1. A layer composition comprising a alcohol-soluble polyamide and a trisamino triphenyl compound having the following formula I:
wherein R1, R2, and R3 are the same or different and are an alkyl group having from about 1 to about 15 carbons.
2. A layer composition in accordance with claim 1, wherein said trisamino triphenyl compound is present in the layer composition in an amount of from about 5 to about 40 percent by weight of total solids.
3. A layer composition in accordance with claim 1, wherein said alcohol-soluble polyamide comprises pendant groups selected from the group consisting of methoxy, ethoxy and hydroxy pendant groups.
4. A layer composition in accordance with claim 3, wherein said pendant groups are selected from the group consisting of N-methoxymethyl, N-ethoxymethyl, and N-hydroxymethyl pendant groups.
5. A layer composition in accordance with claim 4, wherein said polyamide has the following general formula III:
wherein R1, R2 and R3 are the same or different arid are alkyl groups having from about 1 to about 15 carbons, and wherein n is a number of from about 50 to about 1.000.
6. A layer composition in accordance with claim 5, wherein said polyamide is crosslinked.
7. A layer composition in accordance with claim 1, wherein said composition further comprises a crosslinking agent.
8. A layer composition in accordance with claim 7, wherein said crosslinking agent is selected from the group consisting of oxalic acid, p-toluene sulfonic acid, phosphoric acid, sulfuric acid, and mixtures thereof.
9. A layer composition in accordance with claim 1, wherein said composition further comprises a second deletion control agent other than said trisamino triphenyl compound, wherein the first deletion control agent is said trisamino triphenyl compound.
10. A layer composition in accordance with claim 9, wherein said second deletion control agent is selected from the group consisting of tetrakis methylene (3,5-di-tert-butyl-4-hydroxy hydrocinnamate) methane, bis-2-methyl-4-(N-2-hydroxyethyl-N-ethyl-aminophenyl)-phenylmethane, bis (4-diethylamino-2-methylphenyl) triphenyl methane, and the mixtures thereof.
11. A layer composition comprising an alcohol-soluble polyamide and a trisamino triphenyl compound having the following Formula II
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a die paddle having an internal portion with a trench along a perimeter of the die paddle;
forming an interconnect having a concave indentation and an upper portion, the upper portion, opposite the concave indentation, aligned horizontally to the internal portion;
attaching an integrated circuit device on the die paddle, the trench between the integrated circuit device and the perimeter;
attaching an electrical connector to the integrated circuit device and the upper portion; and
applying an encapsulation over the integrated circuit device, the electrical connector, the die paddle, and the interconnect, the concave indentation and non-horizontal curved sides of the interconnect surrounding the concave indentation exposed below the encapsulation.
2. The method as claimed in claim 1 wherein forming the interconnect having the concave indentation includes applying a conductive plating to cover the concave indentation while exposing non-horizontal sides of the interconnect.
3. The method as claimed in claim 1 further comprising applying a conductive plating on a side of the die paddle opposite the internal portion.
4. The method as claimed in claim 1 further comprising attaching a second electrical connector to the integrated circuit device and to a paddle bond site of the die paddle.
5. The method as claimed in claim 1 further comprising attaching a package connector to the concave indention with non-horizontal curved sides of the interconnect exposed from the package connector.