1-15. (canceled)
16. A method of fabricating a stent comprising:
forming a polymeric tube comprising a polymer using melt processing, wherein a diameter of the formed tube is less than a target diameter;
radially deforming the formed tube so that the deformed tube comprises the target diameter; and
forming a stent from the deformed tube, wherein forming the stent includes laser machining a stent pattern in the deformed tube at the target diameter with an ultra-short pulse laser.
17. The method of claim 16, wherein the melt processing comprises injection molding.
18. The method of claim 16, further comprising crimping the stent on a support element, wherein the stent is at the target diameter prior to crimping.
19. The method of claim 16, wherein the tube is radially deformed with an expansion ratio from 2 to 6.
20. The method of claim 16, wherein the polymer comprises poly(L-lactide).
21. The method of claim 16, further comprising crimping the stent on a support element, wherein a temperature of the stent during crimping is above an ambient temperature.
22. The method of claim 16, wherein the formed tube is at a temperature above the glass transition temperature (Tg) of the polymer during the radial deforming.
23. A method of manufacturing a stent comprising:
forming a stent with a target diameter from a polymeric tube comprising a polymer, wherein prior to forming the stent, the tube was radially deformed to the target diameter,
wherein the deformed tube has induced molecular orientation in the circumferential direction from the radial deformation,
wherein forming the stent includes laser machining a stent pattern in the deformed tube at the target diameter; and
crimping the stent on a support element, wherein the support element comprises a catheter andor balloon.
24. The method of claim 23, wherein the polymer comprises poly(L-lactide).
25. The method of claim 23, wherein a temperature of the stent during crimping is above an ambient temperature.
26. A method comprising:
radially deforming a polymeric tube comprising a polymer about a cylindrical axis of the tube to a target diameter to form a deformed tube; and
crimping a stent having the target diameter on a support element, the stent being fabricated from the deformed tube at the target diameter by cutting a stent pattern in the deformed tube, wherein the support element comprises a catheter andor balloon.
27. The method of claim 26, wherein a temperature of the stent during crimping is above an ambient temperature.
28. The method of claim 26, wherein the polymer comprises poly(L-lactide).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-7. (canceled)
8. A method for processing a microelectronic topography within a process chamber, comprising:
sealing an opening of the process chamber with a gate latch;
exposing the microelectronic topography to a first set of process steps subsequent to the step of sealing;
opening the gate latch such that an air passage is provided to the process chamber subsequent to the step of exposing the microelectronic topography to the first set of process steps; and
exposing the microelectronic topography to a second set of process steps subsequent to the step of opening the gate latch, wherein the opened gate latch is configured to inhibit liquids within the process chamber from entering the air passage during the step of exposing the microelectronic topography to the second set of process steps.
9. The method of claim 8, wherein the second set of process steps comprises drying the microelectronic topography.
10. The method of claim 8, wherein the first set of process steps comprises electrolessly depositing a layer upon the microelectronic topography.
11. The method of claim 8, further comprising loading the microelectronic topography into the process chamber.
12. The method of claim 11, wherein the step of loading comprises introducing the microelectronic topography into the process chamber through the opening.
13-14. (canceled)
15. The method of claim 11, wherein the step of loading comprises introducing the microelectronic topography into the process chamber through a different opening of the process chamber.
16-32. (canceled)
33. A method for processing a microelectronic topography within a process chamber, comprising:
moving a reservoir proximate to a substrate holder upon which the microelectronic topography is arranged; and
dispensing the fluids contained within the reservoir into an enclosed area laterally bound by the microelectronic topography and the reservoir.
34. The method of claim 33, wherein the step of dispensing comprises opening a hatch arranged along the base of the reservoir.
35. The method of claim 34, wherein the step of dispensing further comprises raising the hatch within the reservoir.
36. The method of claim 34, further comprising rotating the hatch subsequent to the step of opening the hatch.
37. The method of claim 36, wherein the step of rotating the hatch is conducted at rate sufficient to prevent the accumulation of bubbles upon the microelectronic topography during processing.
38. The method of claim 34, further comprising:
closing the hatch; and
raising the reservoir to a level spaced above the substrate holder subsequent to closing the hatch.
39. The method of claim 33, wherein the step of dispensing includes opening one or more valves arranged along a base of the reservoir.
40. The method of claim 39, further comprising backflowing the fluids through the valves upon completing the processing of the microelectronic topography.
41. (canceled)
42. A substrate holder, comprising:
a shaft coupled to a base platen; and
a rod inserted within an opening of the shaft and coupled to a second platen arranged above the base platen, wherein the substrate holder is configured to slide the rod within the shaft to move the second platen relative to the base platen.
43. The substrate holder of claim 42, further comprising one or more clamping jaws configured to inhibit vertical and lateral movement of a substrate arranged above the second platen.
44. The substrate holder of claim 43, wherein at least one of the one or more clamping jaws comprises:
a support member rigidly coupled to the base platen passing through the second platen; and
a lever pivotally coupled to the support member, wherein the lever is configured to tilt upon raising the second platen such that a portion of the lever is positioned over a portion of the substrate.
45. The substrate holder of claim 42, further comprising one or more pins rigidly coupled to the base platen and slidingly inserted within openings of the second platen.
46. The substrate holder of claim 45, wherein the one or more pins are configured to support a substrate when the second platen is lowered to a level below upper surfaces of the one or more pins.
47. The substrate holder of claim 42, further comprising an annular seal arranged upon the second platen.