What is claimed is:
1. A separator sheet for use in the manufacture of decorative laminates comprising, a paper backing sheet having applied to one surface thereof a polymer layer having a surface energy of about 44 dynescm and a melting point greater than about 160 degrees C.
2. The separator sheet of claim 1 wherein the polymer layer is selected from the group consisting of polypropylene and biaxially oriented polypropylene.
3. The separator sheet of claim 2 wherein the polymer layer is a biaxially oriented, polypropylene film having a thickness of about 0.001 inch.
4. The separator sheet of claim 3 wherein the film is adhered to the backing sheet with a polyolefin tie layer.
5. The separator sheet of claim 2 wherein the polymer layer is an extrusion coated layer of polypropylene.
6. A separator sheet for use in the manufacture of decorative laminates comprising, a paper backing sheet having applied to one surface thereof a polymer layer selected from the group of polymers consisting of biaxially oriented polypropylene, polypropylene, polymethylpentene, polyethylene terephthlate, silicone, polyamide, amorphous polyamide, polyvinyl alcohol and ethylene vinyl alcohol, wherein the polymer layer has a surface energy of about 44 dynescm and a melting point greater than about 160 degrees C.
7. The separator sheet of claim 6 wherein the polymer layer comprises an extrusion coated layer.
8. The separator sheet of claim 7 wherein the polymer layer comprises a film layer.
9. The separator sheet of claim 6 wherein the polymer layer contains a slip agent.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacturing a substrate including an electronic component, the method comprising:
preparing an electronic component having a terminal portion;
preparing a first insulative sheet;
mounting the electronic component to a surface of the first insulative sheet so that the terminal portion is opposed to the first insulative sheet;
forming an opening portion in the first insulative sheet so that a surface of the terminal portion is exposed; and
forming a conductive material that is extended from the terminal portion to an upper portion of the first insulative sheet,
wherein the first insulative sheet is a photosensitive sheet.
2. A method of manufacturing a substrate including an electronic component, the method comprising:
preparing a first electronic component having a terminal portion on a main surface thereof and having a first thickness;
preparing a second electronic component having a terminal portion on a main surface thereof and having a second thickness that is thicker than the first thickness;
preparing a first insulative sheet;
mounting the first and second electronic components on the first insulative sheet so that the terminal portions thereof are opposed to the first insulative sheet;
forming opening portions in the first insulative sheet so that surfaces of the terminal portions of the first and second electronic components are exposed;
forming wiring patterns each of which is extended from the corresponding terminal portions of the first and second electronic components to the upper portion of the first insulative sheet; and
covering the first and second electronic components with resin,
wherein the forming of the opening portions in the first insulative sheet comprises using a photosensitive sheet as the first insulative sheet, directly exposing and developing the photosensitive sheet, and forming the opening portions through which the surfaces of the terminal portions of the first and second electronic components are exposed.