1. A keyless shoe lock assembly, comprising:
a shoe for abutting a work piece for at least one of stabilizing a tool, limiting the depth of a cut, and evenly distributing wear on a blade;
a shoe bracket connected to the shoe, for securing the shoe;
a lock plate enmeshed with the shoe bracket, for locking the shoe bracket; and
a pin rotationally disposed of the shoe bracket and lock plate, for forcing the shoe bracket against the lock plate;
wherein one the shoe bracket and the lock plate having a plurality of protrusions and the other of the shoe bracket and the lock plate having plurality of recesses, and
wherein rotation of the pin forces the shoe bracket against the lock plate, providing a plurality of discrete locking positions for the shoe bracket through engagement of the protrusions or recesses of the shoe bracket with the protrusions or recesses of the lock plate.
2. The keyless shoe lock assembly of claim 1, further comprising a lever assembly comprising at least one of a lever, a molded part, and a co-molded part, coupled with the pin for providing mechanical advantage for rotating the pin.
3. The keyless shoe lock assembly of claim 2, wherein the lever assembly comprises a locking device for locking the lever assembly against a tool.
4. The keyless shoe lock assembly of claim 3, wherein the locking device comprises at least one of an interference protrusion, a plurality of teeth, a plurality of grooves, or a friction interface for locking the lever assembly against a tool.
5. The keyless shoe lock assembly of claim 1, wherein at least one of the shoe bracket and the lock plate include anti-lock protrusions for preventing rotation of the pin while the shoe bracket is disposed in a position undesirable for locking.
6. A keyless shoe lock assembly, comprising:
a shoe for abutting a work piece for at least one of stabilizing a tool, limiting the depth of a cut, and evenly distributing wear on a blade;
a shoe bracket connected to the shoe, for securing the shoe and having a friction interface;
a lock plate enmeshed with the shoe bracket, for locking the shoe bracket and having a friction interface for engaging with the friction interface of the shoe bracket; and
a pin rotationally disposed of the shoe bracket and lock plate, for forcing the shoe bracket against the lock plate;
wherein rotation of the pin forces the shoe bracket against the lock plate, providing a plurality of discrete locking positions for the shoe bracket through engagement of the friction interface of the shoe bracket and the friction interface of the lock plate.
7. The keyless shoe lock assembly of claim 6, further comprising a lever assembly comprising at least one of a lever, a molded part, and a co-molded part, coupled with the pin for providing mechanical advantage for rotating the pin.
8. The keyless shoe lock assembly of claim 7, wherein the lever assembly comprises a locking device for locking the lever assembly against a tool.
9. The keyless shoe lock assembly of claim 8, wherein locking device comprises at least one of an interference protrusion, a plurality of teeth, a plurality of grooves, or a friction interface for locking the lever assembly against a tool.
10. The keyless shoe lock assembly of claim 7, wherein at least one of the shoe bracket and the lock plate include anti-lock protrusions for preventing rotation of the pin while the shoe bracket is disposed in a position undesirable for locking.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An Electronic Module comprising
a body case that comprises a plurality of case members by making an abutting contact each other and that has an internal space where a first opening is formed on one side surface of the internal space and a second opening that opens in a direction different from that of the first opening is in an exposed state when a plurality of the case members are separated each other,
a substrate on which an electronic component is mounted and that is housed in the internal space of the body case, and
a resin body that covers the substrate by being filled into the internal space of the body case and being solidified or hardened, and characterized by that
the plurality of case members and the substrate are integrated by the use of the resin body as an accouplement.
2. The Electronic Module described in claim 1, and characterized by that
a connecting part to give and receive an electronic signal to and from the outside is arranged on at least one of the case members and the connecting part and the substrate are electrically connected.
3. The Electronic Module described in claim 1, and characterized by
a fixing part to fix the body cases to the outside is arranged on at least one of the case members.
4. The Electronic Module described in claim 2, and characterized by
a fixing part to fix the body cases to the outside is arranged on at least one of the case members.
5. The Electronic Module described in claim 1, and characterized by
at least one of the case members is formed with an elastic material and the second opening is sealed by inserting the case member made of the elastic material into inside of the other case member.
6. The Electronic Module described in claim 2, and characterized by
at least one of the case members is formed with an elastic material and the second opening is sealed by inserting the case member made of the elastic material into inside of the other case member.
7. The Electronic Module described in claim 3, and characterized by
at least one of the case members is formed with an elastic material and the second opening is sealed by inserting the case member made of the elastic material into inside of the other case member.
8. The Electronic Module described in claim 4, and characterized by
at least one of the case members is formed with an elastic material and the second opening is sealed by inserting the case member made of the elastic material into inside of the other case member.
9. The Electronic Module described in claim 1, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
10. The Electronic Module described in claim 2, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
11. The Electronic Module described in claim 3, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
12. The Electronic Module described in claim 4, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
13. The Electronic Module described in claim 5, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
14. The Electronic Module described in claim 6, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
15. The Electronic Module described in claim 7, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
16. The Electronic Module described in claim 8, and characterized by
a concave part in a direction crossing a direction in which the case members can be separated each other prior to filling the resin body is formed on an inner surface of at least one of the case members constituting a wall surface of the internal space in the body case.
17. A method for manufacturing an Electronic Module characterized by including
a step, wherein a body case that has an internal space on one surface of which a first opening is formed and that comprises a plurality of case members is in a state that a second opening that opens in a direction different from a first opening is in an exposed state by separating a plurality of the case members, to insert a substrate into the internal space of the body case,
a step to seal the second opening by combining a plurality of the case members,
a step to fill a resin body in a liquid state or in a softened state into the internal space through the first opening, and
a step to solidify or harden the resin body.