1. A method for identifying a cancer in an individual that is susceptible to treatment with a Met inhibitor comprising:
a. isolating a biological sample from an individual; and
b. detecting the presence or absence of amplification of the Met gene, wherein the presence of amplification indicates that the cancer is susceptible to PHA-665752 or PF-02341066.
2. The method of claim 1, wherein amplification of the Met gene is analyzed by detecting increased Met gene copy number or increased Met protein expression.
3. The method of claim 2, wherein the Met gene copy number andor increased Met protein expression is determined by PCR, qPCR, RT-PCR, Southern Blot, comparative genomic hybridization, microarray based comparative genomic hybridization, fluorescence in situ hybridization (FISH), immunohistochemisty (IHC), ligase chain reaction (LCR), transcription amplification, LAMP or self-sustained sequence replication.
4. The method of claim 2, wherein amplification of the Met gene is detected using a probe.
5. The method of claim 4, wherein the probe is nucleic acid, antibody, antibody fragment, or aptamer.
6. The method of claim 1, wherein the cancer is selected from the group consisting of gastrointestinal cancer, prostate cancer, ovarian cancer, breast cancer, head and neck cancer, lung cancer, non-small cell lung cancer, cancer of the nervous system, kidney cancer, retina cancer, skin cancer, liver cancer, pancreatic cancer, genital-urinary cancer, esophageal cancer and bladder cancer.
7. The method of claim 1, wherein the biological sample is selected from the group consisting of a tumor sample, a paraffin embedded tumor sample, a frozen tumor sample, and a cell sample.
8. A method for treating cancer comprising identifying a patient with cancer characterized by amplification of the Met gene andor overexpression of the Met receptor and administering to the identified patient PHA-665752 or PF-02341066.
9. A method to direct treatment of a subject with a cancer, wherein the expression of the Met gene in an individual is associated with a status, and the status is utilized for the direction of treatment, wherein the status of an individual as having amplification of the Met gene directs treatment of the individual with a PHA-665752 or PF-02341066.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor wafer assembly, comprising:
a first wafer layer, including a number of chip sized regions in an array; and
a second wafer layer attached to the first wafer layer, including a number of semiconductor chips in an array substantially matching the array of chip sized regions, wherein selected semiconductor chips from the number of semiconductor chips have been removed from the surface of the first wafer layer.
2. The semiconductor wafer assembly of claim 1, wherein the number of chip sized regions includes only redistribution circuitry.
3. The semiconductor wafer assembly of claim 1, wherein the number of chip sized regions includes memory chips.
4. The semiconductor wafer assembly of claim 1, wherein the number of semiconductor chips includes logic chips.
5. The semiconductor wafer assembly of claim 1, wherein the number of semiconductor chips includes memory chips.
6. A semiconductor wafer assembly, comprising:
a first wafer, including only redistribution circuitry; and
a second wafer attached to the first wafer, including a number of flash memory chips, wherein selected chips from the number of flash memory chips have been removed from the surface of the first wafer.
7. The semiconductor wafer assembly of claim 6, wherein the chips in the second wafer are attached to the first wafer using controlled chip collapse connections (C4).
8. The semiconductor wafer assembly of claim 6, wherein the chips in the second wafer are attached to the first wafer using TiNiCuAu pad metallurgy.
9. A multi-chip stack, comprising:
an end chip that includes only redistribution circuitry;
a plurality of chips stacked on the end chip, including:
at least one memory chip; and
at least one logic chip.
10. The multi-chip stack of claim 9, wherein the at least one memory chip includes a dynamic random access memory (DRAM) chip.
11. The multi-chip stack of claim 9, wherein the at least one memory chip includes a flash memory chip.
12. The multi-chip stack of claim 9, wherein a second end chip, opposite the end chip that includes only redistribution circuitry is thicker than other chips in the plurality of chips.
13. The multi-chip stack of claim 9, wherein the plurality of chips are interconnected using both chip edge connections and through chip connections.
14. An electronic system, comprising:
a multi-chip stack, including:
an end chip that includes only redistribution circuitry;
a plurality of chips stacked on the end chip, including:
at least one memory chip; and
at least one logic chip
a cooling system, coupled to the multi-chip stack to flow a cooling fluid through at least one gap at an interface between at least two chips in the plurality of chips.
15. The electronic system of claim 14, wherein the fluid includes a liquid.
16. The electronic system of claim 14, wherein the fluid includes a supercritical fluid.
17. The electronic system of claim 16, wherein the supercritical fluid includes carbon dioxide.
18. The electronic system of claim 14, wherein the fluid includes a pressurized gas.
19. The electronic system of claim 18, wherein the pressurized gas includes hydrogen.
20. The electronic system of claim 18, wherein the pressurized gas includes helium.
21. The electronic system of claim 18, wherein the pressurized gas includes both hydrogen and helium.