1. A computer implemented method, comprising:
using at least one processor that is programmed for performing a process comprising:
using a pattern dependent model to determine one or more manufacturing recipes and one or more equipment settings for a process used to fabricate an integrated circuit (IC), wherein
the one or more manufacturing recipes and the one or more equipment settings reduce process-induced variation in one or more wafer state parameters or electrical performance; and
performing an electrical impact analysis to adjust at least a part of an integrated circuit design of the integrated circuit to reduce an electrical impact that is caused by the process-induced variation or a variation of a feature of the integrated circuit design.
2. The computer implemented method of claim 1, in which the one or more wafer state parameters comprise at least one of film thickness across the full fabricated IC.
3. The computer implemented method of claim 1, also including using one or more test wafers to characterize pattern dependencies in at least a portion of the integrated circuit fabrication process and using the pattern dependencies in the model.
4. The computer implemented method of claim 3, in which the portion of the fabrication process comprises electroplating.
5. The computer implemented method of claim 3, in which the portion of the fabrication process comprises oxide deposition.
6. The computer implemented method of claim 3, in which the portion of the fabrication process comprises chemical mechanical polishing (CMP).
7. The computer implemented method of claim 3, in which the portion of the fabrication process comprises plasma etch.
8. The computer implemented method of claim 3, in which the portion of the fabrication process comprises a lithography process.
9. The computer implemented method of claim 1, 2, 3, 4, 5, 6, 7, or 8, in which the model maps pattern dependent features to the process induced variation in the one or more wafer state parameters.
10. The computer implemented method of claim 1, in which the pattern dependent model maps the pattern dependent features to the process induced variation in the one or more wafer state parameters that include at least one of film thickness, array height, step height, sheet resistance, capacitance, crosstalk noise, and coupling capacitance.
11. The computer implemented method of claim 1, in which the pattern dependent model maps the pattern dependent features to the process induced variation in the one or more wafer state parameters, and the pattern dependent features include at least one of linespace, linewidth, and effective density.
12. The computer implemented method of claim 1, also including using at least the pattern dependent model to generate full-chip predictions of variation in wafer state and one or more electrical parameters.
13. The computer implemented method of claim 1 or 12, also including using a cost-function to measure results of one or more predictions in wafer state or in one or more electrical parameters generated by using at least the pattern dependent model.
14. The computer implemented method of claim 1, also including:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated using at least the pattern dependent model; and
using the cost function to compare one set of recipe or one or more equipment settings to another.
15. The computer implemented method of claim 1, also including:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated by using at least the pattern dependent model; and
using optimization methods to select recipe and equipment settings that minimize variation in wafer-state or one or more electrical parameters.
16. The computer implemented method of claim 1, comprising:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated by using at least the pattern dependent model; and
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in the wafer-state or the one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming.
17. The computer implemented method of claim 1, also including:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated by using at least the pattern dependent model;
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in wafer-state or one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming; and
using one or more quadratic cost functions to facilitate convergence of the one or more optimization methods.
18. The computer implemented method of claim 1, in which the process comprises a single process step.
19. The computer implemented method of claim 1, in which the process comprises more than one process step or a process flow.
20. The computer implemented method of claim 1, also including communicating one or more sets of the one or more manufacturing recipes and equipment settings to a user through a graphical user interface.
21. The computer implemented method of claim 1, also including communicating at least one of the one or more manufacturing recipes directly to a process tool or a fabrication automation system.
22. The computer implemented method of claim 1, also including communicating at least one of the one or more manufacturing recipes directly to a memory device attached to a wafer carrier or prescribed to a particular wafer lot.
23. The computer implemented method of claim 1, also including using the pattern dependent model to predict or simulate electrical performance or electrical parameters as a result of a single process step.
24. The computer implemented method of claim 1, also including using the pattern dependent model to predict or simulate electrical performance or electrical parameters as a result of more than one process steps or a process flow.
25. The computer implemented method of claim 1, also including using actual product wafers to develop the model, the model mapping pattern dependent features to at least one of process-induced variation in the one or more wafer state parameters or variation in electrical parameters.
26. The computer implemented method of claim 25, in which the pattern dependent features include at least one of lines pace, linewidth, and effective density.
27. The computer implemented method of claim 25, in which the one or more wafer state parameters include at least one of film thickness, array height, step height.
28. The computer implemented method of claim 25, in which the electrical parameters include at least one of sheet resistance, capacitance, crosstalk noise, and coupling capacitance.
29. The computer implemented method of claim 25, also including certifying manufacturability of the IC device before mask tape-out and manufacturing.
30. The computer implemented method of claim 1, also including simulating a final electrical performance of the IC before mask tape-out and manufacturing.
31. The computer implemented method of claim 1, also including determining a process flow, among several candidates, for an IC design.
32. The computer implemented method of claim 1, also including varying recipe parameters to characterize pattern dependencies in an IC manufacturing process.
33. The computer implemented method of claim 32, also including processing the recipe at points of a life cycle of the process to characterize process drift.
34. The computer implemented method of claim 33, in which the process drift comprises CMP pad wear or build up on the walls of a plasma reactor.
35. The computer implemented method of claim 1 implemented in software carried on a non-transitory computer accessible storage medium.
36. The computer implemented method of claim 1, also including providing a graphical user interface to permit a user to access results.
37. The computer implemented method of claim 1 used for process synthesis and implemented on a web server.
38. The computer implemented method of claim 1 used for process optimization and implemented on a web server.
39. The computer implemented method of claim 1 implemented on a web server.
40. The computer implemented method of claim 37, 38 or 39, also including generating custom web applications for the web server with respect to different users.
41. The computer implemented method of claim 1, also including identifying post-manufacture faults spatially across a die for one process step or multiple process steps in a flow.
42. The computer implemented method of claim 1, also including receiving, through a web server, manufacturability predictions for the IC using a particular process or tool.
43. The computer implemented method of claim 1, also including using a web server to provide automatically chosen recipe or equipment settings directly to a process tool or flow of process tools or steps.
44. The computer implemented method of claim 1, also including providing an optimization to a user from a web server in response to a single click.
45. The computer implemented method of claim 1, also including using at least an electrical impact analysis with the pattern dependent model to determine the one or more manufacturing recipes and one or more equipment settings.
46. The computer implemented method of claim 1, also including characterizing process drift and shifts over a number of process hours or a number of wafers processed.
47. The computer implemented method of claim 1, also including scheduling maintenance and repair of process tools.
48. The computer implemented method of claim 1, also including selecting consumable sets.
49. The computer implemented method of claim 1, in which the consumable sets include polishing pads, polishing slurries, or gas composition.
50. A system, comprising:
at least one processor that is programmed for performing a process comprising:
using a pattern dependent model to determine one or more manufacturing recipes and one or more equipment settings for a process used to fabricate an integrated circuit (IC), wherein
the one or more manufacturing recipes and the one or more equipment settings reduce process-induced variation in one or more wafer state parameters or electrical performance; and
performing an electrical impact analysis to adjust at least a part of an integrated circuit design of the integrated circuit to reduce an electrical impact that is caused by the process-induced variation or a variation of a feature of the integrated circuit design.
51. The system of claim 50, in which the at least one processor is programmed for performing the process, the process further comprising:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated using at least the pattern dependent model.
52. The system of claim 51, in which the at least one processor is programmed for performing the process, the process further comprising:
using the cost function to compare one set of recipe or one or more equipment settings to another.
53. The system of claim 51, in which the at least one processor is programmed for performing the process, the process further comprising:
using optimization methods to select recipe and equipment settings that minimize variation in wafer-state or one or more electrical parameters.
54. The system of claim 51, in which the at least one processor is programmed for performing the process, the process further comprising:
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in the wafer-state or the one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming.
55. The system of claim 51, in which the at least one processor is programmed for performing the process, the process further comprising:
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in wafer-state or one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming; and
using one or more quadratic cost functions to facilitate convergence of the one or more optimization methods.
56. An article of manufacture comprising a non-transitory computer readable storage medium having stored thereupon a sequence of instructions which, when executed by at least one processor, causes the at least one processor to execute a process, the process comprising:
using the at least one processor that is programmed for performing a process comprising:
using a pattern dependent model to determine one or more manufacturing recipes and one or more equipment settings for a process used to fabricate an integrated circuit (IC), wherein
the one or more manufacturing recipes and the one or more equipment settings reduce process-induced variation in one or more wafer state parameters or electrical performance; and
performing an electrical impact analysis to adjust at least a part of an integrated circuit design of the integrated circuit to reduce an electrical impact that is caused by the process-induced variation or a variation of a feature of the integrated circuit design.
57. The article of manufacture of claim 56, the process further comprising:
using a cost-function to measure results of one or more predictions of variation in wafer state or in one or more electrical parameters generated using at least the pattern dependent model.
58. The article of manufacture of claim 57, the process further comprising:
using the cost function to compare one set of recipe or one or more equipment settings to another.
59. The article of manufacture of claim 57, the process further comprising:
using optimization methods to select recipe and equipment settings that minimize variation in wafer-state or one or more electrical parameters.
60. The article of manufacture of claim 57, the process further comprising:
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in the wafer-state or the one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming.
61. The article of manufacture of claim 57, the process further comprising:
using one or more optimization methods to select recipe and one or more equipment settings that minimize variation in wafer-state or one or more electrical parameters, in which the one or more optimization methods include at least one of simplex, conjugate gradient, simulated annealing, dynamic programming, approximate dynamic programming, linear programming, and approximate linear programming; and
using one or more quadratic cost functions to facilitate convergence of the one or more optimization methods.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A surgical stapler for closing a puncture wound in a liquid carrying vessel, comprising:
a locator tube having proximal and distal ends with a lumen extending through at least a portion thereof for receiving a glide wire;
an expandable member formed on the locator tube and movable between a closed position and an open position; and
a staple applying apparatus slidably disposed on a portion of the locator tube proximal to the expandable member, the staple applying apparatus being adapted to apply a surgical staple to seal a puncture wound in a liquid carrying vessel.
2. The surgical stapler of claim 1, further comprising a guidewire entry port formed in the locator tube distal to the expandable member, and a guidewire exit port formed in the proximal end of the locator tube.
3. The surgical stapler of claim 1, wherein the expandable member comprises an inflatable balloon.
4. The surgical stapler of claim 1, wherein the staple applying apparatus includes a sheath having a staple pusher slidably disposed therein and adapted to push a staple against an anvil disposed within a distal end of the staple applying apparatus, and a staple former slidably disposed around the staple pusher and the anvil and adapted to deform a staple.
5. The surgical stapler of claim 4, wherein the sheath has a distal end that is expandable from a closed position, in which the sheath is adapted to be deployed through a tissue tract, and an open position, in which the sheath is retracted relative to the staple pusher, staple former, and anvil.
6. The surgical stapler of claim 5, wherein the distal end of the sheath includes opposed cut-out portions formed therein to allow the sheath to move between the open and closed positions.
7. The surgical stapler of claim 4, further comprising at least one staple having a central portion with an opening formed therein and disposed around the locator tube, and opposed legs extending distally from opposed ends of the central portion.
8. The surgical stapler of claim 7, wherein, when the staple is pushed against the anvil by the staple pusher, the anvil is adapted to move the legs a distance apart from one another such that the staple is adapted to be deployed into a liquid carrying vessel.
9. The surgical stapler of claim 7, wherein the at least one staple is bioabsorbable.
10. The surgical stapler of claim 9, wherein the at least one staple is formed from a magnesium alloy.
11. The surgical stapler of claim 1, wherein the expandable member is inflatable, and the locator tube includes an inflation lumen formed therein and coupled to a pressure relief valve that is adapted to regulate a pressure within the inflatable expandable member.
12. The surgical stapler of claim 1, wherein the locator tube includes a position indicator that is effective to indicate a position of the expandable member relative to a liquid carrying vessel.
13. The surgical stapler of claim 12, wherein the position indicator comprises a lumen extending through the locator tube and having a distal, blood inlet port formed adjacent to the expandable member, and a proximal, blood outlet port.
14. The surgical stapler of claim 13, wherein the blood inlet port is formed just proximal to the expandable member such that the inlet port will be positioned external to a liquid carrying vessel when the expandable member is positioned against an internal surface of a liquid carrying vessel adjacent puncture wound.
15. A method for closing a puncture wound in a liquid carrying vessel, comprising:
positioning an expandable member within a liquid carrying vessel such that the expandable member abuts an internal wall of the vessel adjacent a puncture wound;
positioning a distal end of a staple applying apparatus adjacent the puncture wound against an external surface of the liquid carrying vessel;
deploying a surgical staple into the liquid carrying vessel such that the staple extends across the puncture wound;
removing the locator tube and expandable member from the liquid carrying vessel; and
deforming the staple to close the puncture wound in the liquid carrying vessel.
16. The method of claim 15, further comprising, prior to the step of positioning an expandable member within a liquid carrying vessel, advancing a locator tube along a tissue tract through a puncture wound in a liquid carrying vessel to position a distal portion of the tube having the expandable member formed thereon within the liquid carrying vessel.
17. The method of claim 16, wherein, after the locator tube is advanced to position the expandable member on the distal portion of the tube within the liquid carrying vessel, the expandable member is opened and the locator tube is retracted until the expandable member abuts the puncture wound in the liquid carrying vessel.
18. The method of claim 16, further comprising observing blood flow through a blood flow lumen formed in the locator tube to confirm a position of the expandable member relative to the liquid carrying vessel.
19. The method of claim 16, wherein the locator tube is advanced along a guide wire positioned through the tissue tract and puncture wound.
20. The method of claim 18, wherein, when the expandable member is opened and the locator tube is retracted until the expandable member abuts the puncture wound in the liquid carrying vessel, blood flow from the proximal end of the locator tube ceases to indicate proper positioning of the expandable member.
21. The method of claim 17, further comprising, prior to the step of deploying a surgical staple, advancing a staple applying apparatus containing the surgical staple along a proximal portion of the locator tube to position a distal end of the staple applying apparatus at the puncture wound adjacent an external surface of the liquid carrying vessel.
22. The method of claim 21, wherein the staple applying apparatus includes a sheath having a staple pusher slidably disposed therein, an anvil disposed distal of the pusher, and a staple former slidably disposed around the staple pusher and the anvil.
23. The method of claim 22, wherein the step of deploying the staple comprises the steps of retracting the sheath, advancing the staple pusher distally to push the staple against the anvil whereby the staple is moved to an open position, and advancing the staple distally to deploy opposed legs of the staple into the liquid carrying vessel.
24. The method of claim 23, wherein the step of deforming the staple comprises the step of advancing the staple former further distally to deform the opposed legs of the staple around the anvil toward one another into a closed position.
25. The method of claim 23, wherein the step of deforming the staple comprises moving the staple former in a forward direction and the pusher in a reverse direction to progressively deform the opposed legs of the staple around the anvil toward one another into a closed position.
26. The method of claim 23, wherein the sheath is in a closed position, such that the sheath surrounds the staple pusher, anvil, staple former, and staple, when the staple applying apparatus is advanced along the locator tube, and wherein the sheath moves to an open position when the sheath is retracted to deploy the staple.
27. The method of claim 16, wherein the expandable member is formed on the locator tube proximal to a distal end of the locator tube.
28. The method of claim 16, wherein the locator tube is advanced along a guide wire that is pre-positioned along the tissue tract through the puncture wound in the liquid carrying vessel.
29. The method of claim 28, wherein the locator tube includes a guidewire inlet port formed in a distal end thereof, and a guidewire outlet port formed proximal to the distal end.
30. The method of claim 29, wherein the guidewire outlet port is formed distal of the inflatable member.
31. The method of claim 15, wherein the expandable member comprises an inflatable member that is coupled to a pressure relief valve that is adapted to regulate a pressure within the inflatable member.
32. A method for closing a puncture wound in a liquid carrying vessel, comprising the steps of:
advancing a locator tube along a tissue tract through a puncture wound in a liquid carrying vessel to position a distal portion of the tube having an inflatable member formed thereon within the liquid carrying blood vessel;
inflating the inflatable member on the locator tube;
retracting the locator tube until the inflatable member abuts the puncture wound in the liquid carrying vessel;
advancing a staple applying apparatus along a proximal portion of the locator tube to position a distal end of the staple applying apparatus at the puncture wound adjacent an external surface of the liquid carrying vessel;
deploying a surgical staple into the liquid carrying vessel such that the staple extends across the puncture wound;
deflating the inflatable member and removing the locator tube from the liquid carrying vessel; and
deforming the staple to close the puncture wound in the liquid carrying vessel.
33. The method of claim 32, wherein the locator tube is advanced along a guide wire that is pre-positioned along the tissue tract through the puncture wound in the liquid carrying vessel.
34. The method of claim 33, wherein the locator tube includes a guidewire inlet port formed in a distal end thereof, and a guidewire outlet port formed proximal to the distal end.
35. The method of claim 34, wherein the guidewire outlet port is formed distal of the inflatable member.
36. A method for closing a puncture wound in a liquid carrying vessel, comprising:
positioning an elongate member through a puncture wound in a liquid carrying vessel;
opening an expandable member formed on a distal portion of the elongate member and positioned within the liquid carrying vessel;
retracting the elongate member until the expandable member formed on the elongate members abuts the puncture wound in the liquid carrying vessel;
advancing a staple applying apparatus along the elongate member;
removing the elongate member from the liquid carrying vessel; and
deploying a surgical staple into the liquid carrying vessel to close the puncture wound.
37. The method of claim 36, wherein the elongate member is positioned through a puncture wound in a liquid carrying vessel by delivering the elongate member over a guide wire that is positioned through the puncture wound in the liquid carrying vessel.
38. The method of claim 36, further comprising, prior to the step of opening an expandable member, viewing blood flow through the elongate member to confirm proper positioning of the expandable member on the distal portion of the elongate member.