1. A window arrangement for an aircraft, wherein the window arrangement comprises:
a window area;
at least one first installation element serving as fluid conveyance line;
wherein the at least one first installation element includes a duct configured to convey fluids from an aircraft cabin floor via a fluid inlet to an aircraft fuselage roof via a fluid outlet;
wherein the at least one first installation element comprises a transparent region;
wherein the transparent region covers at least part of at least a first window region such that light waves in the visible spectrum can be let through; and
wherein the duct and the transparent region are placed one above the other such that the transparent region extends across a region of the fluid conveyance line.
2. The window arrangement of claim 1, further comprising
at least one second installation element,
wherein the at least one second installation element comprises a transparent region; and
wherein the transparent region of the at least one second installation element covers the at least one first window region in such a way that light waves in the visible spectrum can be let through.
3. The window arrangement of claim 2,
wherein the at least one second installation element is at least one installation element selected from a group consisting of ribs, braces and supporting structures.
4. The window arrangement of claim 2, wherein the at least one second installation element is designed for lining a cabin interior.
5. The window arrangement of claim 2, wherein the at least one first installation element comprises transparent current conductors.
6. The window arrangement of claim 2, wherein the at least one first installation element in its transparent region comprises vent holes for venting the first window region.
7. The window arrangement of claim 2, further comprising:
a second window region,
wherein the transparent region of the first installation element extends between the first window region and the second window region.
8. The window arrangement claim 2, wherein the at least one second installation element comprises transparent current conductors.
9. The window arrangement of claim 2, wherein the at least one first installation element comprises optical wave guides for transmitting signals.
10. The window arrangement of claim 2, wherein the at least one second installation element comprises optical wave guides for transmitting signals.
11. The window arrangement of claim 2, further comprising:
a second window region,
wherein the transparent region of the second installation extends between the first window region and the second window region.
12. The window arrangement of claim 1, further comprising the at least one first window region that is affixed to an aircraft skin in such a way that the interior of the aircraft is insulated, thermally and stably when subjected to pressure, from an exterior atmosphere.
13. The window arrangement of claim 1, wherein the at least one first window region is integrally and in one piece designed with the transparent region of the at least one first installation element.
14. The window arrangement of claim 1, further comprising the at least one first window region that is in an aircraft skin in such a way that the interior of the aircraft is insulated, thermally and stably when subjected to pressure, from an exterior atmosphere.
15. The window arrangement of claim 1, wherein the at least one first window region is integrally and in one piece designed with the transparent region of the at least one second transparent installation element.
16. A method for enlarging a window area of an aircraft, wherein the method comprises:
installation of at least one first installation element serving as fluid conveyance line and including a duct configured for conveying fluids from an aircraft cabin floor via a fluid inlet to an aircraft fuselage roof via a fluid outlet, the at least one first installation element comprises a transparent region;
placing the duct and the transparent region one above the other such that the transparent region extends across a region of the fluid conveyance line; and
covering at least part of at least one first window region with the transparent region such that light waves in the visible spectrum can be let through.
17. An aircraft comprising:
a cabin floor;
a fuselage roof; and
a window arrangement, the window arrangement comprising:
a window area
at least one first installation element serving as fluid conveyance line;
wherein the at least one first installation element includes a duct configured to convey fluids from an aircraft cabin floor via a fluid inlet to an aircraft fuselage roof via a fluid outlet;
wherein the at least one first installation element comprises a transparent region;
wherein the transparent region covers at least part of at least a first window region such that light waves in the visible spectrum can be let through; and
wherein the duct and the transparent region are placed one above the other such that the transparent region extends across a region of the fluid conveyance line.
18. The aircraft of claim 17, further comprising:
at least one second installation element,
wherein the at least one second installation element comprises a transparent region; and
wherein the transparent region of the at least one second installation element covers the at least one first window region in such a way that light waves in the visible spectrum can be let through.
19. The aircraft of claim 18, wherein the at least one second installation element is at least one installation element selected from a group consisting of ribs, braces and supporting structures.
20. The aircraft of claim 18, wherein the at least one second installation element is designed for lining a cabin interior.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor packaging structure, comprising:
a baseboard;
a thermal conductor located on the baseboard;
at least one semiconductor chip set mounted onto the thermal conductor;
a plurality of conductive blades located on the bottom of the baseboard connecting electrically to the semiconductor chip set through a plurality of conductive leads; a package encasing the semiconductor chip set; and
a heat sink coupling with the thermal conductor to perform heat exchange for heat energy generated by the semiconductor chip set and transferred through the thermal conductor.
2. The semiconductor packaging structure of claim 1, wherein the semiconductor chip set is a light emitting diode.
3. The semiconductor packaging structure of claim 1, wherein the semiconductor chip set is a laser diode.
4. The semiconductor packaging structure of claim 1, wherein the heat sink has a reflective portion corresponding to the semiconductor chip set.
5. The semiconductor packaging structure of claim 4, wherein the reflective portion has a reflective layer on the surface thereof.
6. The semiconductor packaging structure of claim 1 further having a plurality of thermal conductive struts running through the baseboard to couple with at least one second heat sink on a lower side thereof.
7. An optoelectric semiconductor packaging structure, comprising:
a baseboard;
a thermal conductor located on the baseboard;
at least one optoelectric semiconductor chip set mounted onto the thermal conductor;
a plurality of conductive blades located on the bottom of the baseboard connecting electrically to the semiconductor chip set through a plurality of conductive leads;
a package encasing the optoelectric semiconductor chip set; and
a heat sink coupling with the thermal conductor and having a reflective portion corresponding to the optoelectric semiconductor chip set to perform heat exchange for heat energy generated by the optoelectric semiconductor chip set and transferred through the thermal conductor, light generated by the optoelectric semiconductor chip set being projected outwards by the reflective portion.
8. The semiconductor packaging structure of claim 7, wherein the optoelectric semiconductor chip set is a light emitting diode.
9. The semiconductor packaging structure of claim 7, wherein the optoelectric semiconductor chip set is a laser diode.
10. The semiconductor packaging structure of claim 7, wherein the reflective portion has a reflective layer on the surface thereof.
11. The semiconductor packaging structure of claim 7 further having a plurality of thermal conductive struts running through the baseboard to couple at least one second heat sink on a lower side thereof.