1. A method of forming a package carrier, the method comprising:
providing a first copper foil layer, a second copper foil layer on the first copper foil layer, a third copper foil layer and a fourth copper foil layer on the third copper foil layer, wherein the second foil layer is partially bonded the fourth copper foil layer by an adhesive gel;
forming a plurality of first through holes extending from the first copper foil layer to the third copper foil layer;
compressing a first dielectric layer and a first conductive layer disposed thereon on the first copper foil layer, and compressing a second dielectric layer and a second conductive layer disposed thereon on the third copper foil layer, wherein the first dielectric layer and the second dielectric layer face to the first copper foil layer and the third copper foil layer respectively, and portions of the first dielectric layer and the second dielectric layer fill in the first through holes;
patterning the first conductive layer and the second conductive layer to form a first circuit layer and a second circuit layer;
compressing a third dielectric layer and a fifth copper foil layer disposed thereon on the first circuit layer and removing the adhesive gel to from a first carrier unit; and
forming a plurality of first conductive blind via structures connecting the fifth copper foil layer and the first circuit layer, and forming a plurality of second conductive blind via structures connecting the first copper foil layer and the first circuit layer.
2. The method of claim 1, wherein a thickness of the second copper foil layer is substantially larger than a thickness of the first copper foil layer, and the thickness of the first copper foil layer is substantially equal to a thickness of the third copper foil layer, and the thickness of the second copper foil layer is substantially equal to a thickness of the fourth copper foil layer.
3. The method of claim 1, wherein a material of the adhesive gel includes cyanoacrylate or polypropylene resin.
4. The method of claim 1, wherein a method of forming the first through holes includes a mechanical drilling.
5. The method of claim 1, wherein a sum of a thickness of the first dielectric layer and a thickness of the first conductive layer is substantially larger than a sum of a thickness of the first copper foil layer and a thickness of the second foil layer, and a sum of a thickness of the second dielectric layer and a thickness of the second conductive layer is substantially larger than a sum of a thickness of the third copper foil layer and a thickness of the fourth copper foil layer.
6. The method of claim 1, before the step of patterning the first conductive layer and the second conductive layer, further comprising forming a plurality of second through holes extending from the first conductive layer to the second conductive layer.
7. The method of claim 1, wherein the third dielectric layer and the fifth copper foil layer disposed on the third dielectric layer are compressed on the first circuit layer after the adhesive gel is removed.
8. The method of claim 1, wherein the third dielectric layer and the fifth copper foil layer disposed on the third dielectric layer are compressed on the first circuit layer before the adhesive gel is removed.
9. The method of claim 8, wherein the step of compressing the third dielectric layer and the fifth copper foil layer disposed on the third dielectric layer on the first circuit layer further comprises compressing a fourth dielectric layer and a sixth copper foil layer disposed thereon on the second circuit layer.
10. The method of claim 1, wherein a method of removing the adhesive gel includes a mechanical drilling or a milling machine process.
11. The method of claim 1, after the step of removing the adhesive gel, further comprising removing the second copper foil layer.
12. The method of claim 11, wherein a method of removing the second copper foil layer includes a lift-off method.
13. The method of claim 1, wherein the first carrier unit comprises the fifth copper foil layer, the third dielectric layer, the first circuit layer, the first dielectric layer and the first copper foil layer, and the method for forming the first conductive blind via structures and the second conductive blind via structures comprises:
performing a mechanical drilling on the fifth copper foil layer and the first copper foil layer so as to form a plurality of first blind via extending from the fifth copper foil layer to the first circuit layer and a plurality of second blind vias extending from the first copper foil layer to the first circuit layer, wherein the first blind vias and the second blind vias expose a portion of the first circuit layer;
forming a chemical copper layer in the first blind vias and the second blind vias, wherein the chemical copper layer connects the fifth copper foil layer and the first circuit layer and connects the first copper foil layer and the first circuit layer;
forming a first patterned dry film photoresist layer on the fifth copper foil layer and forming a second patterned dry film photoresist layer on the first copper foil layer, wherein the first patterned dry film photoresist layer at least exposes the first blind vias and the second patterned dry film photoresist layer at least exposes the second blind vias;
forming an copper plating copper layer at least in the first blind vias and the second blind vias, wherein the copper plating copper layer fills up the first blind vias and the second blind vias and covers a portion of the chemical copper layer; and
removing the first patterned dry film photoresist layer and a portion of the fifth copper foil layer under the first patterned dry film photoresist layer, and the second patterned dry film photoresist layer and a portion of the first copper foil layer under the second patterned dry film photoresist layer to expose a portion of the third dielectric layer and a portion of the first dielectric layer so as to form the first conductive blind via structures in the first blind vias and the second conductive blind via structures in the second blind vias.
14. The method of claim 13, wherein the mechanical drilling includes a laser drilling.
15. The method of claim 13, wherein a method of forming the chemical copper layer comprises a electroless plating process.
16. The method of claim 13, wherein the method for removing the first patterned dry film photoresist layer and a portion of the fifth copper foil layer under the first patterned dry film photoresist layer, and the second patterned dry film photoresist layer and a portion of the first copper foil layer under the second patterned dry film photoresist layer includes an etching process.
17. The method of claim 13, after the step of removing the first patterned dry film photoresist layer and a portion of the fifth copper foil layer under the first patterned dry film photoresist layer, and the second patterned dry film photoresist layer and a portion of the first copper foil layer under the second patterned dry film photoresist layer, further comprising:
forming a first protecting layer on the third dielectric layer and forming a second protecting layer on the first dielectric layer, wherein the first protecting layer covers the third dielectric layer and the first conductive blind via structures exposed by the third dielectric layer, and the second protecting layer covers the first dielectric layer and the second conductive blind via structures exposed by the first dielectric layer.
18. The method of claim 17, wherein a method of forming the first protecting layer and the second protecting layer includes a screen printing.
19. The method of claim 17, after the step of forming the first protecting layer and the second protecting layer, further comprising:
performing a polishing process to remove a portion of the first protecting layer until the first conductive blind via structures are exposed and to remove a portion of the second protecting layer until the second conductive blind via structures are exposed; and
removing a rest portion of the first protecting layer and a rest portion of the second protecting layer.
20. The method of claim 13, after the step of forming the first conductive blind via structures and the second conductive blind via structures, further comprising:
forming a first solder mask layer on the third dielectric layer, wherein the first solder mask layer has a plurality of first openings exposing the first conductive blind via structures; and
forming a second solder mask layer on the first dielectric layer, wherein the second solder mask layer has a plurality of second openings exposing the second conductive blind via structures.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A device for tamponade of body cavities and for mechanical anchoring of a catheter having a shaft with an end, the device comprising:
a flexible tube segment having an inner wall and an outer wall that surround an interior space wherein said tube segment is inflatable to assume a torus geometry with said inner wall defining an internal area, and the internal area is configured without through-passing support bodies so that a displacement of tube wall material between said inner wall and said outer wall of said tube segment is possible as inflation proceeds, wherein said tube segment is preformed in such a way that a tube portion that forms the inner wall of said tube segment after invagination is smaller in cross section and has a greater wall thickness than a tube portion forming the outer wall, and wherein said tube segment further comprises:
a. two ends, which are fastened to a same closing element, configured so that a torus geometry is striven for as said inflatable tube segment is inflated and
b. said closing element is a pipe nipple and said two ends of said tube segment are joined together fluid-tightly.
2. The device according to claim 1, wherein at least said outer wall is thin-walled and elastically expandable.
3. The device according to claim 1, wherein at least said outer wall of the tube segment has a wall thickness of a few microns.
4. The device according to claim 1, wherein said tube segment consists of a polyurethane, a polyurethanepolyvinyl chloride mixture, or a comparable polyurethane-based material or a polymer having comparable expansion and processing characteristics.
5. The device according to claim 1, wherein said tube segment is configured for the reversible, sealing securement of the catheter at the end of the catheter shaft.
6. The device according to claim 1, wherein said tube segment is formed by invaginating a single-walled tube section.
7. The device according to claim 6, wherein at least one end of said tube section is attached to the catheter shaft.
8. The device according to claim 1, wherein a channel for the delivery andor discharge of a fluid opens into the interior space formed by said walls of said tube segment.
9. The device according to claim 6, wherein said tube section or a portion thereof is preformed as a single-walled tube in the shape of a roll before being fashioned into a tube segment by invagination.
10. The device according to claim 9, wherein a bulge produced vertically to the plane of rotation of said tube segment by the invagination is thickened by said preforming.
11. The device according to claim 1, wherein said tube portion is provided with a uniform wall thickness and a uniform inner diameter.
12. The device according to claim 1, wherein said tube segment is implemented with a residual volume.
13. The device according to claim 1, wherein a channel is connected via a flexible connecting tube to a valve disposed outside said tube segment.
14. The device according to claim 13, wherein said valve includes a lip valve.
15. The device according to claim 13, wherein said valve is a circular sleeve consisting of flexible material and disposed between said tube ends.
16. The device according to claim 1, wherein a collar-shaped abutment is disposed on a selected one of said pipe nipple and said catheter shaft.
17. The device according to claim 1, wherein a pressure sensor is contained in the interior space.
18. The device according to claim 1, wherein a medically active substance can be introduced into the interior space enclosed by said tube segment.
19. The device according to claim 18, wherein said medically active substance has at least one of radioactive and chemotherapeutic properties.
20. The device according to claim 18, wherein said tube segment is covered in at least one subregion by a shield and said shield suppresses or decreases the medicinal activity of the substance in the shielded subregion.
21. The device according to claim 1, wherein a radiographic contrast medium can be introduced into the interior space enclosed by said tube segment.
22. The device according to claim 1, wherein affixed to a surface of said tube segment is a pair of electrodes.
23. The device according to claim 1, wherein a receptacle is affixed to the surface of said tube segment.
24. The device according to claim 1, wherein a carrier containing a chemotherapeutic substance is affixed to a surface of said tube segment.
25. The device according to claim 1, wherein a carrier is affixed to a surface of said tube segment.
26. The device according to claim 25, wherein the carrier contains a radioactive substance.
27. A device for tamponade of body cavities and for mechanical anchoring of a catheter, the device comprising:
a flexible tube segment having an inner wall and an outer wall that surround an interior space wherein said tube segment is inflatable to assume a torus geometry with said inner wall defining an internal area, and the internal area is configured without through-passing support bodies so that a displacement of tube wall material between said inner wall and said outer wall of said tube segment is possible as inflation proceeds, wherein said tube segment further comprises:
a. two ends, which are fastened to a same closing element, configured so that a torus geometry is striven for as said inflatable tube segment is inflated and
b. said closing element is a pipe nipple and said two ends of said tube segment are joined together fluid-tightly, wherein a clamping closure having a longitudinally displaceable sleeve is slidably attached to said tube segment.