1. A method for manufacturing a semiconductor device comprising:
forming a plurality of first metals on a first support;
mounting a plurality of first semiconductor chips on the first support so as to be adjacent to some of the plurality of first metals;
coupling adjacent first semiconductor chip among the plurality of first semiconductor chips to each other with a first wire over the first metals;
forming a plurality of second metals on a second support;
joining the first support and the second support by respectively coupling the plurality of first metals and the plurality of second metals to each other so as to sandwich the first wire;
forming a resin that molds the plurality of first semiconductor chips by filling an area between the first support and the second support with a resin;
peeling off the first support and the second support from the resin; and
cutting the resin so as to include the first semiconductor chip.
2. The method for manufacturing a semiconductor device according to claim 1, wherein
the forming of the plurality of first metals is forming the plurality of first metals by pressing the first metals into a plurality of recesses provided on the first support; and
the forming of the plurality of second metals is forming the plurality of second metals by pressing the second metals into a plurality of recesses provided on the second support.
3. The method for manufacturing a semiconductor device according to claim 1, further comprising:
planarizing a top part of the plurality of first metals prior to the coupling of the adjacent first semiconductor chips to each other with the first wire over the first metals; and
planarizing a top part of the plurality of second metals prior to the joining of the first support and the second support.
4. The method for manufacturing a semiconductor device according to claim 1, wherein
the forming of the plurality of first metals is forming the plurality of first metals on the first support so as to sandwich the first film; and
the forming of the plurality of second metals is forming the plurality of second metals on the second support so as to sandwich the second film.
5. The method for manufacturing a semiconductor device according to claim 1, wherein
the first support includes a first through-hole which runs through the first support;
the second support includes a second through-hole which runs through the second support; and
the peeling off of the first support and the second support from the resin is peeling off the first support and the second support from the resin by pumping in air through the first through-hole and the second through-hole.
6. The method for manufacturing a semiconductor device according to claim 1, further comprising:
forming a first conductor in a circumference of the first support; and
coupling the first semiconductor chip adjacent to the first conductor to the first conductor with the first wire over the first metals.
7. The method for manufacturing a semiconductor device according to claim 1, further comprising:
forming a second conductor in between the adjacent first semiconductor chips; wherein the coupling of the adjacent first semiconductor chips to each other with the first wire over the first metals comprises:
coupling the adjacent first semiconductor chips to each other with the first wire over the first metals via the second conductor.
8. The method for manufacturing a semiconductor device according to claim 1, further comprising:
mounting a plurality of second semiconductor chips respectively on the plurality of first semiconductor chips; and
coupling adjacent second semiconductor chips to each other with a second wire over the first metals; wherein the joining of the first support and the second support is joining the first support and the second support by coupling the plurality of first metals and the plurality of second metals so as to sandwich the first wire and the second wire respectively.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system for handling a plurality of voice mail systems, comprising:
a voice mail broker;
a plurality of voice mail systems operating independently of each other, and each coupled to the voice mail broker through an adapter so that each of the plurality of voice mail systems communicate messages to and from the voice mail broker;
means for at least one voice mail system sending to the voice mail broker a request to retrieve voice mail messages;
means for the voice mail broker to manipulate the request, including reencoding to and from generic formats;
means for the voice mail broker forwarding the request to other voice mail systems within the plurality of voice mail systems;
means for the voice mail broker receiving a remote voice mail message sent by any of the plurality of voice mail systems; and
means for the voice mail broker forwarding the received remote voice mail messages to the one of the voice mail systems that sent the request to the voice mail broker to retrieve voice mail messages pertaining to the user of the voice mail system sending the request.
2. The system as recited in claim 1, further comprising:
means for playing in the at least one voice mail system a voice mail message received from the voice mail broker.
3. The system as recited in claim 1, further comprising:
means for associating multiple adapters with the voice mail broker.
4. The system as recited in claim 1, wherein the adapter is selected from the group consisting of a DTMF adapter, a VoIP adapter, and a web service adapter.
5. A method for coalescing voice mail messages for a user through a voice mail broker coupled to first and second voice mail systems operating independently of each other, comprising the steps of:
sending from the first voice mail system to the voice mail broker a request to retrieve a voice mail message sent to the user in the second voice mail system;
the voice mail broker manipulating the requests;
the voice mail broker forwarding the request to the second voice mail system;
the voice mail broker receiving the voice mail message sent by the second voice mail system in response to the forwarded request; and
the voice mail broker forwarding the received voice mail message to the first voice mail system.
6. The method as recited in claim 5, further comprising the step of:
the first voice mail system playing the received voice mail message to the user.
7. (canceled)
8. A voice mail broker comprising:
adapters for coupling to a plurality of voice mail systems operating independently of each other, the adapters configured so that each of the plurality of voice mail systems communicate messages to and from the voice mail broker;
circuitry for receiving from one of the plurality of voice mail systems to the voice mail broker a request to retrieve voice mail messages pertaining to a user of the voice mail system sending the request;
circuitry for manipulating the inbound and outbout requests while they are within a computational context of the broker;
circuitry for forwarding the request to the user’s other voice mail systems within the plurality of voice mail systems;
circuitry for receiving remote voice mail messages sent by the user’s other voice mail systems within the plurality of voice mail systems; and
circuitry for forwarding the received remote voice mail messages to the one of the voice mail systems that sent the request to the voice mail broker to retrieve voice mail messages pertaining to the user of the voice mail system sending the request.
9. The voice mail broker as recited in claim 8, further comprising:
circuitry for determining which of the plurality of voice mail systems pertain to the user.
10. The voice mail broker as recited in claim 8, wherein one of the adapters is a DTMF adapter.
11. The voice mail broker as recited in claim 8, wherein one of the adapters is a VoIP adapter.
12. The voice mail broker as recited in claim 8, wherein one of the adapters is a web service adapter.
13. A computer program product stored on a computer readable medium for implementing a voice mail broker, comprising the program steps of:
receiving from one of a plurality of voice mail systems a request to retrieve voice mail messages pertaining to a user of the voice mail system sending the request;
manipulating the inbound and outbound requests while they are in the computational domain of the voice mail broker;
forwarding the request to the user’s other voice mail systems within the plurality of voice mail systems;
receiving remote voice mail messages sent by the user’s other voice mail systems within the plurality of voice mail systems; and
forwarding the received remote voice mail messages to the one of the voice mail systems that sent the request to the voice mail broker to retrieve voice mail messages pertaining to the user of the voice mail system sending the request.
14. A computer program product as recited in claim 13, further comprising the program steps of:
determining which of the plurality of voice mail systems pertain to the user.