1. A bus rooftop air conditioner module comprising:
a housing;
an evaporator section disposed in said housing and having a fan for circulating return air from the passenger compartment of a bus, through an evaporator coil to a supply air duct and to the passenger compartment; and
a condenser section disposed in said housing and having a condenser coil with a fan for drawing outside air into an inlet opening on one side of a vertical plane and through said condenser coil and discharging it from a discharge opening on the other side of the vertical plane wherein said condenser fan is a tangential fan with its axis disposed horizontally and including a drain pan disposed below said condenser coil and said condenser fan, said drain pan being generally planer in form, but having a portion which is disposed under said fan and is curvilinear in form to act as an air guiding wall for the fan.
2. A bus rooftop air conditioner module as set forth in claim 1 and including a back wall that defines an outer boundary of the air flow stream from the high pressure side of the fan, said back wall being angled away from the vertical plane.
3. A bus rooftop air conditioner module as set forth in claim 1 and including a grill in the condenser discharge opening, said grill having a plurality of fins that are angled away from the vertical plane.
4. A bus rooftop air conditioner module as set forth in claim 1 and including a refrigeration circuit that includes said condensing coil and said evaporator coil, a compressor and an expansion valve.
5. A bus rooftop air conditioner module as set forth in claim 4 and including an inverter electrically connected to said compressor and to drive motors for said condenser and evaporator fans.
6. A bus rooftop air conditioner module as set forth in claim 1 wherein said module is adaptable to be mounted in tandem on the bustop with an identical module, with each extending transversely from a point near a longitudinal centerline of the bus to a point near its outer side.
7. An air conditioning module for installation on a bus having a supply air duct for conducting the flow of conditioned air to a passenger compartment and for conducting the flow of stale air from the passenger compartment, comprising:
a housing for selective placement on the bus and having a supply air outlet opening being disposed adjacent the supply air duct and a return air intake opening disposed adjacent the return air duct;
an evaporator coil disposed in said housing and having an associated fan for circulating return air from said return air intake opening, through said evaporator coil and outside supply air duct; and
a condenser coil disposed in said housing and having an associated fan for circulating fresh air from a condenser fresh air intake opening in said housing, through said condenser coil and out a condenser outlet air opening; wherein said associated fan is a transverse fan positioned adjacent said condenser air outlet opening including a drain pan located below said condenser coil and fan, said drain pan being substantially planer in form but having a curvilinear portion disposed under the fan to act as a guiding wall for the air flowing through said fan.
8. An air conditioning module as set forth in claim 7 wherein said condenser fresh air intake opening is adjacent said condenser outlet air opening with said openings being separated by a vertical plane therebetween and further wherein said housing includes a wall on a downstream side of said fan, with said wall being disposed at an angle from the vertical plane so as to facilitate the discharge flow at an angle from said vertical plane.
9. An air conditioning module as set forth in claim 8 and including a grill disposed in said condenser outlet air opening, said grill having a plurality of fins which are disposed at an angle with respect to a vertical plane to thereby facilitate the discharge of flow at an angle from the vertical plane.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of assembling a ball grid array (BGA) package, comprising the steps of:
(A) mounting an IC die in a centrally located cavity of a substantially planar first surface of a stiffener;
(B) attaching the first surface of a substrate to a substantially planar second surface of the stiffener that is opposed to the first surface of the stiffener, such that a centrally located protruding portion on the second surface of the stiffener opposed to the centrally located cavity extends through an opening in the substrate; and
(C) coupling a wire bond from a bond pad of the IC die to a contact pad on the first surface of the substrate through a through-pattern in the stiffener.
2. The method of claim 1, wherein step (C) comprises the step of:
coupling the wire bond through a recessed edge portion of the first and second surfaces of the stiffener.
3. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through a rectangular shaped recessed edge portion of the first and second surfaces of the stiffener.
4. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through a notch formed in a recessed edge portion of the first and second surfaces of the stiffener.
5. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through an opening through the stiffener.
6. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through a notch formed in an opening in the stiffener.
7. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through a rectangular shaped opening in the stiffener.
8. The method of claim 1, wherein step (C) includes the step of:
coupling the wire bond through an opening in the stiffener that has an edge that coincides with an edge of the cavity.
9. The method of claim 1, further comprising the step of:
substantially filling a gap around the protruding portion between the protruding portion and the substrate with a sealant material.
10-88. (canceled)
89. A method of forming a stiffener for use in a ball grid array (BGA) package, comprising the steps of:
(A) forming a cavity in a central location of a first surface of a substantially planar body such that an opposed second surface of the body has a centrally located protruding portion that opposes the cavity; and
(B) forming at least one recessed portion in an edge of the first and second surfaces.
90. The method of claim 89, further comprising the step of:
(C) performing steps (A) and (B) simultaneously by forming the stiffener according to a mold process.
91. The method of claim 89, wherein step (A) comprises the step of:
stamping the cavity into the body.
92. The method of claim 89, further comprising the step of:
(C) separating the body from a metal sheet.
93. The method of claim 89, wherein step (B) comprises the step of:
cutting the at least one recessed portion out of the edge.