1460904908-18f83baf-8822-4de6-900e-b017e2697277

1. A power converter comprising:
a case;
a direct current terminal for receiving direct electric power;
a power module provided at a low portion inside of said case, and provided at one side of said case;
a capacitor arrangement provided at a low portion inside and at another side of said case;
a connecting conductor arranged along said power module and connected to said direct current terminal electrically;
a driver circuit portion arranged at the one side of the case and at upper side of said power module; and
a control circuit portion arranged at an upper side of said connecting conductor;
wherein said connecting conductor is electrically connected to said capacitor and provides a power module side connecting terminal at the side of said power module with said power module providing an outputting portion at the opposite side to the portion where the power module side connecting terminal is connected and direct power received through said direct current terminal being supplied to said power module through said power module side connecting terminal of said connecting conductor to which said capacitor arrangement is connected; and
said power module being arranged to be controlled by said driver circuit portion which is controlled by said control circuit portion, converts from the direct power supplied from said power module to AC power, and outputs from said output portion.
2. The power converter according to claim 1,
wherein said metal has a case is configured to function as a negative pole of the direct current terminal.
3. The power converter according to claim 1,
wherein said connecting conductor is arranged above said capacitor arrangement, and said control circuit portion is arranged above said connecting conductor.
4. The power converter according to claim 3,
wherein said capacitor arrangement is comprised of a row of plurality of capacitors arranged along with said power module at one row at the other side of said power module;
said connecting conductor is arranged along with and on said row of plurality of capacitors; and
said row plurality of capacitors are connected in parallel by said connecting conductor.
5. The power converter according to claim 1,
wherein said driver circuit portion and said control circuit portion are mounted on a common printed circuit board.
6. The power converter according to claim 5,
wherein said capacitor arrangement is comprised of a row of plurality of capacitors arranged along with said power module at one row at the other side of said power module;
said connecting conductor is arranged along with and on said row of plurality of capacitors; and
said row of plurality of capacitors are connected in parallel by said connecting conductor.
7. The power converter according to claim 1,
wherein said arrangement capacitor is comprised of a row of plurality of capacitors arranged along with said power module at one row at the other side of said power module;
said connecting conductor is arranged along with and on said row of plurality of capacitors; and
said row of plurality of capacitors are connected in parallel by said connecting conductor.
8. The power converter according to claim 1,
wherein said power module is configured to generate alternative output corresponding the each phase of three phase alternative current and to provide three pairs of series circuits, one of which consists of a plus side switching element and a minus side switching element in response to the three phase;
said three pairs of series circuits are connected in parallel to said connecting conductors for supplying direct electric power, respectively;
a cooling fin is provided in the opposite side with said driver circuit portion of said power module; and
a cooling passage in which said cooling fin is positive is provided in the opposite side with said driver circuit portion of said power module and along with the direction of said connecting conductor.
9. The power converter according to claim 1, further comprising:
a current sensor for detecting the alternating current,
wherein said current sensor is mounted on the printed board; and
wherein said driver circuit portion is arranged between said control circuit portion and said current sensor.
10. The power converter according to claim 9,
wherein the alternating current terminal is arranged on one side on which said current sensor mounted on the printed board is arranged so that the alternating current terminal and said current sensor are aligned in the same row; and
wherein one end of said alternating current bus bar is connected with the alternating current terminal, and the other end of said alternating current bus bar is connected with an alternating current inputoutput section through a current detection unit of said current sensor, the alternating current inputoutput section being provided for the plurality of switching elements which are provided in said power module.
11. The power converter according to claim 1,
wherein said power module has a first switching element group including an inverter unit for converting a direct current to a three-phase alternating current and a second switching element group including a converter unit for changing a voltage between direct currents.
12. A motor generator system comprising the power converter according to claim 11 in a vehicle which is driven by an internal combustion engine.
13. The power converter according to claim 7, further comprising a second current sensor for detecting a current flowing in said converter unit,
wherein said control device controls said driver device in accordance with the current which has been detected by said second current sensor.
14. The power converter according to claim 11,
wherein the first switching element group and the second switching element group each includes a plurality of metal oxide semiconductor field effect transistors.
15. The power converter according to claim 11, further comprising a noise filter composed of a first coil,
wherein said noise filter is connected in series between the second switching element group and a second direct current terminal different from the direct current terminal.
16. The power converter according to claim 15,
wherein one electrode of said noise filter is connected with the second direct current terminal by using a first direct current bus bar, and the other electrode of said noise filter is connected with one electrode of a second coil which is connected with an output section of the second switching element group by using a second direct current bus bar.
17. The power converter according to claim 16,
wherein said control device is arranged above said first and second direct current bus bars.
18. The power converter according to claim 16,
wherein said noise filter is arranged below said first and second direct current bus bars.
19. The power converter according to claim 18, further comprising a metal chassis for mounting said semiconductor device and said capacitor arrangement therein,
wherein said noise filter is arranged in said chassis.
20. The power converter according to claim 19, further comprising a plurality of alternating current terminals for outputting the three-phase alternating current which has been converted by said inverter unit,
wherein the direct current terminal, the second direct current terminal, and the plurality of alternating current terminals are arranged on a side surface of said metal chassis and in parallel to each other.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for embedding at least one conductive track in a layer of a printed circuit board stack-up, said method comprising the steps of:
applying a first plating mask of photoresist covering partially at least one face of a base substrate, said applying a first plating mask comprising the steps of:
(i) applying a photoresist to said face,
(ii) patterning said photoresist to create gaps in said photoresist,

depositing conductive ink as paste in said gaps formed by said plating mask covering partially at least one face of said base substrate,
liquefying said conductive ink to facilitate uniform distribution
gelling said conductive ink,
removing said first plating mask,
applying a dielectric layer on said conductive ink, and
solidifying said conductive ink and said dielectric layer.
2. The method of claim 1 wherein each of the steps is repeated at least once to create at least one other layer comprising at least one conductive track.
3. The method of claim 2 wherein the conductive paths of said at least two layers are not aligned.
4. The method of claim 1 wherein said conductive ink comprises polymeric resin.
5. The method of claim 4 wherein said resin is an epoxy resin.
6. The method of claim 1 wherein said conductive ink comprises at least one powder selected from the group consisting of graphite powder, carbon powder, metal powder, and ceramic powder.
7. The method of claim 6 wherein said conductive ink comprises colloidal graphite dispersion in a solvent solution.
8. The method of claim 1 further comprising the steps of:
applying a colloidal seeding layer on the second face of said base substrate,
applying a second plating mask covering partially said colloidal seeding layer, and
plating the unmasked part of said colloidal seeding layer.
9. The method of claim 8 further comprising the step of removing said first or second plating mask.
10. The method of claim 1 wherein the color of said conductive ink is similar to the one of said dielectric layer.
11. The method of claim 1 wherein the viscosity of said conductive ink is comprised between 1000 to 20,000 mPa s.
12. A method for embedding a layer hosting discrete components into a printed circuit board stack-up, said method comprising the steps of:
applying a first plating mask of photoresist covering partially at least one face of a base substrate, said applying a first plating mask comprising the steps of:
(i) applying a photoresist to said face,
(ii) patterning said photoresist to create gaps in said photoresist,

depositing conductive ink as paste in said gaps formed by said plating mask covering partially at least one face of said base substrate,
liquefying said conductive ink to facilitate uniform distribution,
gelling said conductive ink,
removing said first plating mask,
applying a dielectric layer on said conductive ink, and
solidifying said conductive ink and said dielectric layer.
13. The method of claim 12 wherein said discrete components comprise at least one resistive discrete component.