1. A system for rate matching and de-rate matching, the system comprising: a memory configured to store a plurality of blocks of data; a digital signal processor (DSP) configured to: pre-compute permutation parameters common to the plurality of blocks, wherein the plurality of blocks are subject to a set of given puncturing parameters; receive a set of pre-computed puncturing thresholds; and for one or more blocks in the plurality of blocks compute a block signature from the pre-computed puncturing thresholds; match the block signature to one of a set of pre-computed zone signatures, derive a zone index corresponding to the one pre-computed zone signature, and apply pre-computed permutation and puncturing transformations corresponding to the zone index to the block.
2. The system of claim 1, wherein the DSP is further configured to load the block into a vector register after deriving the zone index.
3. The system of claim 2 wherein the DSP is further configured to apply the pre-computed permutation and puncturing transformations to the block in the vector register.
4. The system of claim 3, wherein the DSP is further configured to write the block in the vector register to the memory.
5. The system of claim 1, wherein the DSP is further configured to load the block into a vector register after deriving the zone index.
6. The system of claim 5, wherein the DSP is further configured to pack the block in the vector register from double words to words.
7. The system of claim 6; wherein the DSP is further configured to apply the pre-computed permutation and puncturing transformations to the packed block in the vector register.
8. The system of claim 7, wherein the DSP is further configured to unpack the transformed block in the vector register.
9. The system of claim 8, wherein the DSP is further configured to write the unpacked transformed block in the vector register to the memory.
10. A device for rate matching and de-rate matching, comprising: an interface for receiving a plurality of blocks of data; digital signal processor configured to: pre-compute permutation parameters common to the plurality of blocks, wherein the plurality of blocks are subject to a set of given puncturing parameters; receive a set of pre-computed puncturing thresholds; and for one or more blocks in the plurality of blocks compute a block signature from the pre-computed puncturing thresholds; match the block signature to one of a set of pre-computed zone signatures, derive a zone index corresponding to the one pre-computed zone signature, apply pre-computed permutation and puncturing transformations corresponding to the zone index to the block.
11. The device of claim 10, wherein the DSP is further configured to load the block into a vector register after deriving the zone index.
12. The device of claim 11 wherein the DSP is further configured to apply the pre-computed permutation and puncturing transformations to the block in the vector register.
13. The device of claim 12, wherein the DSP is further configured to write the block in the vector register to a memory.
14. The device of claim 10, wherein the DSP is further configured to load the block into a vector register after deriving the zone index.
15. The device of claim 14, wherein the DSP is further configured to pack the block in the vector register from double words to words.
16. The device of claim 15; wherein the DSP is further configured to apply the pre-computed permutation and puncturing transformations to the packed block in the vector register.
17. The device of claim 16, wherein the DSP is further configured to unpack the transformed block in the vector register.
18. The device of claim 17, wherein the DSP is further configured to write the unpacked transformed block in the vector register to a memory.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An exposure method comprising:
forming an immersion area on part of a substrate such that a projection area of a projection optical system is covered by the immersion area;
exposing the substrate by projecting an exposure light onto the substrate through the projection optical system and the liquid in the immersion area positioned between an optical member of the projection optical system and the substrate; and
forming a spare immersion area at an outer circumference of the immersion area by disposing part of the liquid supplied onto the substrate, wherein
the spare immersion area is formed between an immersion-area-forming-member and the substrate during the exposure of the substrate,
the immersion-area-forming-member is provided to surround the optical member of the projection optical system, and an upper surface of the substrate faces a lower portion of the immersion-area-forming-member during the exposure of the substrate,
the immersion-area-forming-member has a groove portion in the lower portion, the groove portion being arranged to surround a path of the exposure light, and
part of the liquid in the spare immersion area is retained between the groove portion and the upper surface the substrate during the exposure of the substrate.
2. An exposure method according to claim 1, wherein part of the liquid is disposed in the spare immersion area prior to exposure of the substrate.
3. An exposure method according to claim 1, further comprising supplying and recovering the liquid to and from the immersion area and the spare immersion area, wherein the amount of the liquid supplied is greater than the amount of liquid recovered.
4. A device fabrication method that includes a lithographic process, the method comprising:
exposing the substrate through the lithographic process with the exposure method according to claim 1; and
processing the exposed substrate.
5. An exposure method according to claim 1, wherein the liquid is supplied from a supply port provided at a bottom surface of the groove portion.
6. An exposure method according to claim 1, wherein the liquid is recovered from a recovery port provided at a bottom surface of the groove portion.
7. An exposure method according to claim 1, wherein during the exposure of the substrate,
a surrounding space is formed between the immersion-area-forming member and the substrate,
the surrounding space surrounds the immersion area formed between the optical member of the projection optical system and the substrate, and
the spare immersion area is formed in a portion of the surrounding space.
8. An exposure method according to claim 1, wherein:
the immersion-area-forming-member has a wall portion in the lower portion thereof, the wall portion being arranged to surround the path of the exposure light, and the wall portion protruding downwardly, and
part of the liquid in the spare immersion area is limited from being leaked to an outer side of the wall portion.
9. An exposure method according to claim 8, wherein the wall portion protrudes downwardly from a bottom surface of the groove portion.
10. An exposure method according to claim 8, wherein the groove portion extends along an inner side of the wall portion.
11. An exposure method according to claim 8, wherein the liquid is supplied from a supply port provided at the bottom surface of the groove portion.
12. An exposure method according to claim 8, wherein the liquid is recovered from a recovery port provided at the bottom surface of the groove portion.
13. An exposure method according to claim 8, wherein a distance between a lower surface of the wall portion and the substrate is smaller than a distance between a lower surface of the optical member of the projection optical system and the substrate during the exposure of the substrate.
14. An exposure method according to claim 8, further comprising removing the liquid at the outer side of the wall portion.