1. An antimicrobial raw material comprising:
a substrate layer made of resin, natural fiber or paper, the resin having a deflection temperature under load of 115\xb0 C. or below as measured in accordance with ASTM-D648-56 under a load of 1,820 kPa; and
a copper-tin alloy layer disposed on the substrate layer, the copper-tin alloy layer containing over 60 atom % to 90 atom % of copper and 10 atom % to less than 40 atom % of tin,
wherein the copper-tin alloy layer has a thickness of 5 nm to 200 nm.
2. The antimicrobial raw material according to claim 1, wherein the copper-tin alloy layer contains 15 atom % to less than 40 atom % of tin, with the remaining portion substantially consisting of copper.
3. The antimicrobial raw material according to claim 1, wherein the substrate layer is made of material selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyethylene, and polypropylene.
4. The antimicrobial raw material according to claim 1, wherein Q value (\u03a9(nm\xb7Cu atom %)) is 0.001 to 0.007, the Q value being obtained by dividing a sheet resistance (\u03a9) of the copper-tin alloy layer by a product of thickness of (nm) and copper atom content (Cu atom %) of the copper-tin alloy layer.
5. An antimicrobial raw material comprising:
a substrate layer; and
a copper-tin alloy layer disposed on the substrate layer, the copper-tin alloy layer formed by simultaneous vapor deposition using an evaporation source composed of a copper-tin alloy containing over 60 atom % to 85 atom % of copper and 15 atom % to less than 40 atom % of tin, the copper-tin alloy layer having a thickness of 5 nm to 200 nm.
6. The antimicrobial raw material according to claim 1, wherein the copper-tin alloy layer covers the entire or part of an outermost surface of the antimicrobial raw material.
7. The antimicrobial raw material according to claim 1, wherein the antimicrobial raw material is a film, and when the film is 4 cm in width, 10 cm in length and 25 \u03bcm in thickness, an amount of curvature is 2 mm or less.
8. The antimicrobial raw material according to claim 1, wherein the substrate layer is a nonwoven fabric, woven fabric or yarn.
9. A method for producing an antimicrobial raw material, comprising:
providing an evaporation source composed of an copper-tin alloy containing over 60 atom % to 85 atom % of copper and 15 atom % to less than 40 atom % of tin;
placing a substrate so as to face the evaporation source;
evaporating the copper-tin alloy from the evaporation source to generate a metal vapor; and
allowing the metal vapor to contact the substrate to deposit thereon a copper-tin alloy layer containing over 60 atom % to 90 atom % of copper and 10 atom % to less than 40 atom % of tin.
10. The method according to claim 9, wherein the substrate is made of resin, natural fiber or paper, the resin having a deflection temperature under load of 115\xb0 C. or below as measured in accordance with ASTM-D648-56 under a load of 1,820 kPa.
11. An antimicrobial material comprising the antimicrobial raw material according to claim 1.
12. The antimicrobial material according to claim 11, wherein the antimicrobial material is used as a touch panel protection film.
13. The antimicrobial material according to claim 11, wherein the antimicrobial material is used as medical material.
14. The antimicrobial material according to claim 11, wherein the antimicrobial material is used as purification material.
15. The antimicrobial raw material according to claim 5, wherein the copper-tin alloy layer covers the entire or part of an outermost surface of the antimicrobial raw material.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A bonding structure of optical members having a first optical member, a second optical member, a first support member supporting the first optical member, and a second support member supporting the second optical member, wherein the first support member is bonded to the second support member, comprising a construction such that:
(1) the first support member and the second support member are bonded with each other via a hardened acrylic resin adhesive under a condition such that an optical axis of the first optical member and an optical axis of the second optical member are optically aligned with each other with an accuracy of within 1 m; and
(2) a viscosity of the acrylic resin adhesive before hardening is larger than 500 cP and lower than 5000 cP.
2. The bonding structure according to claim 1, wherein the first optical member is a laser diode and the second optical member is an optical waveguide substrate, wherein an optical axis of the laser diode and an optical axis of the optical waveguide are optically aligned with each other with an accuracy of within 1 m.
3. The bonding structure according to claim 1, wherein a surface of the first support member is coated by a gold film.
4. The bonding structure according to claim 1, wherein the acrylic resin adhesive is an ultraviolet ray hardening type.