1. A semiconductor package comprising:
a plate-shaped semiconductor device having a gate electrode provided at a midsection of a first main surface, an emitter electrode provided around the gate electrode on the first main surface, and a collector electrode provided on a second main surface;
a plate-shaped first electrode plate having a protruding portion which is provided on one of surfaces facing the first main surface and which abuts against at least part of the emitter electrode, a through-hole formed at a center of the protruding portion, a pedestal portion which forms part of an inner peripheral surface of the through-hole and which is provided on the other surface side, a communication path formed in the protruding portion and extending from the through-hole up to an outer side surface of the protruding portion, and a plurality of opening portions formed in the outer side surface of the protruding portion;
a wiring substrate stacked between the semiconductor device and the first electrode plate, formed like a plate which can be sandwiched, and having an intrusion opening portion into which the protruding portion is intruded, a projecting portion whose base end is provided on an inner peripheral surface of the intrusion opening portion, whose tip is positioned within the through-hole and held on the pedestal portion, and which extends through the communicating path, a control electrode provided on the tip of the projecting portion and electrically connected to the gate electrode, and a plurality of engaging portions which are formed in the inner peripheral surface of the intrusion opening portion and engaged with said plurality of opening portions and whose tips are positioned inside the outer side surface of the protruding portion; and
a plate-shaped second electrode whose one main surface is electrically connected to the collector electrode.
2. The semiconductor package according to claim 1, wherein at least some of said plurality of opening portions are formed in the outer side surfaces that face each other via the protruding portion.
3. A semiconductor package comprising:
a plate-shaped semiconductor device having a gate electrode provided at a midsection of a first main surface, an emitter electrode provided around the gate electrode on the first main surface, and a collector electrode provided on a second main surface;
a plate-shaped first electrode plate having a protruding portion which is provided on an opposite surface facing the first main surface and which abuts against at least part of the emitter electrode, a through-hole formed at a center of the protruding portion, a pedestal portion which forms part of an inner peripheral surface of the through-hole and which is provided on the side of a surface facing the opposite surface, a communication path formed in the protruding portion and extending from the through-hole up to an outer side surface of the protruding portion, at least one opening portion which is formed in an outer side surface of the protruding portion and which partially runs through the outer side surface of the protruding portion, and a projecting grappling portion which forms the outer side surface of the protruding portion and which is provided on the opposite surface;
a wiring substrate stacked between the semiconductor device and the first electrode plate, formed like a plate which can be sandwiched, and having an intrusion opening portion into which the protruding portion and the grappling portion are intruded, a projecting portion whose base end is provided on part of a peripheral surface of the intrusion opening portion, whose tip is positioned within the through-hole and held on the pedestal portion, and which extends through the communicating path, a control electrode provided on the tip of the projecting portion and electrically connected to the gate electrode, and an engaging portion which is formed in the inner peripheral surface of the intrusion opening portion and engaged with the opening portion and whose tip is positioned inside the outer side surface of the protruding portion; and
a plate-shaped second electrode whose one main surface is electrically connected to the collector electrode.
4. The semiconductor package according to claim 3, wherein the opening portion is formed in the outer side surface that faces the outer side surface of the protruding portion on which the grappling portion is provided via the protruding portion.
5. The semiconductor package according to claim 3, wherein the first electrode further comprises an opening portion formed in a side surface of the grappling portion, and
the wiring substrate further comprises an engaging portion which is formed on an inner side surface of the through-hole and engaged with the opening portion formed in the grappling portion.
6. A semiconductor package manufacturing method comprising the steps of:
disposing a square-shaped first electrode plate having a protruding portion provided on one of its main surfaces and a plurality of opening portions formed in a side surface of the protruding portion and a wiring substrate having an intrusion opening portion into which the protruding portion is intruded and engaging portions which are engaged with said plurality of opening portions formed in an inner side surface of the intrusion opening portion and whose tips are positioned inside an outer side surface of the protruding portion, to a position where the opening portions and the engaging portions can be engaged with each other;
mounting the wiring substrate and the first electrode plate to each other by engaging said plurality of engaging portions of the wiring substrate with said plurality of opening portions in the first electrode plate respectively; and
jointing the wiring substrate and the first electrode plate mounted to each other and a semiconductor device having electrodes to each other by using a conductive member.
7. A semiconductor package manufacturing method comprising the steps of:
disposing a square-shaped first electrode plate having a protruding portion provided on one of its main surfaces, a plurality of opening portions formed in at least one of side surfaces of the protruding portion, and a grappling portion provided on the side surface that faces the side surface of the protruding portion in which the opening portions are formed, and a wiring substrate having an intrusion opening portion into which the protruding portion and the grappling portion are intruded and engaging portions which are engaged with said plurality of opening portions formed in an inner side surface of the intrusion opening portion and whose tips are positioned inside an outer side surface of the protruding portion, to a position where the opening portions and the engaging portions can be engaged with each other;
covering the side surface of the protruding portion with the inner side surface of the intrusion opening portion and causing said plurality of opening portions and said plurality of engaging portions to face each other respectively;
engaging said plurality of opening portions and said plurality of engaging portions with each other respectively by moving said plurality of opening portions and said plurality of engaging portions facing each other respectively in such a direction that the opening portions and the engaging portions may be engaged with each other respectively;
mounting the wiring substrate and the first electrode plate to each other by covering the side surfaces of the grappling portion and the protruding portion with the inner side surface of the intrusion opening portion; and
jointing the wiring substrate and the first electrode plate mounted to each other and a semiconductor device having electrodes to each other by using a conductive member.
8. A semiconductor package manufacturing method comprising the steps of:
disposing a square-shaped first electrode plate having a protruding portion provided on one of its main surfaces, a plurality of opening portions formed in at least one of side surfaces of the protruding portion, a grappling portion provided on the side surface that faces the side surface of the protruding portion in which the opening portions are formed, and an opening portion formed on a side surface of the grappling portion, and a wiring substrate having an intrusion opening portion into which the protruding portion and the grappling portion are intruded and engaging portions which are engaged with said plurality of opening portions formed in an inner side surface of the intrusion opening portion and whose tips are positioned inside outer side surfaces of the protruding portion and the grappling portion, to a position where the opening portions and the engaging portions can be engaged with each other;
covering the side surface of the protruding portion with the inner side surface of the intrusion opening portion and causing said plurality of opening portions and said plurality of engaging portions to face each other respectively;
engaging said plurality of opening portions of the protruding portion and said plurality of engaging portions with each other respectively by moving said plurality of opening portions and said plurality of engaging portions provided on the protruding portion facing each other respectively in such a direction that the opening portions of the protruding portion and the engaging portions may be engaged with each other respectively;
mounting the wiring substrate and the first electrode plate to each other by covering the side surfaces of the grappling portion and the protruding portion with the inner side surface of the intrusion opening portion and engaging the engaging portions and the opening portions in the grappling portion with each other respectively; and
jointing the wiring substrate and the first electrode plate mounted to each other and a semiconductor device having electrodes to each other by using a conductive member.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A plurality of ink sticks for use in phase change ink imaging devices, the plurality of ink sticks comprising:
a first ink stick configured for insertion through an insertion opening of an ink loader for a first phase change ink imaging device and configured for insertion through an insertion opening of an ink loader for a second phase change ink imaging device; and
a second ink stick configured for insertion through the insertion opening of the ink loader for the second phase change ink imaging device and configured to be excluded from insertion through the insertion opening of the ink loader for the first phase change ink imaging device;
wherein the first and second ink sticks have substantially identical shapes except for an exclusionary difference in configuration.
2. The plurality of ink sticks of claim 1, the second ink stick having a dimension that is greater than the corresponding dimension in the first ink stick, the dimension being substantially perpendicular to an insertion direction of the insertion openings of the first and second ink loaders.
3. The plurality of ink sticks of claim 1, the first ink stick including a first keying element in a first position on an insertion perimeter of the first ink stick; and
the second ink stick including a first keying element in a first position on an insertion perimeter of the second ink stick corresponding to the first position on the insertion perimeter of the first ink stick, the second ink stick further including a second keying element in a second position on the insertion perimeter of the second ink stick.
4. The plurality of ink sticks of claim 1, the first ink stick including a keying element in a first position on an insertion perimeter of the first ink stick; and
the second ink stick including a keying element in a first position on an insertion perimeter of the second ink stick corresponding to the first position on the insertion perimeter of the first ink stick;
the keying element of the second ink stick having a dimension that is greater than a corresponding dimension of the keying element of the first ink stick, the dimension being substantially perpendicular to an insertion direction of the insertion openings of the ink loaders for the first and second phase change ink imaging devices.
5. The plurality of ink sticks of claim 1, further comprising a third ink stick configured for insertion through in insertion opening of an ink loader for a third phase change ink imaging device, and configured to be excluded from insertion through the insertion openings of the ink loaders for the first and second phase change ink imaging devices; and
the first and second ink sticks being configured for insertion through the insertion opening of the ink loader for the third phase change ink imaging device.
6. The plurality of ink sticks of claim 5, the first, second and third ink stick each having a corresponding dimension that is perpendicular to the insertion direction, the corresponding dimension of the third ink stick being greater than the corresponding dimension in the first and second ink stick, and the corresponding dimension of the second ink stick being greater than the corresponding dimension of the first ink stick.
7. The plurality of ink sticks of claim 5, the first ink stick including a first keying element in a first position on an insertion perimeter;
the second ink stick including a first keying element in a first position on an insertion perimeter of the second ink stick corresponding to the first position on the insertion perimeter of the first ink stick, the second ink stick further including a second keying element in a second position on the insertion perimeter; and
the third ink stick including a first keying element in the first position on an insertion perimeter and a second keying element in a second position on the insertion perimeter, the first and second positions on the insertion perimeter of the third ink stick corresponding to the first and second positions on the insertion perimeter of the second ink stick, the third ink stick further including a third keying element in a third position on the insertion perimeter.
8. The plurality of ink sticks of claim 5, the first, second and third ink sticks each including an insertion perimeter and a keying element in a corresponding position on the insertion perimeter;
the keying element of the third ink stick having a dimension that is greater than a corresponding dimension of the keying elements of the first and second ink sticks, the corresponding dimension of the keying element of the second ink stick being greater than the corresponding dimension of the keying element of the first ink stick, the corresponding dimensions being substantially perpendicular to an insertion direction of the insertion openings of the ink loaders for the first, second and third phase change ink imaging devices.
9. A plurality of phase change ink imaging devices, the plurality of phase change ink imaging devices comprising:
a first phase change ink imaging device having an ink loader with an insertion opening configured to receive a first stick configuration and a second ink stick configuration;
a second phase change ink imaging device having an ink loader with an insertion opening configured to receive the second ink stick configuration and to exclude the first ink stick configuration;
wherein the insertion openings of the first and second phase change ink imaging device are substantially identical in shape except for an exclusionary difference in configuration.
10. The plurality of phase change ink imaging devices of claim 9, the insertion opening of the first phase change ink imaging device including a dimension that is greater than the corresponding dimension in the insertion opening of the second phase change ink imaging device, the dimension being substantially perpendicular to an insertion direction of the insertion openings of the ink loaders of the first and second phase change ink devices.
11. The plurality of phase change ink imaging devices of claim 9, the insertion opening of the second device including a first keying portion in a first position on the perimeter of the insertion opening; and
the insertion opening of the first device including a first keying portion in a first position corresponding to the first position on the perimeter of the insertion opening of the second device, the insertion opening of the first device further including second keying portion in a second position on the perimeter of the insertion opening.
12. The plurality of phase change ink imaging devices of claim 9, the insertion openings of the first and second devices each including a keying portion in a first position on the perimeter of the insertion openings; and
the keying portion of the insertion opening of the first device having a dimension that is greater than a corresponding dimension of the keying portion o the insertion opening of the second device, the dimension of the keying portions being substantially perpendicular to an insertion direction of the insertion openings.
13. The plurality of phase change ink imaging devices of claim 9, further comprising a third phase change ink imaging device having an ink loader with an insertion opening configured to receive a third configuration of ink stick and configured to exclude the first and second configurations of ink stick, the insertion openings of the first and second devices being configured to receive the third ink stick configuration.
14. The plurality of phase change ink imaging devices of claim 13, the insertion openings of the first, second and third imaging devices each having a corresponding dimension that is perpendicular to the insertion direction, the corresponding dimension of the insertion opening of the first device being greater than the corresponding dimension in the insertion openings of the second and third devices, and the corresponding dimension of the insertion opening of the second device being greater than the corresponding dimension of the insertion opening of the third device.
15. The plurality of phase change ink imaging devices of claim 13, the insertion opening of the third device including a first keying portion in a first position on a perimeter of the insertion opening;
the insertion opening of the second device including a first keying portion in a first position corresponding to the first position in the insertion opening of the third device, the insertion opening of the second device further including a second keying portion in a second position on the perimeter of the insertion opening; and
the insertion opening of the first device including a first keying portion in a first position corresponding to the first position in the insertion opening of the second device and a second keying portion in a second keying position corresponding to the second position in the insertion opening of the second device, the insertion opening of the first device further including a third keying portion in a third position on the perimeter of the insertion opening.
16. The plurality of phase change ink imaging devices of claim 13, the insertion openings of the first, second and third devices each including a keying portion in a corresponding position on a perimeter of the insertion opening; and
the keying portion in the insertion openings of the first, second and third devices having a corresponding dimension that is perpendicular to the insertion direction, the corresponding dimension of the keying portion of the insertion opening of the first device being greater than the corresponding dimension of the keying portions of the insertion openings of the second and third devices, and the corresponding dimension of the keying portion of the insertion opening of the second device being greater than the corresponding dimension of the keying portion of the insertion opening of the third device.
17. A method of forming a plurality of ink sticks for use phase change ink imaging devices, the method comprising:
forming a first ink stick configured for insertion through an insertion opening of an ink loader of a first phase change ink imaging device and configured for insertion through an insertion opening of a second phase change ink imaging device; and
forming a second ink stick configured for insertion through the insertion opening of the ink loader of the second imaging device and configured to be excluded from insertion through the insertion opening of the ink loader of the first imaging device.
18. The method of claim 17, forming the second ink stick further comprising:
forming the second ink stick such that the second ink stick has a dimension perpendicular to an insertion direction that is greater than the corresponding dimension of the first ink stick, the dimension being perpendicular to an insertion direction of the insertion openings of the ink loaders.
19. The method of claim 17, forming the first ink stick further comprising:
forming the first ink stick with a first keying element in a first position on an insertion perimeter of the first ink stick; and
forming the second ink stick further comprising:
forming the second ink stick with a first keying element in a first position on an insertion perimeter in a first position corresponding to the first position on the insertion perimeter of the first ink stick; and
forming the second ink stick with a second keying element in a second position on the insertion perimeter.
20. The method of claim 17, forming the first ink stick further comprising:
forming the first ink stick with a keying element in a first position on an insertion perimeter of the first ink stick; and
forming the second ink stick with a keying element in a first position on an insertion perimeter of the second ink stick corresponding to the first position on the insertion perimeter of the first ink stick, the keying element of the second ink stick having a dimension that is greater than a corresponding dimension of the keying element of the first ink stick.