1. An uncured thermoplastic-toughened epoxy resin which, when cured, is resistant to solvent-induced cracking, said uncured thermoplastic-toughened epoxy resin comprising:
an epoxy resin component comprising from 30 to 40 weight percent of a tri functional epoxy resin and from 10 to 20 weight percent of a tetra functional epoxy resin, based on the total weight of said uncured thermoplastic-toughened epoxy resin;
a thermoplastic component comprising from 10 to 20 weight percent of a low molecular weight polyethersulfone, from 5 to 15 weight percent of polyamideimide and from 1 to 5 weight percent of polyamide particles, based on the total weight of said uncured thermoplastic-toughened epoxy resin, wherein the molecular weight of said low molecular weight polyethersulfone is between 10,000 and 30,000 gmole and wherein the amount of said low molecular weight polyethersulfone in said thermoplastic component is sufficient to provide said uncured thermoplastic-toughened epoxy resin, when cured, with said resistance to solvent-induced cracking; and
a curative component comprising from 15 to 25 weight percent of a curing agent, based on the total weight of said uncured thermoplastic-toughened epoxy resin.
2. An uncured thermoplastic-toughened epoxy resin according to claim 1 which comprises:
an epoxy resin component comprising from 32 to 36 weight percent of said tri functional epoxy resin and from 14 to 26 weight percent of said tetra functional epoxy resin, based on the total weight of said uncured thermoplastic-toughened epoxy resin;
a thermoplastic component comprising from 13 to 16 weight percent of a low molecular weight polyethersulfone, from 9 to 11 weight percent of polyamideimide and from 2 to 4 weight percent of polyamide particles, based on the total weight of said uncured thermoplastic-toughened epoxy resin, wherein the amount of polyethersulfone in said thermoplastic component is sufficient to provide said uncured thermoplastic-toughened epoxy resin, when cured, with said resistance to solvent-induced cracking; and
a curative component comprising from 18 to 20 weight percent of a curing agent, based on the total weight of said uncured thermoplastic-toughened epoxy resin.
3. An uncured thermoplastic-toughened epoxy resin according to claim 1 which comprises an elastic particle component comprising from 5 to 9 weight percent polyurethane particles, based on the total weight of said uncured thermoplastic-toughened epoxy resin.
4. An uncured thermoplastic-toughened epoxy resin according to claim 2 which comprises an elastic particle component comprising from 5 to 9 weight percent polyurethane particles, based on the total weight of said uncured thermoplastic-toughened epoxy resin.
5. An uncured thermoplastic-toughened epoxy resin according to claim 1 wherein said tri functional epoxy resin is a tri functional meta-glycidyl amine.
6. An uncured thermoplastic-toughened epoxy resin according to claim 2 wherein said tri functional epoxy resin is a tri functional meta-glycidyl amine.
7. An uncured thermoplastic-toughened epoxy resin according to claim 5 wherein said tetra functional epoxy resin is a tetra functional para-glycidyl amine.
8. An uncured thermoplastic-toughened epoxy resin according to claim 6 wherein said tetra functional epoxy resin is a tetra functional para-glycidyl amine.
9. An uncured thermoplastic-toughened epoxy resin according to claim 1 wherein the molecular weight of said low molecular weight polyethersulfone is between 15,000 and 25,000 gmole.
10. An uncured thermoplastic-toughened epoxy resin according to claim 1 wherein the molecular weight of said low molecular weight polyethersulfone is between 15,000 and 25,000 gmole.
11. An uncured thermoplastic-toughened epoxy composite material comprising an uncured thermoplastic-toughened epoxy resin according to claim 1 and a fiber reinforcement.
12. A composite part comprising an uncured thermoplastic-toughened epoxy composite material according to claim 11 wherein said uncured thermoplastic-toughened epoxy resin has been cured.
13. A composite part according to claim 12 wherein said composite part forms at least part of a primary structure of an aircraft.
14. A method for making a prepreg, said method comprising the steps of:
providing an uncured thermoplastic-toughened epoxy resin according to claim 1; and
combining said uncured thermoplastic-toughened epoxy resin with a fibrous reinforcement to provide said prepreg.
15. A method for making a prepreg according to claim 14 wherein said uncured thermoplastic-toughened epoxy resin comprises an elastic particle component comprising from 5 to 9 weight percent polyurethane particles, based on the total weight of said uncured thermoplastic-toughened epoxy resin.
16. A method for making a prepreg according to claim 14 wherein said tri functional epoxy resin is a tri functional meta-glycidyl amine.
17. A method for making a prepreg according to claim 16 wherein said tetra functional epoxy resin is a tetra functional para-glycidyl amine.
18. A method for making a prepreg according to claim 14 wherein the molecular weight of said low molecular weight polyethersulfone is between 15,000 and 25,000 gmole.
19. A method for making a composite part which includes the method for making a prepreg according to claim 14 and the additional step of curing said uncured thermoplastic-toughened epoxy resin to form said composite part.
20. A method for making a composite part according to claim 19 wherein said composite part forms at least part of a primary structure of an aircraft.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A thin film magnetic head, comprising:
a magnetic transducer film being disposed so that an end surface thereof faces a recording medium, and detecting a signal magnetic field from the recording medium; and
a heat dissipation layer being disposed adjacent to the magnetic transducer film on a side, the side being opposite to a side facing the recording medium, and transferring heat generated in the magnetic transducer film to outside.
2. A thin film magnetic head according to claim 1, further comprising:
an insulating layer between the magnetic transducer film and the heat dissipation layer.
3. A thin film magnetic head according to claim 2, wherein
the heat dissipation layer is made of a material with a higher thermal conductivity than that of the insulating layer.
4. A thin film magnetic head according to claim 1, wherein
the heat dissipation layer is made of a non-magnetic metallic material.
5. A thin film magnetic head according to claim 1, wherein
the heat dissipation layer includes at least one selected from the group consisting of silver (Ag), aluminum (Al), gold (Au), beryllium (Be), bismuth (Bi), cobalt (Co), chromium (Cr), copper (Cu), iron (Fe), indium (In), iridium (Ir), magnesium (Mg), manganese (Mn), molybdenum (Mo), niobium (Nb), nickel (Ni), palladium (Pd), platinum (Pt), rhenium (Re), antimony (Sb), selenium (Se), tantalum (Ta), tellurium (Te), thorium (Th), titanium (Ti), thallium (Tl), vanadium (V), tungsten (W), yttrium (Y) and zirconium (Zr).
6. A thin film magnetic head according to claim 1, wherein
the heat dissipation layer is disposed adjacent to the magnetic transducer film so as to have a thickness corresponding to at least half of the thickness of the magnetic transducer film.
7. A thin film magnetic head according to claim 1, further comprising:
a pair of shield layers being disposed so as to face each other with the magnetic transducer film in between in a laminated direction, and magnetically shielding the magnetic transducer film; and
a pair of gap layers being disposed between the magnetic transducer film and the pair of shield layers, and electrically insulating between the magnetic transducer film and the pair of shield layers.
8. A thin film magnetic head according to claim 7, wherein
a distance between the heat dissipation layer and each of the pair of shield layers is 2 nm or over.
9. A thin film magnetic head according to claim 7, wherein
the insulating layer is made of the same material as that of the pair of gap layers.
10. A thin film magnetic head according to claim 2, wherein
a portion of the insulating layer in contact with an end surface of the magnetic transducer film on a side, the side being opposite to a side facing the recording medium has a thickness ranging from 2 nm to 30 nm inclusive.
11. A thin film magnetic head, comprising:
a magnetic transducer film being disposed so that an end surface thereof faces a recording medium, and detecting a signal magnetic field from the recording medium;
a pair of shield layers being disposed so as to surround an end surface of the magnetic transducer film on a side opposite to the end surface thereof, and film surfaces of the magnetic transducer film facing each other, and magnetically shielding the magnetic transducer film; and
a gap layer being disposed between the magnetic transducer film and the pair of shield layers, and electrically insulating therebetween,
wherein a portion of the gap layer in contact with the end surface of the magnetic transducer film on a side, the side being opposite to a side facing the recording medium has a thickness ranging from 2 nm to 30 nm inclusive.
12. A thin film magnetic head according to claim 11, wherein
the pair of shield layers occupy a space corresponding to at least half of the thickness of the magnetic transducer film, and have a distance of at least 2 nm therebetween.
13. A method of manufacturing a thin film magnetic head, the thin film magnetic head comprising a magnetic transducer film being disposed so that an end surface thereof faces a recording medium, and detecting a signal magnetic field from the recording medium, the method comprising the steps of:
forming the magnetic transducer film; and
forming a heat dissipation layer for transferring heat generated in the magnetic transducer film to outside so as to be disposed adjacent to the magnetic transducer film on a side, the side being opposite to a side facing the recording medium.
14. A method of manufacturing a thin film magnetic head according to claim 13, further comprising the step of:
forming an insulating layer between the magnetic transducer film and the heat dissipation layer.
15. A method of manufacturing a thin film magnetic head according to claim 14, wherein
in the step of forming the heat dissipation layer, the heat dissipation layer is made of a material with a higher thermal conductivity than that of the insulating layer.
16. A method of manufacturing a thin film magnetic head according to claim 13, wherein
in the step of forming the heat dissipation layer, the heat dissipation layer is made of a non-magnetic metallic material.
17. A method of manufacturing a thin film magnetic head according to claim 13, wherein
in the step of forming the heat dissipation layer, the heat dissipation layer is formed so as to include at least one selected from the group consisting of silver (Ag), aluminum (Al), gold (Au), beryllium (Be), bismuth (Bi), cobalt (Co), chromium (Cr), copper (Cu), iron (Fe), indium (In), iridium (Ir), magnesium (Mg), manganese (Mn), molybdenum (Mo), niobium (Nb), nickel (Ni), palladium (Pd), platinum (Pt), rhenium (Re), antimony (Sb), selenium (Se), tantalum (Ta), tellurium (Te), thorium (Th), titanium (Ti), thallium (Ti), vanadium (V), tungsten (W), yttrium (Y) and zirconium (Zr).
18. A method of manufacturing a thin film magnetic head according to claim 13, wherein
in the step of forming the heat dissipation layer, the thickness of the heat dissipation layer is half or more of the thickness of the magnetic transducer film.
19. A method of manufacturing a thin film magnetic head according to claim 13, further comprising the steps of:
forming a pair of shield layers for magnetically shielding the magnetic transducer film so as to face each other with the magnetic transducer film in between; and
forming a pair of gap layers for electrically insulating between the magnetic transducer film and the pair of shield layers so as to be disposed between the magnetic transducer film and the pair of shield layers.
20. A method of manufacturing a thin film magnetic head according to claim 19, wherein
in the step of forming the pair of shield layers, a distance between the heat dissipation layer and each of the pair of shield layers is 2 nm or over.
21. A method of manufacturing a thin film magnetic head according to claim 19, wherein
in the step of forming the insulating layer, the insulating layer is made of the same material as that of the pair of gap layers.
22. A method of manufacturing a thin film magnetic head according to claim 14, wherein
in the step of forming the insulating layer, the insulating layer is formed so that a portion of the insulating layer in contact with at least an end surface of the magnetic transducer film on a side, the side being opposite to a side facing the recording medium has a thickness ranging from 2 nm to 30 nm inclusive.
23. A method of manufacturing a thin film magnetic head, the thin film magnetic head comprising a magnetic transducer film being disposed so that an end surface thereof faces a recording medium, and detecting a signal magnetic field from the recording medium, a pair of shield layers magnetically shielding the magnetic transducer film, and a gap layer electrically insulating between the magnetic transducer film and the pair of shield layers, the method comprising the steps of:
forming the magnetic transducer film;
forming the pair of shield layers so as to surround an end surface of the magnetic transducer film on a side opposite to the end surface thereof, and film surfaces of the magnetic transducer film facing each other; and
forming the gap layer between the magnetic transducer film and the pair of shield layers so that a portion of the gap layer in contact with the end surface of the magnetic transducer film on a side, the side being opposite to a side facing the recording medium has a thickness ranging from 2 nm to 30 nm inclusive.
24. A method of manufacturing a thin film magnetic head according to claim 23, wherein
in the step of forming the pair of shield layers, the pair of shield layers occupy a space corresponding to at least half of the thickness of the magnetic transducer film, and has a distance of at least 2 nm therebetween.
25. A magnetic disk drive, comprising:
a recording medium; and
a thin film magnetic head,
wherein the thin film magnetic head comprises:
a magnetic transducer film being disposed so that an end surface thereof faces the recording medium, and detecting a signal magnetic field from the recording medium, and
a heat dissipation layer being disposed adjacent to the magnetic transducer film on a side, the side being opposite to a side facing the recording medium, and transferring heat generated in the magnetic transducer film to outside.
26. A magnetic disk drive, comprising:
a recording medium; and
a thin film magnetic head,
wherein the thin film magnetic head comprises:
a magnetic transducer film being disposed so that an end surface thereof faces the recording medium, and detecting a signal magnetic field from the recording medium,
a pair of shield layers being disposed so as to surround an end surface of the magnetic transducer film on a side opposite to the end surface thereof, and film surfaces of the magnetic transducer film facing each other, and magnetically shielding the magnetic transducer film, and
a gap layer being disposed between the magnetic transducer film and the pair of shield layers, and electrically insulating therebetween,
wherein a portion of the gap layer in contact with the end surface of the magnetic transducer film on a side, the side being opposite to a side facing the recording medium has a thickness ranging from 2 nm to 30 nm inclusive.