1. An information handling system (IHS) comprising:
a system processor;
a wireless section coupled to the system processor;
wherein, while the system processor remains in a reduced power state, the wireless section is operable to be powered up to detect the presence of a wireless network external to the IHS and determine if that detected wireless network matches a network included in profile information stored in a memory that is accessible by the wireless section; and
an indicator that is coupled to the wireless section and is operable to provide an indication that a wireless network is present.
2. The system of claim 1, wherein the profile information comprises at least one preferred wireless network.
3. The system of claim 2, wherein the indicator is operable to provide an indication that the at least one preferred wireless network is present.
4. The system of claim 1, wherein the profile information comprises at least one authorized wireless network.
5. The system of claim 4, wherein the indicator is operable to provide an indication that the at least one authorized wireless network is present.
6. The system of claim 1, wherein the profile information comprises at least one location associated with a wireless network that is accessible by the IHS in a particular location.
7. The system of claim 6, wherein the indicator is operable to provide an indication of the at least one location associated with the accessible wireless network.
8. The system of claim 1, wherein the profile information comprises at least one broadcasting wireless network.
9. The system of claim 8, wherein the indicator is operable to provide an indication that the at least one broadcasting wireless network is present.
10. The system of claim 1, wherein the profile information comprises at least one non-broadcasting wireless network.
11. The system of claim 10, wherein the indicator is operable to provide an indication that the at least one non-broadcasting wireless network is present.
12. The system of claim 1, wherein the indicator is operable to provide an indication of a technology type of a wireless network that is present.
13. The system of claim 12, wherein the technology type of a wireless network that present is selected from the group consisting of a Wireless Local Area Network (WLAN) type, a Mobile Broadband type, a Wireless Personal Area Network (WPAN) type, a Wireless Wide Area Network (WWAN) type, an Wi-Fi (802.11) type, a Bluetooth type, an Ultra Wide Band (UWB) type, a General Packet Radio Service (GPRS) type, a Third Generation Wireless (3G) type, a Cellular Digital Packet Data (CDPD) type, a High Speed Circuit Switched Data (HSCSD) type, a Packet Data Cellular (PDC-P) type, a 1x Radio Transmission Technology (1xRTT) type, a Multichannel Multipoint Distribution Service (MMDS) type, a Local Multipoint Distribution Service (LMDS) type, a WorldWide Interoperability for Microwave Access (WiMAX) type, an Interoperable Universal Two Way Cordless Infrared Light Transmission Data Port (IrDA) type, an Enhanced Data rates for GSM Evolution (EDGE) type, an Enhanced GPRS (EGPRS) type, an Infrared (IR) type, a Global System for Mobile Communications (GSM) type, a Code Division Multiple Access (CDMA) type, a Time Division Multiple Access (TDMA) type, a Wireless Internete-mail Service Providers (WISPs) type, a High Speed Downlink Packet Access (HSDPA) type, a High Speed Uplink Packet Access (HSUPA) type, a Long Term Evolution (LTE) type, and combinations thereof.
14. The system of claim 1, wherein the indicator is operable to provide an indication of a signal strength of a wireless network that is present.
15. The system of claim 1, wherein the wireless section is operable to detect the presence of a plurality of wireless networks to determine if the plurality of detected wireless networks match a plurality of networks included in the profile information, and the indicator is operable to indicate that a plurality of wireless networks are present.
16. The system of claim 15, wherein the indicator is operable to provide an indication of a name of each of the plurality of wireless networks that are present.
17. The system of claim 15, wherein the indicator is operable to provide an indication of a signal strength of each of the plurality of wireless networks that are present.
18. The system of claim 15, wherein the indicator is operable to provide an indication of a location of each of the plurality of wireless networks that are present.
19. The system of claim 15, wherein the indicator is operable to provide an indication of a technology type of each of the plurality of wireless networks that are present.
20. An information handling system (IHS) comprising:
a system processor;
a wireless section coupled to the system processor;
wherein, while the system processor remains in a reduced power state, the wireless section is operable to be powered up to detect the presence of a wireless network external to the IHS and determine if that detected wireless network matches a network included in profile information stored in a memory that is accessible by the wireless section; and
an indicator that is coupled to the wireless section and is operable to provide an indication that a wireless network is present, wherein the indicator is operable to provide an indication of a preferred status of each of the plurality of wireless networks that are present.
21. An information handling system (IHS) comprising:
a system processor;
a wireless section coupled to the system processor;
wherein, while the system processor remains in a reduced power state, the wireless section is operable to be powered up to detect the presence of a wireless network external to the IHS and determine if that detected wireless network matches a network included in profile information stored in a memory that is accessible by the wireless section; and
an indicator that is coupled to the wireless section and is operable to provide an indication that a wireless network is present, wherein the indicator is operable to provide an indication of an authorized status of each of the plurality of wireless networks that are present.
22. A wireless card for an information handling system (IHS), comprising:
an indicator operable to provide an indication that a wireless network is present;
a wireless card controller coupled to the indicator, the wireless card controller operable to both detect the presence of a wireless network and determine if that detected network matches a network included in profile information that is stored in a memory accessible to the wireless card controller while a system processor in the IHS is in a reduced power state, wherein, upon a wireless network being detected, the wireless card controller directs the indicator to provide the indication; and
wherein the wireless card controller is operable to receive power from the IHS while the system processor in the IHS remains in the reduced power state.
23. The card of claim 22, wherein the indicator is operable to provide an indication that at least one preferred wireless network is present.
24. The card of claim 22, wherein the indicator is operable to provide an indication that at least one authorized wireless network is present.
25. The card of claim 22, wherein the indicator is operable to provide an indication of the location of a wireless network wireless network that is present.
26. The card of claim 22, wherein the indicator is operable to provide an indication of a technology type of a wireless network that is present.
27. The card of claim 22, wherein the indicator is operable to provide an indication of a signal strength of a wireless network that is present.
28. A method of operating an information handling system (IHS) comprising:
powering up a wireless section of an IHS to detect a presence of a wireless network while a system processor remains in a reduced power state; and
determining, while the system processor remains in the reduced power state, if a detected network matches a network included in profile information stored in a memory that is accessible to the wireless section.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device, comprising:
a semiconductor substrate having at least two cell array regions and a peripheral circuit array region between the cell array regions, the two cell array regions being opposite each other across the peripheral circuit array region;
a plurality of process monitoring patterns disposed in the peripheral circuit array region; and
a plurality of inputoutput (IO) pads, each IO pad being disposed above at least one corresponding process monitoring pattern including a conductive material, each IO pad being electrically insulated from the at least one corresponding process monitoring pattern including the conductive material disposed thereunder and being electrically connected to a semiconductor circuit included in at least one of the cell array regions,
wherein the IO pads and the corresponding process monitoring patterns are vertically aligned and overlap each other.
2. The device as claimed in claim 1, further comprising a trench recessed in the semiconductor substrate.
3. The device as claimed in claim 2, wherein the plurality of process monitoring patterns include a first process monitoring pattern on the semiconductor substrate having a first oxide pattern filled in the trench.
4. The device as claimed in claim 3, wherein the plurality of process monitoring patterns include a second process monitoring pattern including the conductive material disposed on substantially an entire planar surface of the second process monitoring pattern.
5. The device as claimed in claim 4, wherein the plurality of process monitoring patterns include a third process monitoring pattern having a second oxide pattern with at least one opening and a conductive material pattern filling the at least one opening.
6. The device as claimed in claim 5, wherein the third process monitoring pattern includes a second dam region surrounding the opening.
7. The device as claimed in claim 6, wherein the second dam region is a region of the third process monitoring pattern where the first insulating layer is formed.
8. The device as claimed in claim 5, wherein the plurality of process monitoring patterns include a fourth process monitoring pattern having a fourth oxide pattern disposed on substantially an entire planar surface of the fourth process monitoring pattern.
9. The device as claimed in claim 2, wherein the trench has a smaller planar area than each IO pad.
10. The device as claimed in claim 9, further comprising a first dam region surrounding a vicinity of the trench and arranged under each IO pad.
11. The device as claimed in claim 10, wherein the first dam region is formed on a surface of the semiconductor substrate.
12. A semiconductor device, comprising:
a semiconductor substrate having at least two cell array regions and a peripheral circuit array region between the cell array regions, the two cell array regions being opposite each other across the peripheral circuit array region;
a plurality of process monitoring patterns disposed in the peripheral circuit array region; and
a plurality of inputoutput (IO) pads, each IO pad being disposed above at least one corresponding process monitoring pattern including a conductive material, each IO pad being electrically insulated from the at least one corresponding process monitoring pattern including the conductive material disposed thereunder and being electrically connected to a semiconductor circuit included in at least one of the cell array regions, the IO pads and the corresponding process monitoring patterns being vertically aligned and overlapping each other,
the plurality of process monitoring patterns include,
a first process monitoring pattern including a trench, a first oxide pattern in the trench, a first dam region surrounding a vicinity of the trench, the first dam region being a portion of the semiconductor substrate;
a second process monitoring pattern including a conductive material layer disposed on substantially an entire planar surface of the second process monitoring pattern;
a third process monitoring pattern including a second oxide pattern with at least one opening and a conductive material pattern filling the at least one opening and a second dam region surrounding the opening, the second dam region being a region of the third process monitoring pattern where the first insulating layer is formed; and
a fourth process monitoring pattern including a fourth oxide pattern disposed on substantially an entire planar surface of the fourth process monitoring pattern.
13. A semiconductor device, comprising:
a circuit region including at least two cell array regions and a peripheral circuit array region between the cell array regions, and the two cell array regions being opposite each other across the peripheral circuit array region;
an inputoutput (IO) pad array region including a plurality of IO pads; and
a plurality of process monitoring patterns, at least one of the process monitoring patterns overlapping with at least one of the IO pads, wherein:
each IO pad is disposed above at least one correspond process monitoring pattern including a conductive material, each IO pad being electrically insulated from the at least one corresponding process monitoring pattern including the conductive material disposed thereunder and being electrically connected to a semiconductor circuit included in at least one of the cell array regions, and
the IO pads and the corresponding process monitoring patterns are vertically aligned and overlap each other.
14. The devices as claimed in claim 13, wherein the circuit region includes the semiconductor circuit electrically connected to the corresponding IO pad and electrically insulated from the corresponding process monitoring pattern.
15. A semiconductor module comprising:
a module substrate;
semiconductor devices disposed on the module substrate; and
contact terminals disposed at edge of the module substrate,
wherein at least one of the semiconductor devices includes:
a semiconductor substrate having at least two cell array regions and a peripheral circuit array region between the cell array regions, the two cell array regions being opposite each other across the peripheral circuit array region;
a plurality of process monitoring patterns disposed in the peripheral circuit array region; and
a plurality of inputoutput (IO) pads, each IO pad being disposed above at least one corresponding process monitoring pattern including a conductive material, each IO pad being electrically insulated from the at least one corresponding process monitoring pattern including the conductive material disposed thereunder and being electrically connected to a semiconductor circuit included in at least one of the cell array regions, and the IO pads and the corresponding process monitoring patterns being vertically aligned and overlapping each other.
16. An electronic apparatus comprising,
a housing;
a memory unit in the housing, the memory unit including a semiconductor device;
an inputoutput unit; and
a controller to control the memory unit and the inputoutput unit,
wherein the semiconductor device includes:
a semiconductor substrate having at least two cell array regions and a peripheral circuit array region between the cell array regions, the two cell array regions being opposite each other across the peripheral circuit array region;
a plurality of process monitoring patterns disposed in the peripheral circuit array region; and
a plurality of inputoutput (IO) pads, each IO pad being disposed above at least one corresponding process monitoring pattern including a conductive material, each IO pad being electrically insulated from the at least one corresponding process monitoring pattern including the conductive material disposed thereunder and being electrically connected to a semiconductor circuit included in at least one of the cell array regions, and the IO pads and the corresponding process monitoring patterns being vertically aligned and overlapping each other.