1. A food waste disposer comprising:
a food conveying section, a motor section and a grinding section, the grinding section disposed between the food conveying section and the motor section, the food conveying section conveying food waste to the grinding section;
the grinding section including a grind mechanism, the grind mechanism including a stationary grind ring and a rotating shredder plate assembly; and
the stationary grinding ring comprising an aggressive grind ring that includes horizontal shredder elements and openings therein in spaced relationship to each other around a circumference of the stationary grind, the openings in a major circumferential portion of the stationary grind ring blocked so that comminuted food waste can exit the grinding section only through the openings in a minor circumferential portion of the stationary grind ring.
2. The food waste disposer of claim 1 wherein the major circumferential portion extends around approximately seventy percent of the circumference of the stationary grind ring and the minor circumferential portion extends around a remaining approximately thirty percent of the circumference of the stationary grind ring.
3. The food waste disposer of claim 1 wherein the openings include long openings that extend upwardly from a lower edge of the stationary grind ring with upper edges that are spaced from an upper edge of the stationary grind ring and mid-openings that extend above and below a mid-point of the stationary grind ring with lower edges spaced from a lower edge of the stationary grind ring and upper edges spaced from the upper edge of the stationary grind ring.
4. The food waste disposer of claim 3 wherein a plurality of the long openings and the mid-openings alternate around the major circumferential portion and another plurality of the long openings are disposed adjacent each other around the minor circumferential portion of the stationary grind ring without any mid-openings disposed therebetween.
5. The food waste disposer of claim 3 wherein the horizontal shredder elements extend radially inwardly from the upper edges of the long and mid-openings and from lower edges of the mid-openings.
6. The food waste disposer of claim 1 wherein the rotating shredder plate assembly includes a rotating shredder plate, and further including an adapter ring in which the stationary grind ring is received and a resilient seal that seals the adapter ring to an upper end bell of the grinding section and the rotating shredder plate, the resilient seal disposed around a lower portion of an outside of the stationary grind ring between a bottom of the adapter ring and a top of the upper end bell and along a bottom of an outer edge of the rotating shredder plate.
7. The food waste disposer of claim 6 wherein the adapter ring is solid behind the openings in the major circumferential portion and blocks those openings.
8. The food waste disposer of claim 1 wherein the horizontal shredder elements extending radially inwardly from at least upper edges of the openings.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for patterning a substrate, the method comprising:
identifying a critical dimension signature that spatially characterizes observed critical dimension values of structures on substrates corresponding to a substrate to be processed;
coating the substrate with a patterning film, the patterning film being at least initially radiation-sensitive in that a solubility of the patterning film is changeable by exposure to actinic radiation;
projecting a pattern of electromagnetic radiation onto the patterning film coated on the substrate, the pattern of electromagnetic radiation being projected using a digital pixel-based projection system having an array of independently addressable projection points, the projected pattern being based on the critical dimension signature; and
subsequent to the substrate being processed via a photolithographic exposure process, developing the patterning film such that soluble portions of the patterning film are removed resulting in remaining portions of the patterning film forming a relief pattern on the substrate.
2. The method of claim 1, wherein projecting the pattern of electromagnetic radiation includes projecting electromagnetic radiation having a wavelength less than about 1000 nanometers.
3. The method of claim 2, wherein the projected electromagnetic radiation has a wavelength less than about 200 nanometers.
4. The method of claim 1, wherein the critical dimension signature identifies variations in critical dimensions corresponding to physical locations on a representative substrate that has been processed by a specific photolithography exposure system.
5. The method of claim 1, wherein the digital pixel-based projection system is configured to vary an amount of electromagnetic radiation projected by point location on the projected pattern.
6. The method of claim 1, wherein using a digital pixel-based projection system includes using a micro-mirror projection device that reflects electromagnetic radiation onto the substrate from a light source.
7. The method of claim 1, wherein the patterning film includes a photo acid generator; and
wherein projecting the pattern of electromagnetic radiation onto the patterning film causes photo acid to form in the patterning layer according to the pattern of electromagnetic radiation.
8. The method of claim 1, wherein projecting the pattern of electromagnetic radiation onto the patterning film provides a pre-dose of electromagnetic radiation prior to a receiving a mask-based lithographic exposure.
9. The method of claim 1, wherein projecting the pattern of electromagnetic radiation onto the patterning film provides a dose of electromagnetic radiation that is executed subsequent to a receiving a mask-based lithographic exposure.
10. The method of claim 1, wherein projecting the pattern of electromagnetic radiation includes projecting light onto the surface of the substrate via a digital light processing (DLP) device.
11. The method of claim 10, wherein the digital light processing device is configured to vary a light intensity of each independently addressable pixel.
12. A method for patterning a substrate, the method comprising:
identifying a critical dimension signature that spatially characterizes critical dimension values of structures corresponding to a substrate to be processed;
calculating an image based on the critical dimension signature;
projecting the image onto a patterning film deposited on the substrate, the image being projected as a pattern of electromagnetic radiation and projected using a digital pixel-based projection system having an array of independently addressable projection points; and
subsequent to the substrate being processed via a photolithographic exposure process, developing the patterning film such that soluble portions of the patterning film are removed resulting in remaining portions of the patterning film forming a relief pattern on the substrate.
13. The method of claim 12, wherein the critical dimension signature identifies variations in critical dimensions corresponding to physical locations on a representative substrate that has been processed by a specific photolithography exposure system.
14. The method of claim 12, wherein the digital pixel-based projection system is configured to vary an amount of electromagnetic radiation projected by point location on the projected pattern; and
wherein using a digital pixel-based projection system includes using a micro-mirror projection device that reflects electromagnetic radiation onto the substrate from a light source.
15. The method of claim 12, wherein the patterning film includes a photo acid generator; and
wherein projecting the pattern of electromagnetic radiation onto the patterning film causes photo acid to form in the patterning layer according to the pattern of electromagnetic radiation.
16. The method of claim 12, wherein projecting the pattern of electromagnetic radiation onto the patterning film is selectively executed either prior to a mask-based lithographic exposure or subsequent to mask-based lithographic exposure.
17. The method of claim 12, wherein projecting the pattern of electromagnetic radiation includes projecting light onto the surface of the substrate via a digital light processing (DLP) device; and
wherein the digital light processing device is configured to vary a light intensity of each independently addressable pixel.
18. A method for patterning a substrate, the method comprising:
identifying a critical dimension signature that spatially characterizes critical dimension values of structures corresponding to a substrate to be processed;
calculating an image based on the critical dimension signature;
projecting the image onto a patterning film deposited on the substrate, the image being projected as a pattern of electromagnetic radiation and generated using a digital pixel-based projection system having an array of independently addressable projection points, the pattern of electromagnetic radiation causing a first solubility shift in the patterning film; and
executing a reticle-based photolithographic exposure process, the reticle-based photolithographic exposure process causing a second solubility shift in the patterning film, the first solubility shift and the second solubility shift combined defining a latent pattern in the patterning film in that the latent pattern comprises portions of the patterning film that are soluble to a given developer.
19. The method of claim 18, wherein executing the reticle-based photolithographic exposure process occurs subsequent to projecting the image onto the patterning film using the digital pixel-based projection system.
20. The method of claim 18, wherein executing the reticle-based photolithographic exposure process occurs prior to projecting the image onto the patterning film using the digital pixel-based projection system.