1. A method of processing a surface of a layer on a workpiece, the method comprising the steps:
degassing a process solution to form a degassed process solution; and
processing the surface of the layer using the degassed process solution.
2. The method claim 1, wherein the step of processing includes removing material from the surface of the layer.
3. The method of claim 2, wherein the step of removing includes at least one of chemical etching, chemical mechanical polishing, electrochemical polishing and electrochemical mechanical polishing.
4. An integrated circuit manufactured according to claim 1.
5. The method claim 1, wherein the step of processing includes depositing material onto the surface of the layer.
6. The method of claim 5, wherein the step of depositing includes at least one of electrochemical deposition, electrochemical mechanical deposition, chemical deposition and chemical mechanical deposition.
7. The method of claim 5, wherein the step of depositing material provides a conductive film having reduced electrical resistivity.
8. The method of claim 5, wherein the step of depositing material provides a conductive film having increased grain size.
9. The method of claim 1, wherein the step of processing includes cleaning the surface of the workpiece with the degassed process solution.
10. The method of claim 1, wherein the step of degassing the process solution reduces dissolved gas content in the process solution.
11. The method of claim 1, wherein dissolved oxygen content in the process solution is lowered and consumption of organic additives is reduced during the step of processing.
12. The method of claim 10, wherein the dissolved gas content comprises oxygen, nitrogen, carbon dioxide, and hydrogen.
13. The method of claim 1, wherein the step of processing the surface of the layer using the degassed process solution reduces bubble formation.
14. The method of claim 13, wherein the bubble formation on the surface of the layer is reduced.
15. The method of claim 1, wherein the step of processing the surface of the layer using the degassed process solution minimizes defects on the surface of the layer.
16. The method of claim 1, wherein the step of processing the surface of the layer using the degassed process solution minimizes chemical reaction between the process solution and the layer.
17. The method of claim 1, wherein the layer comprises of copper.
18. The method of claim 1, wherein the step of degassing is an in-situ degassing.
19. The method of claim 1, wherein the degassed process solution getters bubbles.
20. A method of depositing a layer on a workpiece surface comprising the steps:
supplying a process solution to a degasser;
degassing the process solution using the degasser to form a degassed process solution;
delivering the degassed process solution to a processing unit;
wetting the workpiece surface with the degassed process solution; and
depositing the layer.
21. The method of claim 20, wherein the step of depositing includes at least one of electrochemical deposition, electrochemical mechanical deposition and electroless deposition.
22. The method of claim 20, wherein the process solution includes at least one of electroplating solution and electroless deposition solution.
23. The method of claim 20 further comprising the step of recycling the degassed process solution.
24. The method of claim 20, wherein the workpiece surface includes a seed layer having a thickness less than 1000 and the step of degassing the process solution reduces an amount of dissolved gases in the process solution, thereby reducing a chemical interaction between the degassed process solution and the seed layer after the step of wetting and prior to the step of depositing.
25. An integrated circuit manufactured according to claim 20.
26-36. (canceled)
37. A method of forming a copper film on a workpiece having a copper seed layer using an electrochemical deposition process, the method comprising the steps:
immersing the copper seed layer in a degassed process solution; and
applying a potential between the copper seed layer and an electrode in electrical communication with the degassed process solution.
38. The method of claim 37, wherein the copper seed layer has a thickness less than 1000 .
39. An integrated circuit manufactured according to the method of claim 37.
40. A method of forming a copper film on a surface of a workpiece using an electroless deposition process, the method comprising the steps:
immersing the surface in a degassed process solution; and
depositing the copper film out of the degassed process solution.
41. The method of claim 40, further comprising the step of forming a barrier layer on the surface of the workpiece prior to the step of depositing the copper film.
42. The method of claim 41, further comprising the step of forming a seed layer on the barrier layer prior to the step of depositing the copper film.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable; and
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion.
2. The semiconductor inspection apparatus according to claim 1, wherein said connection portion has a single-layer or multilayer stacked stud bump projecting toward said spherical connection terminal which is loaded on said apparatus.
3. The semiconductor inspection apparatus according to claim 2, wherein said multilayer stacked stud bump is made of different kinds of metals.
4. The semiconductor inspection apparatus according to claim 1, wherein a surface of said connection portion is roughened.
5. The semiconductor inspection apparatus according to claim 1, wherein a surface of said connection portion has a metal film formed thereon, a material of said metal film being different from a material of said connection portion.
6. The semiconductor inspection apparatus according to claim 1, wherein a cut portion is formed in said shock absorbing member.
7. The semiconductor inspection apparatus according to claim 1, wherein said shock absorbing member comprises a combination of a plurality of division members.
8. The semiconductor inspection apparatus according to claim 1, wherein said connection portion includes a ring-shaped portion and an extending portion which extends from said ring-shaped portion toward a center of said ring-shaped portion.
9. The semiconductor inspection apparatus according to claim 1, wherein said connection portion has a nail-head shape.
10. The semiconductor inspection apparatus according to claim 1, wherein a cut portion is formed in said supporting film.
11. The semiconductor inspection apparatus according to claim 1, wherein said supporting film comprises a combination of a plurality of division film members.
12. The semiconductor inspection apparatus according to claim 1, wherein an electronic device is provided on a substrate which comprises said conductor layer and said supporting film.
13. The semiconductor inspection apparatus according to claim 1, wherein a projection portion is formed to said shock absorbing member at a position at which said shock absorbing member faces said connection portion, said projecting portion projecting toward said connection portion.
14. The semiconductor inspection apparatus according to claim 1, further comprising a supporting member which supports said shock absorbing member.
15. The semiconductor inspection apparatus according to claim 14, wherein said supporting member has one of a depression and a projection formed thereto at a position at which said supporting member faces said connection portion.
16. The semiconductor inspection apparatus according to claim 1, further comprising a positioning mechanism which performs positioning between said to-be-inspected device having said spherical connection terminal and said connection portion.
17. The semiconductor inspection apparatus according to claim 16, wherein said positioning mechanism comprises a guide pin.
18. The semiconductor inspection apparatus according to claim 16, wherein said positioning mechanism comprises a guide-pin-attached frame, said guide-pin-attached frame comprising a frame portion which holds said to-be-inspected device and a guide pin which is integrated with said frame portion.
19. The semiconductor inspection apparatus according to claim 18, wherein said frame portion of said guide-pin-attached frame covers and holds said to-be-inspected device, and said frame portion has a taper surface formed on an inner surface thereof for positioning said to-be-inspected device.
20. The semiconductor inspection apparatus according to claim 18, wherein said frame portion has an aligning mechanism formed thereto, said aligning mechanism performing an aligning process on said to-be-inspected device so that said spherical connection terminal can be positioned at said connection portion.
21. The semiconductor inspection apparatus according to claim 18, wherein said frame portion has a pressing mechanism, said pressing mechanism pressing said to-be-inspected device in a loaded condition to said conductor layer.
22. The semiconductor inspection apparatus according to claim 18, further comprising an elastic member having a shock absorbing function between said frame portion and said to-be-inspected device.
23. The semiconductor inspection apparatus according to claim 16, wherein said positioning mechanism comprises a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal.
24. The semiconductor inspection apparatus according to claim 23, wherein said positioning substrate is provided with a drawing mechanism for drawing said spherical connection terminal.
25. The semiconductor inspection apparatus according to claim 23, further comprising a substrate positioning mechanism for performing positioning between said hole and said connection portion.
26. An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable; and
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion,
said inspection method comprising the step of pressing said spherical connection terminal to said connection portion formed in said conductor layer so that elastic deformation occurs in said connection portion of said conductor layer and said shock absorbing member,
the elastic restoring force occurring in said connection portion and said shock absorbing member due to said elastic deformation causing said connection portion to be pressed to said spherical connection terminal so that electrical connection therebetween is provided.
27. An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion; and
a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
said inspection method comprising the steps of:
a) inserting said spherical connection terminal into said hole of said positioning substrate, and thus positioning said spherical connection terminal;
b) causing said spherical connection terminal to be electrically connected with said connection terminal while maintaining the condition where the positioning has been performed; and
c) performing a test of said to-be-inspected device.
28. An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion; and
a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
said inspection method comprising the step of vibrating at least one of said positioning substrate and said to-be-inspected device and thus positioning said spherical connection terminal in said hole of said positioning substrate.
29. An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion; and
a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion,
said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
said positioning substrate having a drawing mechanism for drawing said spherical connection terminal,
said inspection method comprising the steps of:
a) forming a suction path in said positioning substrate and connecting a suction apparatus to said suction path, and
b) positioning said spherical connection terminal in said hole of said positioning substrate as a result of said spherical connection terminal being drawn to said suction path.
30. An inspection method using a semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprises:
a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion,
a positioning mechanism for performing positioning between said to-be-inspected device having said spherical connection terminal and said connection portion is provided,
said positioning mechanism comprising a positioning substrate, said positioning substrate being located so as to face said to-be-inspected device which is loaded on said conductor layer, said positioning substrate having a hole which has a shape corresponding to said spherical connection terminal,
said positioning substrate having a drawing mechanism for drawing said spherical connection terminal,
said inspection method comprising the steps of:
a) forming said positioning substrate of a porous material and connecting a suction apparatus to said positioning substrate; and
b) positioning said spherical connection terminal in said hole of said positioning substrate as a result of said spherical connection terminal being drawn to said positioning substrate.