1. An endoscopic device insertable into a body cavity movable in a predetermined direction, comprising a housing having an axis extending in a direction substantially corresponding to a direction of movement of the device; movable attaching means which is movable relative to said housing and is attachable to a wall of the body cavity under the action of vacuum in an interior of said movable attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said movable attaching means; and immovable attaching means which is immovably connected with said housing and is attachable to a wall of the body cavity under the action of vacuum in an interior of said immovable attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said immovable attaching means, said immovable attaching means and said movable attaching means being alternatingly attachable to the wall of the cavity; so that when said movable attaching means is attached to the wall of the cavity and said immovable attaching means is not attached to the wall of the cavity, said housing can be displaced in the direction of movement, while when said immovable attaching means is attached to the wall of the cavity, said movable attaching means can be displaced in a longitudinal direction without displacement of said housing, said movable attaching means and immovable attaching means being arranged so that they are attachable to different locations on the wall of the intestine as considered in a direction transverse to said axis of said housing.
2. An endoscopic device as defined in claim 1, wherein one of said movable and immovable attaching means including one first attaching element extending substantially coaxially with said axis of said housing and centrally of the latter, while the other of said movable and immovable attaching means including at least two second attaching elements which are located at opposite sides of said axis of said housing laterally of the latter.
2. An endoscopic device as defined in claim 1, wherein each of said attaching elements has a cup-shaped form with one convex side provided with an opening to be in contact with a wall of an intestine.
3. An endoscopic device as defined in claim 1, wherein each of said attaching elements has a side provided with an opening an adapted to face a wall of an intestine, said side of each of said attaching elements being provided with an element preventing introduction of the wall of intestine into said attaching element under the action of vacuum.
4. An endoscopic device as defined in claim 3, wherein said element is an element selected from the group consisting of a grate, a perforated wall, and a ribbed assembly.
5. An endoscopic device as defined in claim 1, wherein at least some of said attaching elements are movable in a direction transverse to said axis for adaptation to sides of intestine.
6. An endoscopic device as defined in claim 1; and further comprising means for removing mucus from said attaching elements.
7. An endoscopic device as defined in claim 6, wherein said means for removing mucus include means for supplying a liquid into said attaching elements
8. An endoscopic device as defined in claim 1; and further comprising means for creating a vacuum and pressure in said attaching elements and including pipe means.
9. An endoscopic device as defined in claim 7; and further comprising means for creating a vacuum and pressure in said attaching elements and including pipe means, said liquid supplying means including liquid supplying pipes selected from the group consisting of liquid supplying pipes separate from said pipe means and liquid supplying pipes integral with the latter.
10. An endoscopic device as defined in claim 1; and further comprising means for supplying vacuum and pressure into each of said attaching elements and selected from the group consisting of pneumatic, hydraulic, and hydropneumatic means.
11. An endoscopic device as defined in claim 1; and further comprising means for supplying vacuum and pressure in said attaching elements including means for supplying washing liquid into said attaching elements and means for filtration of washing liquid.
12. An endoscopic device as defined in claim 1; and further comprising means for displacing said housing and selected from the group consisting of means arranged in said housing and means located outside of said housing and connected with the latter by a flexible connection.
13. An endoscopic device as defined in claim 1; and further comprising means for displacing said housing in a manner selected from the group consisting of automatic mode and a stepped mode, and in a direction selected from the group consisting of a forward direction and a reverse direction.
14. An endoscopic device as defined in claim 1, wherein the device is composed of a material allowing the device to be disposable.
15. An endoscopic device as defined in claim 1, wherein all components of the device are connectable with one another to jointly from the device.
16. An endoscopic device as defined in claim 1, wherein all components of the device are formed of one-piece with one another.
17. An endoscopic device insertable into a body cavity movable in a predetermined direction, comprising a housing having an axis extending in a direction substantially corresponding to a direction of movement of the device; first attaching means which is attachable to a wall of the body cavity under the action of first in an interior of said movable attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said first attaching means; second attaching means which is attachable to a wall of the body cavity under the action of vacuum in an interior of said second attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said second attaching means, said first attaching means and said second attaching means being alternatingly attachable to the wall of the cavity; so that and means for alternating attaching said first attaching means and said second attaching means to the wall of the cavity one of said attaching means is attached to the wall of the cavity, then the other of said attaching means is moved forwardly of said one attaching means behind, then the one of said attaching means is moved forwardly of said other attaching means behind, et.
18. A method of inserting an endoscopic device into a body cavity and moving in a predetermined direction, comprising the steps of providing a housing having an axis extending in a direction substantially corresponding to a direction of movement of the device; providing first attaching means which is movable relative to said housing and is attachable to a wall of the body cavity under the action of vacuum in an interior of said first attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said first attaching means; providing second attaching means which is attachable to a wall of the body cavity under the action of vacuum in an interior of said second attaching means and detachable from the wall of the cavity under the action of pressure provided in the interior of said second attaching means; alternating attaching said first attaching means and said second attaching means to the wall of the cavity by attaching one of said attaching means to the wall of the cavity, then moving the other of said attaching means forwardly of said one attaching means to leave said one attaching means behind, then moving said one attaching means forwardly of said other attaching means to leave said other attaching means behind, etc.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of fabricating photolithography masks for an integrated circuit, the method comprising:
(a) fabricating a set of routing layer masks, which define conductive segments including signal segments, power supply segments and filler segments on various routing layers of the integrated circuit, wherein the filler segments are located in areas unused by the signal segments and the power supply segments;
(b) fabricating a first via mask, which defines electrical connections between the conductive segments on at least two of the routing layers, including connections between the filler segments on one of the layers and the power supply segments on another of the layers;
(c) changing a signal net on the integrated circuit after fabricating at least one of the routing layer masks and the first via mask; and
(d) fabricating a second via mask to replace the first via mask, which decouples a first of the filler segments from a first of the power supply segments and couples the first filler segment into the signal net.
2. The method of claim 1 wherein the signal net is changed in step (c) through step (d) without changing any of the routing layer masks fabricated in step (a).
3. The method of claim 1 wherein the signal net comprises a first signal segment defined on the routing layer on which the first power supply segment is defined and wherein:
step (b) comprises fabricating the first via mask, which defines a first conductive via between the first filler segment and the first power supply segment; and
step (d) comprises fabricating the second via mask to remove the first via and define a second via, which couples the first filler segment to the first signal segment of the signal net.
4. The method of claim 1 wherein:
in step (a), the first power supply segment and a first signal segment are defined by a first of the routing layer masks and the first filler segment and a second signal segment are defined by a second of the routing layer masks;
in step (b), the first via mask defines a first conductive via between the first filler segment and the first power supply segment and a second conductive via between the first and second signal segments, wherein the first and second signal segments and the second via at least partly define the signal net; and
in step (d), the second via mask eliminates the first and second vias and defines a third via, which couples the first filler segment to the first signal segment to define a modified signal net.
5. The method of claim 1 wherein:
step (a) further comprises fabricating a base layer mask set, which defines a first contact of a semiconductor device within the integrated circuit; and
step (d) further comprises fabricating the second via mask define a conductive via between the first filler segment and the first contact.
6. A method of fabricating an integrated circuit having a logical function, the method comprising:
(a) fabricating first and second routing layer masks and a first via mask, wherein the first routing layer mask comprises power supply segments and signal segments, the second routing layer mask comprises signal segments and filler segments, wherein the filler segments are located in unused areas of the second routing layer mask, and the first via mask defines vias that electrically couple the filler segments to the power supply segments;
(b) changing the logical function after step (a);
(c) fabricating a second via mask, which decouples a first of the filler segments from the power supply segments and couples the first filler segment to a first of the signal segments defined by the first routing layer mask to implement the logical function change in step (b); and
(d) fabricating the integrated circuit with the first and second routing layer masks and the second via mask.
7. The method of claim 6 wherein step (d) comprises fabricating the integrated circuit without any changes to the first and second routing layer masks after step (a).
8. The method of claim 6 wherein:
the first via mask defines a first conductive via between the first filler segment and a first of the power supply segments; and
the second via mask removes the first via and defines a second via, which couples the first filler segment to the first signal segment.
9. The method of claim 8 wherein:
the second routing layer mask defines a second signal segment;
the first via mask defines a third conductive via between the first and second signal segments; and
the second via mask removes the first and third vias.
10. The method of claim 6 wherein:
step (a) further comprises fabricating a base layer mask set, which defines a first contact of a semiconductor device within the integrated circuit; and
step (c) further comprises fabricating the second via mask define a conductive via between the first filler segment and the first contact.
11. A collection of masks for fabricating a portion of an integrated circuit, the collection of masks comprising:
a first routing layer mask defining conductive segments, including a plurality of signal segments and at least one power supply segment;
a second routing layer mask defining conductive segments, including a plurality of signal segments and at least one filler segment located in an area unused by the signal segments;
a first via mask, which defines locations of conductive vias between the conductive segments defined by the first and second routing layer masks, including a first via that couples the filler segment to the power supply segment; and
a second via mask which replaces the first via mask, wherein the second via mask eliminates the first via and adds a second via that couples the filler segment to one of the signal segments defined by the first routing layer mask instead of the power supply segment.
12. The collection of masks of claim 11 wherein:
the first routing layer mask defines a first signal segment;
the second routing layer mask defines a second signal segment;
the first via mask defines a third conductive via between the first and second signal segments; and
the second via mask eliminates the first and third vias and adds the second via, which couples the filler segment to the first signal segment.
15. The collection of masks of claim 11 and further comprising:
a base layer mask set, which defines a first contact of a semiconductor device within the integrated circuit; and
the second via mask defines a third conductive via, which couples the first filler segment and the first contact.