1. A semiconductor chip comprising:
a substrate including an inner semiconductor circuit;
a conductive redistribution structure formed on the substrate including a conductive redistribution interconnection and a conductive redistribution via plug, wherein the redistribution via plug is connected to the inner semiconductor circuit; a conductive chip pad formed on the substrate; and
a conductive chip via plug configured to penetrate the substrate and electrically connected to the redistribution structure.
2. The semiconductor chip of claim 1, wherein the chip via plug is aligned with the chip pad.
3. The semiconductor chip of claim 1, wherein the chip via plug is electrically connected to the chip pad.
4. The semiconductor chip of claim 1, wherein the chip via plug is electrically connected to the redistribution structure.
5. The semiconductor chip of claim 1, wherein the chip via plug comprises:
a chip via hole configured to penetrate the semiconductor substrate;
a sidewall barrier layer formed on a sidewall of the chip via hole; and
a conductive plug on the sidewall barrier layer configured to fill the chip via hole.
6. The semiconductor chip of claim 5, wherein the sidewall barrier layer is formed of an insulating material.
7. The semiconductor chip of claim 1, wherein the chip pad is disposed on the center portion of a top surface of the substrate.
8. The semiconductor chip of claim 1, further comprising:
a pad insulating layer between the redistribution structure and the chip pad.
9. The semiconductor chip of claim 1, further comprising:
a passivation layer formed below the substrate.
10. The semiconductor chip of claim 1, wherein the chip via plug corresponds to a supply voltage node of the semiconductor chip.
11. The semiconductor chip of claim 1, further comprising:
a conductive inner circuit interconnection pad between the inner semiconductor circuit and the redistribution via plug.
12. The semiconductor chip of claim 11, wherein the chip via plug is electrically connected to one or more inner circuit interconnection pads.
13. A semiconductor chip comprising:
a substrate including an inner semiconductor circuit;
a conductive redistribution structure formed on a surface of the substrate and electrically connected to the inner semiconductor circuit through a conductive redistribution via plug; and
a conductive chip via plug penetrating the substrate, the chip via plug connected to the redistribution structure.
14. The semiconductor chip of claim 17, further comprising:
an interconnection pad between the inner semiconductor circuit and the redistribution via plug, the interconnection pad is electrically connected to the inner semiconductor circuit and the redistribution via plug.
15. A semiconductor stack, comprising:
a first semiconductor chip; and
a second semiconductor chip stacked on the first semiconductor chip,
wherein each of the semiconductor chips comprises:
a substrate including an inner semiconductor circuit;
a conductive redistribution structure formed on the substrate including a conductive redistribution interconnection and a conductive redistribution via plug, wherein the redistribution via plug is connected to the inner semiconductor circuit;
a conductive chip pad formed on the substrate; and
a conductive chip via plug configured to penetrate the substrate and electrically connected to the redistribution structure,
wherein the chip via plug and the chip pad are aligned each other,
wherein the chip via plug of the first semiconductor chip is electrically connected to the chip via plug of the second semiconductor chip.
16. The semiconductor stack of claim 15, wherein the second semiconductor chip further comprises a connection bump pad formed below the chip via plug, and the connection bump pad is electrically connected to the chip via plug of the first semiconductor chip.
17. The semiconductor stack of claim 15, wherein the redistribution structure of the first semiconductor chip is partially exposed, and the exposed part of the redistribution structure of the first semiconductor chip is electrically connected to the chip via plug of the second semiconductor chip.
18. A semiconductor device package comprising:
a first semiconductor chip disposed on a package substrate; and
a second semiconductor chip stacked on the first semiconductor chip,
wherein each of the semiconductor chips comprises:
a substrate including an inner semiconductor circuit;
a conductive redistribution structure formed on the substrate including a conductive redistribution interconnection and a conductive redistribution via plug, wherein the redistribution via plug is connected to the inner semiconductor circuit;
a conductive chip pad formed on the substrate; and
a conductive chip via plug configured to penetrate the substrate and to electrically connect to the redistribution structure,
wherein the chip via plug of the first semiconductor chip is electrically connected to the chip via plug of the second semiconductor chip, and the chip via plug of the first semiconductor chip is electrically connected to a package substrate pad of the package substrate.
19. An electronic apparatus comprising:
a function unit to perform a function thereof; and
an semiconductor chip connected to the function unit to control the function, and comprising:
a substrate including an inner semiconductor circuit,
a conductive redistribution structure formed on a surface of the substrate and electrically connected to the inner semiconductor circuit through a conductive redistribution via plug, and
a chip via plug penetrating the substrate, the chip via plug connected to the redistribution structure,
wherein one of the chip via plug and the redistribution structure is electrically connected to the function unit.
20. The electronic apparatus of claim 19, wherein the chip via plug is aligned to the input output pad.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A motion detecting device for generating a motion vector in image data to be encoded, comprising:
an overall motion information generator configured to generate overall motion information indicative of overall motion of an image specified by said image data; and
a search region variable-shaped motion detector configured to determine a search shape as a determined search shape based on said overall motion information and to set a search region having an area determined by said determined search shape and operational capability of said search region variable-shaped motion detector, and to perform a comparison operation in said search region between current image data and reference image data in said image data, thereby generating a motion vector, wherein
said determined search shape varies at a predetermined timing as said overall motion information varies.
2. The motion detecting device according to claim 1, wherein
said overall motion information includes control information of an image capturing part for capturing an image to obtain said image data.
3. The motion detecting device according to claim 2, wherein
said control information includes at least one of a moving direction, an angular speed and a focal length of said image capturing part.
4. The motion detecting device according to claim 1, wherein
said overall motion information generator generates said overall motion information based on motion vector related information including a plurality of motion vectors corresponding to said image data in a predetermined unit and evaluation values of said plurality of motion vectors.
5. The motion detecting device according to claim 4, wherein
said overall motion information generator obtains a distribution value of said plurality of motion vectors and judges reliability of said distribution value based on said motion vector related information, thereby generating said overall motion information indicative of a motion in a direction where said distribution value is high when said reliability is high and indicative of a motion in a direction where said distribution value is low when said reliability is low.
6. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector selects one of various types of rectangular search shapes as said determined search shape.
7. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector selects one of various types of rhombus search shapes as said determined search shapes.
8. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector selects one of various types of parallelogrammic search shapes as said determined search shape.
9. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector selects one of various types of basic shapes including at least two of rectangle, rhombus and parallelogram as said determined search shape.
10. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector is capable of determining one of various types of search shapes having different search accuracies as said determined search shape.
11. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector changes an extending direction of said search region with respect to a predetermined reference point at said predetermined timing.
12. The motion detecting device according to claim 1, wherein
said predetermined timing includes a unit of picture of said image data.
13. The motion detecting device according to claim 1, wherein
said predetermined timing includes a unit of slice of said image data.
14. The motion detecting device according to claim 1, wherein
said predetermined timing includes a unit of macroblock of said image data.
15. The motion detecting device according to claim 1, wherein
said search region includes a search region formed on a macroblock basis.
16. The motion detecting device according to claim 1, wherein
said search region variable-shaped motion detector is provided within a video encoding device.
17. A search region variable-shaped motion detector for detecting a motion vector in image data to be encoded, comprising:
a search region shape control part configured to receive overall motion information indicative of overall motion of an image and to determine a search shape as a determined search shape based on said overall motion information and to set a search region having an area determined by said determined search shape and predetermined operational capability, and to output a selection signal for selecting, by a predetermined unit, at least one of current image and reference image in said image data in accordance with said search region; and
a motion detecting part configured to perform a comparison operation between said reference image and said current image in said image data based on said selection signal, thereby detecting said motion vector, wherein
said predetermined operational capability includes operational capability of said motion detecting part.