1. A method for treating non-viral infections, the method comprising the steps of:
administering a therapeutically-effective amount of a composition comprising isolated secretory IgA and at least one probiotic bacteria to an individual having a non-viral infection, at least 90% of the probiotic bacteria present in the composition being associated with at least one SIgA molecule as immune complexes.
2. The method in accordance with claim 1 wherein the non-viral infection is selected from the group consisting of a bacterial infection, a parasite infection and a fungal infection.
3. The method in accordance with claim 1 wherein the non-viral infection is a bacterial infection selected from the group consisting of an Escherichia coli infection, a Vibrio cholerae infection, a salmonella infection, a clostridia infection, a shigella infection, and a parasite infection.
4. The method in accordance with claim 1 wherein the probiotic bacteria is selected from the group consisting of Bifidobacterium, Lactobacillus, Streptococcus, Saccharomyces and mixtures thereof.
5. The method in accordance with claim 1, wherein the product is a food product or a pharmaceutical composition.
6. The method in accordance with claim 1, wherein the individual is a human.
7. The method in accordance with claim 1, wherein all of the probiotic bacteria are associated with at least one SIgA molecule as immune complexes.
8. The method in accordance with claim 1, wherein the composition enhances immune function.
9. The method in accordance with claim 1, wherein the composition comprises at least one other kind of other food grade bacteria.
10. The method in accordance with claim 1, wherein the composition contains at least one prebiotic.
11. The method in accordance with claim 1, wherein the product comprises between 102 and 1010 cells of probiotics per daily dose.
12. The method in accordance with claim 1, wherein the product comprises between 0.0001 mg secretory SIgA and 10 mg SIgA per daily dose.
13. A method for treating a non-viral infection comprising the steps of:
administering a therapeutically-effective amount of a composition comprising isolated secretory IgA and at least one probiotic bacteria to an individual having a non-viral infection, the isolated secretory IgA and the probiotic bacteria present in the composition in a stoichiometric ratio of at least 10:1.
14. The method in accordance with claim 1 wherein the non-viral infection is selected from the group consisting of Giardia lamblia, Entamoeba histolytica, Cryptosporidium spp and mixtures thereof.
15. The method in accordance with claim 1 wherein the probiotic is selected from the group consisting of Bifidobacterium longum, Bifidobacterium lactis, Lactobacillus acidophilus, Lactobacillus rhamnosus, Lactobacillus paracasei, Lactobacillus johnsonii, Lactobacillus plantarum, Lactobacillus salivarius, Enterococcus faecium, Saccharomyces boulardii, Lactobacillus reuteri and mixtures thereof.
16. The method in accordance with claim 13 wherein the non-viral infection is selected from the group consisting of a bacterial infection, a parasite infection and a fungal infection.
17. The method in accordance with claim 13 wherein the non-viral infection is a bacterial infection selected from the group consisting of an Escherichia coli infection, a Vibrio cholerae infection, a salmonella infection, a clostridia infection, a shigella infection, and a parasite infection.
18. The method in accordance with claim 13 wherein the probiotic bacteria is selected from the group consisting of Bifidobacterium, Lactobacillus, Streptococcus, Saccharomyces and mixtures thereof.
19. The method in accordance with claim 13, wherein the product is a food product or a pharmaceutical composition.
20. The method in accordance with claim 13, wherein the individual is a human.
21. The method in accordance with claim 13, wherein the secretory IgA and the at least one probiotic bacteria are present in the composition in a stoichiometric ratio of at least 100:1.
22. The method in accordance with claim 13, wherein the composition enhances immune function.
23. The method in accordance with claim 13, wherein the composition comprises at least one other kind of other food grade bacteria.
24. The method in accordance with claim 13, wherein the composition contains at least one prebiotic.
25. Method in accordance with claim 13, wherein the product comprises between 102 and 1010 cells of probiotics per daily dose.
26. The method in accordance with claim 13, wherein the product comprises between 0.0001 mg secretory SIgA and 10 mg SIgA per daily dose.
27. The method in accordance with claim 13 wherein the non-viral infection is selected from the group consisting of Giardia lamblia, Entamoeba histolytica, Cryptosporidium spp and mixtures thereof.
28. The method in accordance with claim 13 wherein the probiotic is selected from the group consisting of Bifidobacterium longum, Bifidobacterium lactis, Lactobacillus acidophilus, Lactobacillus rhamnosus, Lactobacillus paracasei, Lactobacillus johnsonii, Lactobacillus plantarum, Lactobacillus salivarius, Enterococcus faecium, Saccharomyces boulardii, Lactobacillus reuteri and mixtures thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wireless IC device comprising:
a wireless IC arranged to transmit and receive signals;
a feeder circuit substrate including a feeder circuit incorporating an inductance element connected to the wireless IC in a galvanically conductive state and in which a feeder electrode coupled to the inductance element is provided on a surface of the feeder circuit substrate or an inside of the feeder circuit substrate;
a radiation plate that is electromagnetically coupled to the feeder electrode; and
a mounting electrode provided on a surface of the feeder circuit substrate; wherein
the mounting electrode is electrically independent from the feeder circuit.
2. The wireless IC device according to claim 1, wherein, between the feeder electrode and the mounting electrode, the mounting electrode is disposed at an outer edge portion of the feeder circuit substrate.
3. The wireless IC device according to claim 1, wherein the mounting electrode is disposed on a side surface of the feeder circuit substrate.
4. The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of two opposite side surfaces of the feeder circuit substrate.
5. The wireless IC device according to claim 3, wherein the mounting electrode is disposed on each of the two opposite side surfaces of the feeder circuit substrate at line-symmetrical positions.
6. The wireless IC device according to claim 3, wherein the mounting electrode is disposed at a distance spaced away from a lower surface of the feeder circuit substrate.
7. The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged so as to expose the electrode layer on at least one of surfaces of the laminated body.
8. The wireless IC device according to claim 3, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged in a recess formed on at least one of side surfaces of the laminated body.
9. The wireless IC device according to claim 1, further comprising a resonant circuit that is provided in the feeder circuit substrate.
10. The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit is arranged so that the wireless IC is galvanically connected to the feeder electrode.
11. The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element incorporated in the feeder circuit substrate and an element mounted on the feeder circuit substrate.
12. The wireless IC device according to claim 9, wherein the resonant circuit or the matching circuit includes an element provided for the feeder circuit substrate and an element mounted on a substrate for which the radiation plate is provided.
13. The wireless IC device according to claim 1, further comprising a matching circuit that is provided in the feeder circuit substrate.
14. The wireless IC device according to claim 1, wherein the radiation plate is provided on at least one of a surface or an inside of a radiation substrate.
15. The wireless IC device according to claim 1, further comprising a substrate-side mounted electrode that is provided on a surface of a radiation substrate in which the radiation plate is provided, wherein the substrate-side mounted electrode is electrically connected to the mounting electrode of the feeder circuit substrate.
16. The wireless IC device according to claim 15, wherein the substrate-side mounted electrode is electrically connected to the radiation plate.
17. The wireless IC device according to claim 1, wherein the feeder electrode is arranged over a range from a surface, facing the radiation plate, of the feeder circuit substrate to at least one of surface of the feeder circuit substrate that does not face the radiation plate.
18. The wireless IC device according to claim 1, wherein a plurality of the radiation plates are provided.
19. The wireless IC device according to claim 1, wherein at least one of a plurality of the feeder electrodes or a plurality of the mounting electrodes are provided on a surface of the feeder circuit substrate.
20. The wireless IC device according to claim 1, further comprising a sealing resin that is provided between a radiation substrate, on which the radiation plate is provided, and the feeder circuit substrate.
21. The wireless IC device according to claim 1, wherein the feeder circuit includes at least two inductance elements having different inductances.
22. The wireless IC device according to claim 1, wherein
the feeder circuit substrate includes the inductance element and a capacitance element at different positions in plan view,
the capacitance element is electromagnetically coupled to a feeder electrode that is different from the feeder electrode to which the inductance element is electromagnetically coupled, and
the different radiation plates are respectively coupled to the feeder electrodes in a galvanically non-conductive state.
23. The wireless IC device according to claim 1, wherein the feeder circuit substrate is defined by a multilayer substrate.
24. The wireless IC device according to claim 1, further comprising a protection film arranged to cover at least one of a wireless IC chip arranged to transmit and receive signals, the feeder circuit substrate and the radiation plate.
25. The wireless IC device according to claim 1, wherein an imaginary portion of an inputoutput impedance of the wireless IC device conjugates with the imaginary portion of an impedance when viewed from a portion of the feeder circuit substrate, connected to the wireless IC, toward the feeder electrode within or near a range of frequency used.
26. An electronic apparatus comprising the wireless IC device according to claim 1.
27. An electronic apparatus comprising the wireless IC device according to claim 1, wherein the radiation plate is provided for a printed wiring board incorporated in an apparatus casing, and the feeder electrode provided for the feeder circuit substrate is electromagnetically coupled to the radiation plate.