1. (canceled)
2. Method as claimed in claim 5, wherein the proanthocyanidins are extracted from Vitis vinifera, lingonberries or bilberries, or quebracho wood.
3. Method as claimed in claim 2, wherein the proanthocyanidins are extracted from Vitis vinifera.
4. Method as claimed in claim 5, wherein the ratio between pea protein and proanthocyanidins is between 1:0.1 and 1:2.5.
5. Method of treating disorders caused by alterations of the intestinal epithelial tissue in a subject in need thereof with a complex comprising pea protein and proanthocyanidins, said method comprising:
administering to said subject in need thereof an effective amount of said complex; and
treating said subject.
6. Method as claimed in claim 5, wherein the disorder is diarrhoea.
7. Method as claimed in claim 5 wherein said complex is, in admixture with suitable carriers.
8. Method as claimed in claim 7, wherein said complex further comprises other active ingredients selected from antibiotics, antimotility agents, steroidal and non-steroidal anti-inflammatories, compounds for the treatment of gastrointestinal bloating, mesalazine, sucralfate, pectins, chitosan, hyaluronic acid, guar gum, xanthan gum, animal gelatins, plant proteins, cellulose and hemicellulose, hydroxypropyl-cellulose, carrageenans, carbomers, ferulic acid, probiotics, gelatin tannate and electrolytes.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit board having an electrically conductive structure formed between circuit layers thereof, comprising:
an insulating layer;
a first patterned circuit layer formed on the insulating layer, the first patterned circuit layer having a plurality of conductive pads and traces;
at least one dielectric material layer formed on the insulating layer, wherein second openings are penetratingly formed in the dielectric material layer to expose the conductive pads respectively;
at least one conductive post formed in the second openings of dielectric material layer and electrically connected to the conductive pads of first patterned circuit layer, the conductive post and the conductive pads having the same diameter, and the conductive pads being formed in the dielectric material layer;
a second conductive layer formed on the conductive post and part of the dielectric material layer; and
a second patterned circuit layer formed on the second conductive layer and having an extension portion, wherein the extension portion fills the second openings and electrically connects with the conductive post.
2. The circuit board of claim 1, wherein the electrically conductive structure comprises the conductive post and the extension portion for electrically interconnecting the first patterned circuit layer and the second patterned circuit layer.