1. A method to facilitate provision of at least one semiconductor device comprising:
providing a substrate;
forming on the substrate at least one semiconductor device using a plurality of different printable semiconductor inks.
2. The method of claim 1 wherein providing a substrate further comprises providing a flexible substrate.
3. The method of claim 2 wherein providing a flexible substrate further comprises providing a polyester substrate.
4. The method of claim 2 wherein providing a flexible substrate further comprises providing a paper substrate.
5. The method of claim 1 wherein forming on the substrate at least one semiconductor device using a plurality of different printable semiconductor inks further comprises forming on the substrate a plurality of organic semiconductor devices using a plurality of different semiconductor materials.
6. The method of claim 5 wherein forming on the substrate a plurality of organic semiconductor devices using a plurality of different semiconductor materials further comprises forming on the substrate a plurality of organic semiconductor devices using a first semiconductor material for a first one of the plurality of organic semiconductor devices and a second semiconductor material, which second semiconductor material is different from the first semiconductor material, for a second one of the plurality of organic semiconductor devices.
7. The method of claim 1 wherein forming on the substrate at least one semiconductor device using a plurality of different printable semiconductor inks further comprises using a plurality of different semiconductor material inks.
8. The method of claim 7 wherein using a plurality of different semiconductor material inks further comprises using a plurality of different semiconductor material functional inks.
9. The method of claim 1 wherein forming on the substrate at least one semiconductor device using a plurality of different printable semiconductor inks further comprises using a plurality of different semiconductor materials wherein the semiconductor materials differ from one another at least with respect to an electrical performance attribute.
10. The method of claim 1 wherein forming on the substrate at least one semiconductor device using a plurality of different printable semiconductor inks further comprises using a plurality of different semiconductor materials wherein the semiconductor materials differ from one another at least with respect to environmental robustness.
11. An apparatus comprising:
a substrate;
at least a first semiconductor device formed on the substrate comprised of at least two differing printable semiconductor inks.
12. The apparatus of claim 11 wherein the at least two differing printable semiconductor inks comprise at least two differing printable organic semiconductor material inks.
13. The apparatus of claim 11 wherein the at least two differing printable semiconductor inks comprise inks that have been printed with respect to the substrate.
14. The apparatus of claim 11 wherein the at least a first semiconductor device further comprises at least two organic semiconductor devices.
15. The apparatus of claim 14 wherein each of the at least two organic semiconductor devices are comprised of at least two different printable semiconductor inks.
16. The apparatus of claim 15 wherein a first one of the at least two organic semiconductor devices is comprised of a first printable semiconductor ink and a second one of the at least two organic semiconductor devices is comprised of a second printable semiconductor ink, which second printable semiconductor ink is different from the first printable semiconductor ink.
17. The apparatus of claim 11 wherein the at least two differing printable semiconductor inks differ from one another with respect to an electrical property.
18. The apparatus of claim 17 wherein the electrical property comprises conductivity.
19. The apparatus of claim 17 wherein the electrical property comprises majority carrier type.
20. The apparatus of claim 17 wherein the electrical property comprises field effect mobility.
21. A method comprising:
providing a substrate;
printing at least a first semiconductor device on the substrate using at least two different printable semiconductor material inks.
22. The method of claim 21 wherein printing at least a first semiconductor device on the substrate using at least two different printable semiconductor material inks further comprises printing at least a first semiconductor device on the substrate using at least two different printable semiconductor material inks, wherein at least one of the two different printable semiconductor material inks comprises a printable organic semiconductor material ink.
23. The method of claim 22 wherein printing at least a first semiconductor device on the substrate using at least two different printable semiconductor material inks further comprises printing at least a first semiconductor device on the substrate using at least two different printable semiconductor material inks, wherein both of the at least two different printable semiconductor material inks comprise a printable organic semiconductor material ink.
24. The method of claim 21 wherein printing at least a first semiconductor device on the substrate further comprises printing at least a first and a second semiconductor device on the substrate.
25. The method of claim 24 wherein printing at least a first and a second semiconductor device on the substrate further comprises printing the first semiconductor device on the substrate using a first printable semiconductor material and printing the second semiconductor device on the substrate using a second printable semiconductor material, which second printable semiconductor material is different from the first printable semiconductor material.
26. The method of claim 21 wherein printing comprises at least one of:
screen printing;
offset printing;
gravure printing;
xerographic printing;
flexography printing;
inkjetting;
microdispensing;
stamping.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An antenna, comprising;
a dipole gap;
a notch filter;
a dipole structure comprising a first antenna conductor and a second antenna conductor; and
a feed structure coupled to a feed point, wherein the feed structure is a microstrip coupled line operable to couple a signal delivered to the feed point to the first antenna conductor and the second antenna conductor, wherein at least a portion of the microstrip coupled line is above the feed point, wherein the microstrip coupled line is over at least a portion of the first antenna conductor and at least a portion of the second antenna conductor, wherein the feed structure and the first antenna conductor and the second antenna conductor are formed on a printed circuit board (PCB), and wherein the feed structure and the microstrip coupled line are formed on a first side of the PCB and the first antenna conductor and the second antenna conductor are formed on a second side of the PCB.
2. The antenna of claim 1, wherein the microstrip coupled line comprises a first portion along a first axis, a second portion on a second axis substantially perpendicular to the first axis.
3. The antenna of claim 2, wherein the first portion and the second portion are connected by a curved portion.
4. The antenna of claim 2, wherein the microstrip coupled line comprises a third portion along the first axis.
5. The antenna of claim 1, wherein the microstrip coupled line is above at least a portion of the dipole gap.
6. The antenna of claim 1, wherein the notch filter is operable in the frequencies between approximately 5.15 GHz and approximately 5.35 GHz.
7. The antenna of claim 1, comprising a notched matching stub.
8. The antenna of claim 7, wherein the notched matching stub is operable to filter frequencies less than approximately 3 GHz.
9. The antenna of claim 1, comprising a first set of teeth and a second set of teeth.
10. The antenna of claim 9, wherein the first set of teeth and the second set of teeth are formed on the second side of the PCB.
11. The antenna of claim 10, wherein the first set of teeth and the second set of teeth are in a comb pattern.
12. The antenna of claim 10, wherein the first antenna conductor has a first cutout and the second antenna conductor has a second cutout.
13. The antenna of claim 10, wherein the first set of teeth and the second set of teeth are in a meanderline pattern.
14. The antenna of claim 13, wherein the first antenna conductor has a first cutout and the second antenna conductor has a second cutout.
15. The antenna of claim 9, wherein the notch filter is over at least one of the first set of teeth.