1. A track-tightening device for crawlers, comprising an undercarriage or bogie consisting of a structure (20) which includes elements (21) for carrying a plurality of fixed lower supporting rollers (2), as well as idler back-pull wheels (11) and optionally a crawler wheel, said structure (20) also housing a guide system (25) for controlled axial sliding of the track-tightening device (5) carried by a second movable structure (8), said second movable structure (8) being equipped with fittings (26) which interconnect with the guide system (25), said second movable structure (8) having an idler wheel (3) as well as at least one movable supporting roller (22) capable of following the longitudinal movement of the idler wheel (3), the structure (20) and the second movable structure interact by way of a guide (25) and fittings (26) to modify the wheel base between the idler wheel (3) and the back pull wheel (11) of the bogie by axial sliding, wherein the structure (20) is box shaped and where at least one of said movable lower supporting rollers (22) is in constant contact with the idler wheel (3) so that their reciprocal distance does not vary during the operating life of the vehicle, under any operating condition and with any range of the track-tightening device, said movable lower supporting roller (22) being attached to said second movable structure (8) so that the length of a section of track situated between the axis of the idler wheel (3) and the axis of said movable lower supporting roller (22), is constant and at a minimum value during the functioning of the crawler under all conditions.
2. The track-tightening device for crawlers according to claim 1, wherein the second movable structure (8) carries two or more movable supporting rollers (22).
3. The track-tightening device for crawlers according to claim 1, wherein the idler wheel (3) is installed on the bogie in a front position.
4. The track-tightening device for crawlers according to claim 1, wherein the movable supporting rollers have the same structure and dimensions as the fixed lower supporting rollers (2).
5. The track-tightening device for crawlers according to claim 1, wherein the track tightening device (5) is activated with a tightenershock absorber group (30) which comprises a helicoidal spring (36) possessing a fixed shoulder (34), said helicoidal spring operates in extension, and a chamber (38) filled with the injection of a lubricant which acts as an adjustable run end and tightener of the chain (1) of the track.
6. The track-tightening device far crawlers according to claim 5, wherein the tightenershock absorber group (30) comprises calibration means of the longitudinal position of the fixed shoulder (34) of the helicoidal spring (36) with respect to the structure (20) of the undercarriage.
7. The track-tightening device for crawlers according to claim 5, wherein the tightenershock absorber group (30) comprises a cylindrical telescopic guide (3132) coaxial with the helicoidal spring (36) and with the lubricant injection chamber (38).
8. The track-tightening device for crawlers according to claim 5, wherein the tightenershock absorber group (30) is comprised of the helicoidal spring (36) and with the lubricant injection chamber (38) separate and arranged in series on the same axis.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-4. (canceled)
5. A substrate wherein the a composition comprising:
a) electrically conductive silver powder;
b) zinc-containing additive;
c) one or more glass frits wherein said glass fits are lead-free, wherein the one or more glass fits comprise, in weight percent based on the total glass composition:
SiO2 4-4.5
Al2O3 0.5-0.7,
B2O3 9-11,
CaO 0.4-0.6,
ZnO 11-14,
Na2O 0.7-1.1,
Bi2O3 56-67, and
BiF3 4-13; dispersed in
d) organic medium
has been deposited thereon and wherein said composition has been processed to remove said organic medium and sinter said glass frit and silver powder.
6. An electrode formed from a composition comprising:
a) electrically conductive silver powder;
b) zinc-containing additive;
c) one or more glass frits wherein said glass fits are lead-free, wherein the one or more glass fits comprise, in weight percent based on the total glass composition:
SiO2 4-4.5
Al2O3 0.5-0.7,
B2O3 9-11,
CaO 0.4-0.6,
ZnO 11-14,
Na2O 0.7-1.1,
Bi2O3 56-67, and
BiF3 4-13; dispersed in
d) organic medium
wherein said composition has been fired to remove the organic vehicle and sinter said glass particles.
7. A method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film a thick film composition comprising:
a) electrically conductive silver powder;
b) zinc-containing additive;
c) one or more glass frits wherein said glass frits are lead-free, wherein the one or more glass frits comprise, in weight percent based on the total glass composition:
SiO2 4-4.5
Al2O3 0.5-0.7,
B2O3 9-11,
CaO 0.4-0.6,
ZnO 11-14,
Na2O 0.7-1.1,
Bi2O3 56-67, and
BiF3 4-13; dispersed in
d) organic medium
and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.
8. The method of claim 7, wherein the insulating film is selected from the group comprising silicon nitride film, titanium oxide film, SiNx:H film, silicon oxide film and a silicon oxidetitanium oxide film.
9. A semiconductor device formed by the method of claim 7.
10. A semiconductor device formed from the composition comprising:
a) electrically conductive silver powder;
b) zinc-containing additive;
c) one or more glass frits wherein said glass frits are lead-free, wherein the one or more glass frits comprise, in weight percent based on the total glass composition:
SiO2 4-4.5
Al2O3 0.5-0.7,
B2O3 9-11,
CaO 0.4-0.6,
ZnO 11-14,
Na2O 0.7-1.1,
Bi2O3 56-67, and
BiF3 4-13; dispersed in
d) organic medium
wherein said composition has been processed to remove said organic medium and sinter said glass frit and silver powder.
11. (canceled)
12. A composition comprising:
(a) a thick film composition comprising:
a) an electrically conductive silver powder;
b) one or more glass frits wherein said glass frits are lead-free; dispersed in
c) an organic medium;
(b) an insulating film
wherein the thick film composition is formed on the insulating film, and wherein, upon firing, the insulating film is penetrated by components of the thick film composition and the organic medium is removed.
13. (canceled)
14. The composition of claim 12, wherein the insulating film comprises one component selected from: titanium oxide, silicon nitride, SiNx:H, silicon oxide, and silicon oxidetitanium oxide.
15. The composition of claim 12, wherein the composition further comprises a semiconductor substrate, and wherein the insulating film is formed on the semiconductor substrate.
16. The composition of claim 15, wherein the composition further comprises a back electrode.
17. A semiconductor device, comprising the composition of claim 15, wherein the composition has been fired, wherein the firing removes the organic vehicle and sinters the silver and glass fits, and wherein the conductive silver and frit mixture penetrate the insulating film.
18. The composition of claim 12, wherein the insulating film is an anti-reflection coating.
19. The composition of claim 12, wherein the thick film composition further comprises an additive.
20. The composition of claim 19, wherein the additive is a metal additive, or a metal-containing additive, and wherein the metal additive or metal-containing additive forms an oxide under processing conditions.
21. The composition of claim 19 wherein the additive is a metal oxide additive.
22. The composition of claim 20, wherein the metal additive is selected from Zn, Gd, Ce, Ti, Sn, Ru, and Cu.
23. The composition of claim 20, wherein the metal-containing additive is Zn-containing.
24. The composition of claim 23, wherein the Zn-containing additive is ZnO.
25. The composition of claim 21, wherein the metal oxide additive is a metal oxide of one or more of the metals selected from Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu, and Cr.
26. An electrode formed from the composition of claim 56, wherein the composition has been fired to remove the organic vehicle and sinter the silver and glass particles.
27-60. (canceled)