1. An apparatus for testing multiple components of a 3D stacked integrated circuit (IC), comprising:
a base component having a scan input pad, a scan output pad, a base scan chain, and a base chain access block including a base chain select multiplexor and a base bypass multiplexor; and
a secondary component having a secondary scan chain and a secondary chain access block including a secondary chain select multiplexor and a secondary bypass multiplexor, the secondary chain select multiplexor configured to receive input directly from the base component and another component, the base and secondary chain access blocks being configured to selectively access the base scan chain andor the secondary scan chain.
2. The apparatus of claim 1, in which the components comprise tiers of the 3D stacked IC, at least one of the tiers comprising through substrate vias (TSVs).
3. The apparatus of claim 1, in which the components comprise cores of a multi core die.
4. The apparatus of claim 1, in which the scan input pad and scan output pad are configured to selectively read and write to the base andor secondary scan chain.
5. The apparatus of claim 1, further comprising a test controller within at least one of the components and coupled to the base and secondary chain access blocks, the test controller configured to communicate with the base and secondary chain access block to enable the selective access of the base and secondary scan chains.
6. The apparatus of claim 1, in which the base chain select multiplexor is configured to directly receive input from the scan input pad and the secondary component.
7. The apparatus of claim 1, in which the base bypass multiplexor is configured to directly receive input from the base chain select multiplexor and the base scan chain.
8. The apparatus of claim 1, in which the secondary bypass multiplexor is configured to directly receive input from the secondary chain select multiplexor and the secondary scan chain.
9. The apparatus of claim 1, in which the base chain access block further comprises a base bypass flop and the secondary chain access block further comprises a secondary bypass flop, the base and secondary bypass flops configured to manage timing across the components.
10. The apparatus of claim 9, in which
the base bypass flop is coupled to the base chain select multiplexor and the base bypass multiplexor,
the base bypass multiplexor is configured to directly receive input from the base bypass flop and the base scan chain;
the secondary bypass flop is coupled to the secondary chain select multiplexor and the secondary bypass multiplexor; and
the secondary bypass multiplexor is configured to directly receive input from the secondary bypass flop and the secondary scan chain.
11. The apparatus of claim 1, integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, andor a fixed location data unit.
12. A method of selectively accessing scan chains in multiple tiers of a 3D stacked integrated circuit (IC), comprising:
accessing at least one scan chain in one of the tiers by controlling a chain select multiplexor to selectively receive test data from an upper tier or a lower tier.
13. The method of claim 12, further comprising controlling a bypass multiplexor to either receive output from the accessed at least one scan chain, or the chain select multiplexor.
14. The method of claim 12, further comprising integrating the IC into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, andor a fixed location data unit.
15. An apparatus for selectively accessing scan chains in multiple components of an integrated circuit (IC), comprising:
means for multiplexing inputs from an upper component and a lower component to access at least a scan chain in one of the components by selecting a scan chain input from the lower component or a scan chain output from the upper component; and
means for bypassing a scan chain by selecting an output of the multiplexing means or an output of the scan chain.
16. The apparatus of claim 15, in which the components comprise tiers of the 3D stacked IC, at least one of the tiers comprising through substrate vias (TSVs).
17. The apparatus of claim 15, in which the components comprise cores of a multi core die.
18. The apparatus of claim 15, integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, andor a fixed location data unit.
19. A method of selectively accessing scan chains in multiple tiers of an integrated circuit (IC), comprising the step of:
accessing at least one scan chain in one of the tiers by controlling a chain select multiplexor to selectively receive test data from an upper tier or a lower tier.
20. The method of claim 19, further comprising the step of integrating the IC into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, andor a fixed location data unit.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A temperature regulator that adjusts a temperature of an X-ray detector, comprising:
a controller;
a thermal sensor reporting temperature data to the controller;
a thermo-electric device having a positive voltage contact and a negative voltage contact that responds to the controller being in receipt of the temperature data from the thermal sensor, the contacts configured to allow reversing a voltage applied thereto;
a heat dissipating plate in contact with an X-ray panel of the X-ray detector;
a cold plate in thermal contact with the heat dissipating plate via a heat pipe, at least one of the heat dissipating plate and cold plate connected to the thermo-electric device; and
thermal insulation configured to thermally isolate the cold plate from electronics of the X-ray detector.
2. The apparatus of claim 1, further comprising:
a switch that switches the positive voltage contact and the negative voltage contact.
3. The apparatus of claim 1, wherein the thermal sensor is a thermocouple.
4. The apparatus of claim 1, wherein the thermal sensor is in contact with an X-ray panel.
5. The apparatus of claim 1, further comprising:
a voltage source connected to the positive voltage contact and the negative voltage contract.
6. The apparatus of claim 1, wherein the thermo-electric device is a solid state thermo-electric device.
7. The apparatus of claim 1, further comprising: a switch that controls current direction at the positive voltage contact controlled by the controller in response to receipt of temperature data.
8. The apparatus of claim 1, where the thermo-electric device responds to the control to maintain an X-ray panel in the X-ray detector within a predetermined temperature range.
9. The apparatus of claim 8, wherein the predetermined temperature range is twenty-five to thirty-five degrees Celsius.
10. A method for regulating temperature of a medical X-ray detector, the method comprising the steps of:
measuring a temperature of the medical X-ray detector;
determining if the temperature of the medical X-ray detector is within a predetermined operational range;
adjusting via a positive voltage contact and a negative voltage contact a current that enters a thermo-electric device in order to change the temperature of the medical X-ray detector;
providing a heat dissipating plate in contact with an X-ray panel of the medical X-ray detector and in thermal contact with a cold plate via a heat pipe with heat being transferred from the heat dissipating plate to the cold plate via the heat pipe; and
thermally isolating at least one of the beat pipe and cold plate from electronics of the X-ray detector.
11. The method of claim 10, further comprising the steps of:
identifying a mode of temperature control the device requires; and
changing polarity of a voltage entering the thermo-electric device in response to the mode of temperature control.
12. The method of claim 11, wherein the step of changing further comprises the step of:
switching the voltage with an electromagnetic switch that responds to the controller.
13. The method of claim 10, where measuring further comprise:
sending data from a thermocouple to the controller.
14. The method of claim 10, wherein the thermo-electric device is a solid-state thermo-electric device.
15. The method of claim 10, wherein the predetermined operating range is twenty-five to thirty-five degrees Celsius.
16. A system that adjusts a temperature in a X-ray detector, the system comprising:
a controller;
a thermal sensor reporting temperature data to the controller;
a thermo-electric device having a positive voltage contact and a negative voltage contact that responds to the controller being in receipt of the temperature data from the thermal sensor, the contacts configured to allow reversing a voltage applied thereto;
an external cooling device that removes thermal energy from the thermo-electric device; and
a cold plate and a heat sink connected to the thermo-electric device, the heat sink in contact with an X-ray panel of the X-ray detector;
at least one heat pipe thermally connecting the cold plate and the heat sink; and
thermal insulation between electronics of the X-ray detector and at least one of the heat pipe and cold plate.
17. The apparatus of claim 16, further comprising:
a switch that switches the positive voltage contact and the negative voltage contact.
18. The apparatus of claim 16, wherein the thermal sensor is a thermocouple.
19. The apparatus of claim 16, wherein the thermal sensor is a solid-state thermal sensor.
20. The apparatus of claim 16, wherein the thermal sensor is in contact with an X-ray panel.
21. The apparatus of claim 16, further comprising:
a voltage source connected to the positive voltage contact and the negative voltage contract.
22. The apparatus of claim 16, wherein the thermo-electric device is a solid-state thermo-electric device.
23. The apparatus of claim 16, wherein the external cooling device is a liquid cooling device.
24. The apparatus of claim 16, where the external cooling device is located more than three meters from the thermo-electrical device.