the adjacent pair of the lead groups.
2. The semiconductor device as defined by claim 1,
wherein an adjacent pair of the second leads is disposed so as to sandwich one of the lead groups, and
wherein the outermost pair of the first leads of each of the lead groups is formed so that the first spacing is greater than or equal to a spacing of the adjacent pair of the second leads.
3. The semiconductor device as defined by claim 1,
wherein the plurality of lead groups includes a first lead group and a second lead group,
wherein the second leads are formed in such a manner that an end of each of the second leads does not pass over a straight line, and
wherein the first portion of each of the outermost pair of the first leads of the first lead group is disposed at a position closer to the straight line than the first portion of each of the outermost pair of the first leads of the second group.
4. The semiconductor device as defined by claim 1,
wherein each of the lead group includes at least three of the first leads, and
wherein the outermost pair of the first leads of each lead group are of a different length from a length of a remaining one of the first leads which is sandwiched between the outermost pair of the first leads.
5. An electronic module to which is attached the semiconductor device defined by claim 1.
6. An electronic instrument having the semiconductor device defined by claim 1.
7. A wiring board comprising:
a substrate; and
a plurality of leads which are formed on the substrate,
wherein the plurality of leads includes a plurality of lead groups, each of which are formed of at least two first leads, and a plurality of second leads,
wherein each of the second leads is positioned between an adjacent pair of the lead groups,
wherein each of an outermost pair of the first leads of each of the lead groups includes a first portion and a second portion, the first portion of each of the outermost pair of the first leads being positioned at a first spacing apart and the second portion of each of the outermost pair of the first leads being positioned at a second spacing apart which is smaller than the first spacing, and
wherein each of the second leads is disposed in a manner to avoid a region that is sandwiched between the first portion of each of the adjacent pair of the lead groups and has a portion that is disposed in a region that is sandwiched between the second portion of each of the adjacent pair of the lead groups.
8. The wiring board as defined by claim 7,
wherein an adjacent pair of the second leads is disposed so as to sandwich one of the lead groups, and
wherein the outermost pair of the first leads of each of the lead groups is formed so that the first spacing is greater than or equal to a spacing of the adjacent pair of the second leads.
9. The wiring board as defined by claim 7,
wherein the plurality of lead groups includes a first lead group and a second lead group,
wherein the second leads are formed in such a manner that an end of each of the second leads does not pass over a straight line, and
wherein the first portion of each of the outermost pair of the first leads of the first lead group is disposed at a position closer to the straight line than the first portion of each of the outermost pair of the first leads of the second group.
10. The wiring board as defined by claim 7,
wherein each of the lead group includes at least three of the first leads, and
wherein the outermost pair of the first leads of each lead group are of a different length than a length of a remaining one of the first leads which is sandwiched between the outermost pair of the first leads.
11. A method of a manufacturing a semiconductor device, the method comprising:
mounting a semiconductor chip having a plurality of electrodes onto a substrate on which is formed a plurality of leads, in such a manner that the electrodes face the leads; and
bonding the electrodes and the leads,
wherein the plurality of leads includes a plurality of lead groups, each of which are formed of at least two first leads, and a plurality of second leads,
wherein each of the second leads is positioned between an adjacent pair of the lead groups,
wherein each of an outermost pair of the first leads of each of the lead groups includes a first portion and a second portion, the first portion of each of the outermost pair of the first leads being positioned at a first spacing apart and the second portion of each of the outermost pair of the first leads being positioned at a second spacing apart which is smaller than the first spacing, and
wherein each of the second leads is disposed in a manner to avoid a region that is sandwiched between the first portion of each of the adjacent pair of the lead groups and has a portion that is disposed in a region that is sandwiched between the second portion of each of the adjacent pair of the lead groups.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Apparatus for the internal depressurization of plastic containers thermoformed by means of blowing and intended for sterile filling, characterized in that the said depressurization step is performed by means of the secondary suction circuit of a Venturi meter or ejector (15), the primary circuit of which is passed through by compressed air at pressure values regulated by a proportional valve (19) controlled by an electronic control unit (10) which detects the internal pressure or vacuum of the containers by means of a transducer (9) and which is programmed by means of a suitable programming apparatus (11) and which, upon reaching of the predetermined vacuum inside the containers, activates means (Z) for closing the end portion of the said thermoformed containers.
2. Apparatus according to claim 1, characterized in that the electronic control unit (10) intended for driving the proportional pressure valve (19) is designed to detect, in addition to the internal pressure or vacuum of the containers, by means of the said transducer (9), also the atmospheric pressure of the working environment of the thermoforming machine, by means of at least one special barometric sensor (21), the said control unit being designed to receive, via the said programming unit (11), the reference value (Vr) of the internal pressure (DPI) of the containers, correlated to a mean value (Vm) of the atmospheric pressure (PA), and also being designed to vary automatically the internal vacuum threshold, upon reaching of which the means (Z) for closing the end portion of the containers are activated, in accordance with the variations in atmospheric pressure with respect to the said mean value (Vm), following the law whereby the internal vacuum varies in an inversely proportional manner with respect to the said variations in the atmospheric pressure.
3. Apparatus according to claim 1, characterized in that the blowing nozzles (U) of the thermoforming machine are branched to a first ON-OFF valve (1) for sending the sterile compressed air for thermoforming the containers (C) and are also connected to a second ON-OFF valve (13) which is closed during the thermoforming step and which is opened at the end of this step, after closing of the said first valve, the outlet of this second valve being connected to the suction mouth of the Venturi meter (15), both the said valves (1, 13) being controlled by the electronic control unit (10) via a suitable interface (14).
4. Apparatus according to claim 1, in which a filter or silencer (16) is connected to the discharge mouth of the Venturi meter (15).
5. Apparatus according to claim 1, in which the primary circuit of the Venturi meter (15) is provided, immediately upstream of the latter, with a valve of the ON-OFF type (20) controlled by the said electronic control unit (10) which drives the proportional pressure valve (19).
6. Apparatus according to claim 1, characterized in that the line (17) which supplies the compressed air to the primary circuit of the Venturi meter (15) is provided with a pressure regulator (18) driven by the proportional pressure valve (19) controlled by the electronic control unit (10).