1. A panel system for a wall or ceiling, comprising:
(a) a plurality of flat base boards, each base board having an upper surface, a top, a bottom and left and right ends wherein each base board has a width W and a length PL;
(b) a plurality of varied, discrete essentially rectangular pieces, each piece having a uniform thickness T but varying lengths L and heights H, wherein the total of lengths L of said plurality of discrete pieces equals PL, wherein said discrete pieces are randomly attached to said base boards in a plurality of full rows from top to bottom, and wherein at least two of said discreet pieces in each row have different lengths L, and wherein the thickness dimension of said discrete varied pieces is parallel to the upper surface of said flat base boards;
(c) a plurality of gap rows at the left and right ends of said base boards each gap row having left and right connecting gaps for attaching said panel to a wall or ceiling wherein the sum of the lengths of the left and right connecting gaps in each row is equal to the length CL of a connecting piece and wherein the total lengths L of discreet pieces in said gap rows is equal to PL-CL, and wherein at least two of said discreet pieces in each gap row have different lengths, and wherein said gaps are adapted to receive connecting pieces;
(d) connecting pieces each having a length CL adapted to be inserted in the gaps of adjoining panels to connect adjoining panels in a wall or ceiling system;
wherein said plurality of base boards may be connected side-by-side by said connecting pieces to form a random and virtually seamless wall or ceiling.
2. A panel system for a wall or ceiling as in claim 1, wherein the discrete varied pieces are randomly attached only to alternate rows of said base boards.
3. A panel system for a wall or ceiling as in claim 1, wherein each base board is 24, 36 or 48 inches long and wherein the length of each discrete varied piece is 4, 8, 12 or 16 inches.
4. A corner insert for a wall or ceiling system, comprising a corner insert having left and right perpendicular legs attached at one end, the outer surface of each leg having a plurality of discrete random pieces attached thereto, wherein the attached end of each leg is beveled at a 45 degree angle to create a 90 degree edge and wherein the unattached end is adapted to be mated and connected to a finished panel as described in claim 1, having full rows and gap rows, wherein the gaps in each of said left and right perpendicular legs is adapted to be mated and connected to said finished panel.
5. A method of manufacturing a wall or ceiling system, comprising the steps of:
(a) setting a flat essentially rectangular base board having a length PL and a width W and an upper surface, a top, a bottom and left and right sides on a table or in a jig;
(b) randomly attaching a plurality of discrete varied pieces having the same thickness T but varying heights H and lengths L, to the upper surface of said base board in rows forming a plurality of full rows wherein the total lengths of random full row pieces equals PL, wherein at least two of said discreet pieces have different lengths and wherein the varied heights and lengths of said discrete varied pieces are randomly selected by a workman to form a random decorative pattern on said base board surface;
(c) randomly attaching a plurality of discrete varied pieces having the same thickness T but varying heights H and lengths L, to the upper surface of said base board in rows forming a plurality of gap rows wherein the total lengths of random gap row pieces equals PL-CL wherein CL is the length of a connecting piece and wherein at least two of said pieces have different lengths, and wherein the varied heights and lengths of said discrete varied pieces are randomly selected by a workman to form a random decorative pattern on said base board surface;
(d) (c) leaving gaps at the left and right ends of a plurality of gap rows for each base board for connecting said finished base board panels to each other wherein the total length of the left and right gaps in each gap row equals CL;
whereby a plurality of randomly manufactured panels having random full rows and random gap rows may be created to produce a decorative but random visual effect.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A device; comprising:
a leadframe including:
a base metal structure selected from a group consisting of copper, copper alloy, aluminum, iron-nickel alloy, brass, and invar;
a nickel layer covering the base metal structure;
a palladium film covering the nickel layer;
a palladium layer selectively covering areas of the leadframe suitable for bonding wire attachment and solder attachment; and
the palladium layer providing visual distinction to the areas covered by the layer over the areas of the palladium film uncovered by the palladium layer; and
a semiconductor chin mounted on the leadframe.
2. The device of claim 1, in which the nickel layer has a thickness in the range from approximately 1 to 3 \u03bcm.
3. The device of claim 1, in which the nickel layer is a stack of a nickel layer in the thickness range from about 30 to 50 nm, plated onto said base metal, followed by a palladiumnickel layer in the thickness range from about 30 to 50 nm, followed by a nickel layer in the thickness range from about 1.0 to 3.0 \u03bcm.
4. The device of claim 1, in which the palladium film has a thickness from about 1 to 5 nm.
5. The device of claim 1, in which the palladium layer has a thickness from about 70 to 90 nm.
6. The device of claim 1, in which the palladium layer covers selective areas having boundaries of loose tolerance.
7. The device of claim 1, in which the base metal has a thickness between about 100 and 250 \u03bcm.
8. The device of claim 1, in which the solder attachment comprises materials selected from a group consisting of tinlead, tinindium, tinsilver, tinbismuth, tincopper, tinsilvercopper, and conductive adhesive compounds.
9. The device of claim 1, in which the solder layer has a reflow temperature compatible with wire bonding temperatures and molding temperatures.
10. The device of claim 1, in which the leadframe further includes a chip mount pad for an integrated circuit chip and a plurality of lead segments, each segment having a first end near said mount pad and a second end remote from said mount pad.
11. The device of claim 10, in which the semiconductor chip is mounted on the chip mount pad.
12. The device of claim 11, further comprising a bonding wire connecting the chip and a first end of the lead segments.
13. The device of claim 12, further comprising encapsulation material surrounding the chip, the bonding wire, and the first ends of the lead segments; and leaving the second ends of the lead segments un-encapsulated.
14. The device of claim 12, in which the bonding wire is selected from a group consisting of gold, copper, aluminum and alloys thereof.
15. The device of claim 11, in which the bonding wire contacts the first end with a stitch bond, a ball bond, or a wedge bond.
16. A method for fabricating a semiconductor device; comprising the steps of:
providing a leadframe, which includes:
a base metal structure;
a nickel layer covering the base metal structure;
a palladium film covering the nickel layer;
a palladium layer selectively covering areas of the leadframe suitable for bonding wire attachment and solder attachment; and
the palladium layer providing visual distinction to the areas covered by the layer over the areas of the palladium film uncovered by the palladium layer; and
mounting a semiconductor chip on the leadframe.