1. A solder transfer substrate, comprising:
a base layer;
an adhesive layer arranged on the base layer; and
solder powder arranged on the adhesive layer, wherein
in the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged,
the base layer is larger than the adhesive layer in respect of a compression rate at a time of heating, and
the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.
2. A solder transfer substrate according to claim 1, wherein
the base layer is a porous member.
3. The solder transfer substrate according to claim 1, wherein
at least one of the plurality of holes is formed at least to an inside of the adhesive layer.
4. The solder transfer substrate according to claim 1, wherein
the base layer is made of a woven-fabric material.
5. The solder transfer method, comprising:
a solder joining step of superposing a solder transfer substrate and a circuit board or electronic component with an electrode formed on a surface thereof, the solder transfer substrate comprising:
a base layer;
an adhesive layer arranged on the base layer; and
solder powder arranged on the adhesive layer, wherein
in the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged,
the base layer is larger than the adhesive layer in respect of a compression rate at a time of heating, and
the adhesive layer has a characteristic of expanding with the peeling-off liquid infused,
the solder transfer substrate being superposed so that a face on which the solder powder has been loaded faces a face on which the electrode has been formed, carrying out heating and pressurization, and allowing the solder powder to be joined to the electrode;
a peeling-off liquid infiltrating step of allowing the peeling-off liquid to infiltrate the adhesive layer via the plurality of holes provided in the base layer; and
a transfer substrate peeling-off step of peeling-off the solder transfer substrate from the circuit board or electronic component.
6. The solder transfer method, comprising:
a solder joining step of superposing a solder transfer substrate and a circuit board or electronic component with an electrode formed on a surface thereof, the solder transfer substrate comprising:
a base layer;
an adhesive layer arranged on the base layer; and
solder powder arranged on the adhesive layer, wherein
in the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged,
the base layer is larger than the adhesive layer in respect of a compression rate at a time of heating, and
the adhesive layer has a characteristic of expanding with the peeling-off liquid infused,
the solder transfer substrate being superposed so that a face on which the solder powder has been loaded faces a face on which the electrode has been formed, carrying out heating and pressurization, and allowing the solder powder to be joined to the electrode;
a peeling-off liquid infiltrating step of allowing the peeling-off liquid to infiltrate the adhesive layer via the plurality of holes provided in the base layer;
a transfer substrate peeling-off step of peeling-off the solder transfer substrate from the circuit board or electronic component, and
a solder layer forming step of performing heating at a melting point of solder or more to allow the solder powders to be melted.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A removable elastic appliance comprising:
a thin polymeric shell which is shaped to be positioned over at least some teeth of a jaw and adapted to interact with an oral surface to expand the palate of the jaw.
2. An appliance as in claim 1, wherein the appliance further comprises an orthodontic component mounted directly on the shell.
3. An appliance as in claim 1, wherein the orthodontic component is formed by the shell.
4. An appliance as in claim 3, wherein the component is configured to interact with the palate.
5. A system comprising two or more removable elastic appliances as in claim 1.
6. An appliance as in claim 5, wherein the system comprises three or more elastic appliances.
7. A removable positioning appliance comprising:
a thin polymeric shell having cavities shaped to receive at least some of the teeth of a jaw and adapted to interact with an oral surface to expand the palate of the jaw.
8. An appliance as in claim 7, wherein the thin polymeric shell includes a protrusion having an increased thickness of material in at least a portion of a posterior occlusal region.
9. An appliance as in claim 7, wherein the thin polymeric shell includes a protrusion having an extension of at least a portion of an upper palatal region with added thickness.
10. An appliance as in claim 3, wherein the component comprises a wire which spans an arch of the shell between the portions which are positioned over opposing upper molars.
11. An appliance as in claim 3, wherein the component comprises a wire which is embedded in the polymeric shell.
12. An appliance as in claim 4, wherein the component is a palatal bar.
13. An appliance as in claim 12, wherein the palatal bar is corrugated.
14. An appliance as in claim 7, further comprising a wire which spans an arch of the shell between the portions which are positioned over opposing upper molars.
15. An appliance as in claim 7, further comprising a wire which is embedded in the polymeric shell.
16. An appliance as in claim 7, further comprising a palatal bar formed as part of the shell and spanning an arch between portions of the shell positioned over opposing upper molars.
17. An appliance as in claim 16, wherein the palatal bar is corrugated.
18. A system comprising a series of removable thin shell appliances, including one or more intermediate appliances each of which has a geometry selected to progressively expand the palate and a final appliance having a geometry selected to expand the palate to a target desired breadth.
19. The system of claim 18, wherein each of the appliances comprises molar cavities adapted to fit over the patient’s molars and a palatal component separating the two molar regions.
20. The system of claim 19, wherein each molar cavity fits over two posterior molars.
21. The system of claim 18, wherein there are at least two intermediate appliances.
22. The system of claim 18, wherein there are at least 10 intermediate appliances.
23. The system of claim 18, wherein there are at least 20 intermediate appliances.
24. A method of expanding the palate of a patient using the system of claim 18, the method comprising positioning each appliance in the series of appliances to expand the palate of the patient, leaving the appliance in position for a period of time and replacing the appliance with the next in the series until the desired palatal expansion has occurred.
25. A method of expanding the palate of a patient, the method comprising generating from an initial model of the patient’s upper jaw a series of incremental appliances including a first appliance having a geometry selected to incrementally expand the palate; one or more intermediate appliances having geometries selected to progressively expand the palate; and a final appliance having a geometry selected to expand the palate to a target desired breadth; and sequentially positioning the appliances over the molars in the patient’s upper jaw for a period of time effective to expand the palate to approximately the target desired breadth.