1460904728-6ee3407f-7b24-4ccb-a8e2-292dfe2dae8f

1. A method of manufacturing a color filter substrate including a plurality of coloring layers having a plurality of colors in a predetermined pattern, the method comprising:
a partition wall portion formation step of forming, on a substrate, a first partition wall portion having a first opening defining a region in which the coloring layers are formed and a second partition wall portion located on the first partition wall portion and having a second opening defining the region in which the coloring layers are formed; and
an ejection step of ejecting liquid substances for the openings of the partition wall portions by using a liquid droplet ejecting method, the liquid substances being made by dissolving or dispersing coloring materials composing the respective coloring layers in solvents,
wherein the ejected liquid substances have different viscosities for each coloring layer, and
wherein, in the partition wall portion formation step, the first partition wall portion projects from an inner surface of the second opening of the second partition wall portion, a surface area of a portion of the first partition wall portion projecting from the second partition wall portion becomes relatively small in an opening through which the liquid substance having relatively low viscosity is ejected, and the surface area of the portion of the first partition wall portion projecting from the second partition wall portion becomes relatively large in an opening through which the liquid substance having relatively high viscosity is ejected.
2. A method of manufacturing an electro-optical device including different types of electro-optical layers in a predetermined pattern, the method comprising:
a partition wall portion formation step of forming on a substrate a first partition wall portion having a first opening defining a region in which the electro-optical layers are formed and a second partition wall portion located on the first partition wall portion and having a second opening defining the region in which the electro-optical layers are formed; and
an ejection step of ejecting liquid substances for the openings of the partition wall portions by using a liquid droplet ejecting method, the liquid substances being made by dissolving or dispersing functional materials composing the respective electro-optical layers in solvents,
wherein the ejected liquid substances have different viscosities for each electro-optical layer, and
wherein, in the partition wall portion formation step, the first partition wall portion projects from an inner surface of the second opening of the second partition wall portion, a surface area of a portion of the first partition wall portion projecting from the second partition wall portion becomes relatively small in an opening through which the liquid substance having relatively low viscosity is ejected, and the surface area of the portion of the first partition wall portion projecting from the second partition wall portion becomes relatively large in an opening through which the liquid substance having relatively high viscosity is ejected.
3. The method of manufacturing an electro-optical device according to claim 2,
wherein, in the partition wall portion formation step, the projecting length of the first partition wall portion projecting from the inner surface of the second opening of the second partition wall portion becomes relatively small in an opening through which the liquid substance having relatively low viscosity is ejected, and the projecting length of the first partition wall portion projecting from the second partition wall portion becomes relatively large in an opening through which the liquid substance having relatively high viscosity is ejected.
4. The method of manufacturing an electro-optical device according to claim 2,
wherein, the solvent included in the liquid substance is of the same kind for the same type of electro-optical layers.
5. The method of manufacturing an electro-optical device according to claim 2, further comprising:
after the ejection step, a drying step of drying the ejected liquid substances simultaneously for the same type of electro-optical layers.
6. An electro-optical device manufactured by the manufacturing method according to claim 2.
7. An electronic apparatus comprising the electro-optical device according to claim 6.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A magnetic memory comprising:
a magnetic element; and
a metal layer stacked on the magnetic element,
wherein HD>1.47 is satisfied, where H denotes a sum of thicknesses of the magnetic element and the metal layer in a first direction in which the magnetic element and the metal layer are stacked, and D denotes a width of the magnetic element in a second direction perpendicular to the first direction.
2. The memory of claim 1, wherein
the magnetic element includes a first ferromagnetic layer, a nonmagnetic insulating layer stacked on the first ferromagnetic layer, and a second ferromagnetic layer stacked on the nonmagnetic insulating layer.
3. The memory of claim 2, wherein
D denotes a width of the nonmagnetic insulating layer in the second direction.
4. The memory of claim 1, wherein
the metal layer includes one of W, Ta, Ru, Ti, TaN and TiN.
5. The memory of claim 1, further comprising:
an FET having a gate, a source, and a drain,
wherein the magnetic element is provided above the FET.
6. A method of manufacturing a magnetic memory, the method comprising:
forming a metal layer on a magnetic element;
patterning the metal layer; and
patterning the magnetic element by using an ion beam accelerated by an accelerating voltage of higher than 200 V after patterning the metal layer.
7. The method of claim 6, wherein
the ion beam includes one of Ne, Ar, Kr, Xe, N2 and O2.
8. The method of claim 6, wherein
the patterning the magnetic element includes a first etching and a second etching after the first etching.
9. The method of claim 8, wherein
the first etching is executed by a beam angle larger than a beam angle of the second etching.
10. The method of claim 9, wherein
the beam angle of the first etching is selected to be in a range of 30\xb0 to 60\xb0, where the beam angle is an angle between a direction in which the magnetic element and the metal layer are stacked and a direction in which the ion beam is irradiated.
11. The method of claim 9, wherein
the beam angle of the second etching is selected to be in a range of 0\xb0 to 30\xb0, where the beam angle is an angle between a direction in which the magnetic element and the metal layer are stacked and a direction in which the ion beam is irradiated.
12. The method of claim 8, wherein
the magnetic element is formed by forming a nonmagnetic insulating layer on a first ferromagnetic layer, and forming a second ferromagnetic layer on the nonmagnetic insulating layer.
13. The method of claim 12, wherein
a changing point between the first and second etchings is provided in the second ferromagnetic layer.
14. The method of claim 12, wherein
a changing point between the first and second etchings is provided on the nonmagnetic insulating layer.
15. The method of claim 12, wherein
a changing point between the first and second etchings is provided in the first ferromagnetic layer.
16. The method of claim 6, wherein
the metal layer includes one of W, Ta, Ru, Ti, TaN and TiN.
17. The method of claim 6, wherein
the metal layer is patterned by one of RIE and IBE.
18. The method of claim 6, further comprising:
forming an FET having a gate, a source, and a drain,
wherein the magnetic element is formed above the FET.