1460889954-033da8dd-56d6-40de-b92e-53e16c4a3dfe

1. An intervertebral implant comprising:
a first plate having an inner surface, an outer surface, a ball shaped protuberance projecting from the inner surface and an annular groove surrounding the ball shaped protuberance;
a second plate having an inner surface, an outer surface, a curvate socket formed in the inner surface of said second plate and a raised rim surrounding the curvate socket;
said first and second plates being assembled together so that the inner surfaces of said plates oppose one another and with the ball shaped protuberance disposed in the curvate socket and the annular groove aligned with the raised rim, wherein the assembled first and second plates angulate and rotate relative to one another.
2. The implant as claimed in claim 1, wherein the ball shaped protuberance is inwardly deflectable.
3. The implant as claimed in claim 2, wherein the ball shaped protuberance has a first radius in an undeflected state and a smaller second radius in a deflected state.
4. The implant as claimed in claim 3, wherein the curvate socket of said second plate has a radius that is smaller than the first radius of the ball shaped protuberance when the ball shaped protuberance is in the undeflected state.
5. The implant as claimed in claim 2, wherein the ball shaped protuberance has an axial bore formed therein and the device further comprises a deflection preventing element insertible into the axial bore.
6. The implant as claimed in claim 5, wherein the deflection preventing element is selected from the group consisting of a rivet, a plug, a dowel and a screw.
7. The implant as claimed in claim 5, wherein said second plate has an opening formed therein and the deflection preventing element is passable through the opening in said second plate.
8. The implant as claimed in claim 1, wherein the ball shaped protuberance is centrally located on said first plate and the curvate socket is centrally located on said second plate.
9. The implant as claimed in claim 1, wherein the inner surface of said second plate has a region outside the raised rim that slopes toward the outer surface of said second plate.
10. The implant as claimed in claim 1, further comprising a mesh overlying the outer surface of one of said first and second plates.
11. The implant as claimed 10, wherein the outer surface of the one of said first and second plates has a recess and the mesh overlies the recess.
12. The implant as claimed in claim 1, wherein the raised rim of said second plate advances into the annular groove of said first plate when said first and second plates are angled relative to one another.
13. The implant as claimed in claim 1, the inner surface of said first plate having a central region and a peripheral region outside the central region that slopes toward the outer surface of said first plate.
14. An intervertebral implant comprising:
a first plate having an inner surface, an outer surface, an inwardly deflectable ball shaped protuberance projecting from the inner surface and an annular groove surrounding the ball shaped protuberance;
a second plate having an inner surface, an outer surface, a curvate socket formed in the inner surface of said second plate and a raised rim surrounding the curvate socket;
said first and second plates being assembled together so that the inner surfaces of said plates oppose one another and the inwardly deflectable ball shaped protuberance is disposed in the curvate socket, wherein the annular groove on said first plate is aligned with the raised rim on said second plate, the raised rim advancing into the annular groove when said first and second plates are angled relative to one another.
15. The implant as claimed in claim 14, wherein the ball shaped protuberance is integrally formed with said first plate and the curvate socket is integrally formed with said second plate.
16. The implant as claimed in claim 14, further comprising a deflection preventing element inserted in an axial bore of said ball shaped protuberance for preventing inward deflection of said ball shaped protuberance.
17. An intervertebral implant comprising:
a first plate having an inner surface, an outer surface, a ball shaped protuberance integrally formed with said first plate and projecting from the inner surface and an annular groove formed in the inner surface of said first plate and surrounding the ball shaped protuberance;
a second plate having an inner surface, an outer surface, a curvate socket integrally formed with said second plate and provided in the inner surface of said second plate and a raised rim surrounding the curvate socket;
said first and second plates being assembled together with the ball shaped protuberance inserted in the curvate socket, wherein the raised rim on said second plate advances into the annular groove on said first plate for increasing a range of angulation of the said first and second plates relative to one another.
18. The implant as claimed in claim 17, wherein the ball shaped protuberance is inwardly deflectable for being inserted into the curvate socket, the ball shaped protuberance having an axial bore for receiving a deflection preventing element that prevents inward deflection of the ball shaped protuberance after the ball shaped protuberance has been received in the curvate socket of said second plate.
19. The implant as claimed in claim 17, wherein the inner surface of said first plate opposes the inner surface of said second plate, the opposing inner surfaces sloping away from one another for increasing a range of angulation of the said first and second plates relative to one another.
20. The implant as claimed in claim 17, further comprising a mesh overlying at least one of the outer surfaces of said first and second plates.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of manufacturing an electronic or optoelectronic circuitry sheet, comprising:
a) forming a device layer stack having a plurality of unpatterned device layers;
b) locating a resist layer in working relation with said device layer stack; and
c) activating said resist layer so as to impart a plurality of images distinct from one another at different imaging levels within said resist layer, wherein said plurality of images are imparted substantially simultaneously.
2. A method according to claim 1, wherein said resist layer is a single coating layer.
3. A method according to claim 1, wherein said resist layer comprises a plurality of resist coating layers activated by differing stimuli, and step c) includes activating said resist layer with energy comprising said differing stimuli so as to activate each of said plurality of resist coating layers substantially independently from each other.
4. A method according to claim 1, wherein step c) comprises stimulating said resist layer with a plurality of stimuli corresponding respectively to said plurality of images, said plurality of stimuli selected from the group consisting of electromagnetic energy, thermal energy, electric field energy, magnetic field energy, e-beam energy and sonic energy.
5. A method according to claim 1, further comprising performing steps a), b) and c) sequentially in a roll-to-roll process.
6. A method according to claim 5, further comprising performing steps a), b) and c) in forming at least parts of a plurality of corresponding respective thin film transistors.
7. A method according to claim 1, wherein step a) includes forming said device layer stack on a temporary substrate.
8. A method according to claim 7, further comprising, prior to step b), removing said temporary substrate.
9. A method according to claim 1, wherein the step of locating a resist layer includes locating a positive photoresist layer in working relation with said device stack.
10. A method according to claim 1, wherein the step of locating a resist layer includes locating a negative photoresist layer in working relation with said device stack.
11. A method according to claim 1, wherein the step of locating a resist layer includes locating a hybrid photoresist layer in working relation with said device stack.