1. A device for non-invasive monitoring thermal stress of a user comprising:
a. a monitoring unit comprising
1) a first substrate comprising a first side and an opposite second side; and
2) at least two temperature sensors, wherein at least one temperature sensor is located of the first side of the first substrate and at least one temperature sensor is located on the second side of the first substrate, each temperature sensor is directly or indirectly connected to said first substrate;
b. a cover comprising a first side and an opposite second side, where the first side of said cover has a defined surface area, said defined surface area has a first area and a second area, said cover being adapted to receive the monitoring unit in the first area of said defined area: and
c. a thermally conductive member contacting the temperature sensor on the second side of the first substrate, the thermally conductive member extending through the second side of the cover.
2. The device according to claim 1, further comprising an adhesive applied to a portion of the second area of the cover.
3. The device according to claim 1, wherein the first substrate comprises a circuit board.
4. The device according to claim 1, wherein the monitoring unit further comprises a shell directly or indirectly connected to said first substrate, said shell essentially covers the second side of said first substrate.
5. The device according to claim 1, further comprising an alert mechanism wherein the alert mechanism comprises an audible alarm, a visual alarm, a tactile alarm, an action to provide heating or cooling to the user, or a combination thereof.
6. The device according to claim 2, further comprising a processor attached to the first substrate, where the processor is configured to receive input from each temperature sensor and the processor is configured to determine a core temperature of a user of the device.
7. The device according to claim 6, wherein the processor is configured to compare the measured core temperature to a stored core temperature value andor the processor is configured to determine a rate of change in core temperature to a stored threshold rate of change in core temperature range, and where the processor is configured to output an alert signal when the measured core temperature is outside the stored core temperature or value the determined rate of change in core temperature or the stored threshold rate of change in core temperature range.
8. The device according to claim 1, wherein the cover comprises a flexible material.
9. The device according to claim 2, wherein the adhesive is a pressure sensitive adhesive adapted to be applied to the skin of a user.
10. The device according to claim 9, wherein said adhesive is covered with a release sheet.
11. The device according to claim 1, wherein the cover is removable from the monitoring unit and the cover is disposable, while the monitoring unit is reusable.
12. A device for non-invasive monitoring thermal stress of a user having a monitoring unit comprising
a first substrate comprising a first side and an opposite second side;
at least two temperature sensors, wherein at least one temperature sensor is located of the first side of the first substrate and at least one temperature sensor is located on the second side of the first substrate, each temperature sensor is directly or indirectly connected to said first substrate;
a shell directly or indirectly connected to said first substrate, said shell essentially covers the second side of said first substrate; and
a thermally conductive member, said thermally conductive member contacting the temperature sensor on the second side of the first substrate and extends through the shell.
13. A device for non-invasive monitoring thermal stress of a user comprising:
a) a monitoring unit comprising
(1) a first substrate comprising a first side and an opposite second side; and
(2) at least two temperature sensors;
(3) a processor;
(4) an alert mechanism; and
(5) a power supply;
wherein
at least one temperature sensor is located of the first side of the first substrate and at least one temperature sensor is located on the second side of the first substrate, each temperature sensor is directly or indirectly connected to said first substrate and each temperature sensor is connected to the processor;
the processor is configured to compare the measured core temperature to a stored core temperature value andor the processor is configured to determine a rate of change in core temperature to a stored threshold rate of change in core temperature range, and where the processor is configured to output an alert signal when the measured core temperature is outside the stored core temperature or value the determined rate of change in core temperature or the stored threshold rate of change in core temperature range;
the alert mechanism is connected to the processor and is configured to alarm the user when the processor outputs the alert signal; and
the power supply being connected to the processor and the power supply is configured to provide power to the processor and alert mechanism;
b) a cover comprising a first side and an opposite second side, where the first side of said cover has a defined surface area, said defined surface area has a first area and a second area, said cover being adapted to receive monitoring unit in the first area of said defined area:
c) a thermally conductive member contacting the temperature sensor on the second side of the first substrate, the thermally conductive member extending through the second side of the cover.
14. The device according to claim 13, wherein the alert mechanism comprises an audible alarm, a visual alarm, a tactile alarm, an action to provide heating or cooling to the user, or a combination thereof.
15. The device according to claim 13, wherein the cover comprises a flexible material.
16. The device according to claim 13, wherein the cover is removable from the monitoring unit and the cover is disposable, while the monitoring unit is reusable.
17. The device according to claim 13, further comprising an adhesive applied to a portion of the second area of the cover.
18. A method of monitoring thermal stress in a user, said method comprising
a. providing a monitoring unit comprising a first substrate having a first side and an opposite second side; at least two temperature sensors, wherein at least one temperature sensor is located of the first side of the first substrate and at least one temperature sensor is located on the second side of the first substrate, each temperature sensor is connected to said first substrate;
b. providing a cover comprising a first side and an opposite second side, where the first side of said cover has a defined surface area, said defined surface area has a first area and a second area, said cover being adapted to receive the monitoring unit such that the monitoring unit directly or indirectly contacts the first area of said defined area and an adhesive applied to a portion of the second area of the cover;
c. placing the monitoring unit into the cover in the first area to create a monitoring unitcover combination;
d. applying the monitoring unitcover combination to the skin of a user, such that the adhesive on the cover and the at least one temperature sensor on the first side of the first substrate contacts the skin of the user.
19. The method of claim 18, wherein the monitoring unitcover combination is applied to the skin of the user in the temporal artery region of the skin.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A hermetic modular power supply comprising a circuit board, which is provided with heating elements, for serving as a heating unit on which is provided with metallic electric, conducting terminals; a heat conductive and dissipative material, which serves as a unit of insulation, heat conduction and dissipation, and completely adheres the heating unit into a modular power supply; and a modular base on which is provided with at least one set of AC power plug holes and one set of DC power plug holes; for at least one modular power supply, selectively, the metallic electric conducting terminals being plugged into at least one set of the power plug holes.
2. The hermetic modular power supply according to claim 1, wherein the modular base includes:
(a) a bottom seat, an interior of which is fixed with a circuit board, with the circuit board being welded with a plurality of electric conducting spring leaves, and a slot being formed by a gap between each two neighboring electric conducting spring leaves;
(b) an upper cover, a surface of which is provided with at least one set of power plug holes, with a lower side of each plug hole corresponding to the slot, and the upper cover being assembled on the bottom seat.
3. The hermetic modular power supply according to claim 1, wherein the heat conductive and dissipative material is a lumpish body constituted by an insulating heat conductive glue and paste, being provided with functions of heat conduction and dissipation, adhering, and isolation, so as to isolate the heating unit from ambient environment.
4. The hermetic modular power supply according to claim 1, wherein the metallic electric conducting terminal is protruded out of the lumpish body, and is selectively an electric conducting plate.
5. The hermetic modular power supply according to claim 1, wherein the hermetic power supply is used for an outdoor LED lamp set.
6. A hermetic modular power supply comprising a circuit board, which is provided with heating elements, for serving as a heating unit on which is provided with metallic electric conducting terminals; a heat conductive and dissipative material, which serves as a unit of insulation, heat conduction and dissipation, and completely adheres the heating unit into a modular power supply; a heat dissipating shade into which is provided with a container; a lumpish body which is tightly put into the container to form a modular power supply, with the lumpish body forming a heat conduction medium to conduct heat generated by the heating unit to the heat dissipating shade for dissipating heat outward; and a modular base on which is provided with at least one set of power plug holes; for at least one modular power supply, selectively, the metallic electric conducting terminals being plugged into the power plug holes.
7. The hermetic modular power supply according to claim 6, wherein the heat conductive and dissipative material includes a heat conductive paste as an inner layer, with an outer layer of the heat conductive paste being enclosed with a layer of heat conductive glue.
8. The hermetic modular power supply according to claim 6, wherein the metallic electric conducting terminal is selectively designed as an electric conducting wire which is protruded out of the lumpish body, the container is sealed by an insulating cover board, and the electric conducting wire is penetrated out of a through-hole of the cover board.
9. The hermetic modular power supply according to claim 6, wherein the metallic electric conducting terminal is designed as a plate which is protruded out of the lumpish body.
10. The hermetic modular power supply according to claim 6, wherein the hermetic modular power supply is used for an outdoor LED lamp set.