What is claimed is:
1. A torque pin to maintain rotating disks of a turbine in alignment comprising:
an elongate body having a slot provided in a sidewall thereof,
a locking element coupled to said body and being moveable relative to said body from a retracted condition where said locking element is accommodated in said slot to an extended condition where said locking element extends outwardly beyond said sidewall; and
a retaining mechanism disposed in said body, said retaining mechanism being biased towards said slot to maintain said locking element in said extended condition.
2. A torque pin according to claim 1 wherein said retaining mechanism maintains said locking element in said retracted condition and in said extended condition.
3. A torque pin according to claim 2 wherein said retaining mechanism extends into said slot when said locking element is in said extended condition thereby to inhibit said locking element from moving to said retracted condition.
4. A torque pin according to claim 3 wherein said retaining mechanism abuts said locking element when said locking element is in said retracted condition thereby to maintain said locking element in said retracted condition.
5. A torque pin according to claim 4 wherein said retaining mechanism includes a spring and a retaining element, said spring urging said retaining element into contact with said locking element when said locking element is in said retracted condition and urging said retaining element into said slot when said locking element is in said extended condition.
6. A torque pin according to claim 5 wherein said retaining element is moveable within said body against the bias of said spring to enable said locking element to move from said extended position back to said retracted condition.
7. A torque pin according to claim 6 wherein said body has a centrally disposed bore therein, said bore including a larger diameter portion and a smaller diameter portion to define an internal shoulder, said larger diameter portion intersecting said slot, and wherein said retaining element includes a smaller diameter portion and a larger diameter portion to define an annular abutment surface, said spring being disposed in the larger diameter portion of said bore and bearing against the larger diameter portion of said retaining element, said annular abutment surface contacting said locking element when said locking element is in said retracted condition and contacting said internal shoulder when said locking element is in said extended condition thereby to position said larger diameter portion in said slot.
8. A torque pin according to claim 7 wherein the smaller diameter portion of said bore extends to the end of said body and wherein the smaller diameter portion of said bore and the smaller diameter portion of said retaining element are generally the same length.
9. A torque pin according to claim 3 wherein said locking element is a cam pivotably coupled to said body.
10. A torque pin comprising:
a generally cylindrical body defining an external sidewall and having a longitudinally extending bore formed therein, said body also having a radially extending slot provided in said sidewall that intersects said bore;
a cam pivotally coupled to said body and being accommodated by said slot, said cam being moveable between an unlocking condition where said cam is fully accommodated by said slot and a locking condition where said cam is partially accommodated by said slot and extends outwardly beyond said sidewall; and
a retaining mechanism disposed in said bore, said retaining mechanism acting on said cam when said cam is in said unlocking condition and moving into said slot when said cam is in said locking condition thereby to inhibit said cam from returning to said unlocking condition.
11. A torque pin according to claim 10 wherein said retaining mechanism provides a visual indication of the condition of said cam.
12. A torque pin according to claim 11 wherein said retaining mechanism includes a retaining element having a larger diameter portion and a smaller diameter portion, the junction between said larger and smaller diameter portions defining an annular abutment surface; and a spring element acting on said retaining element and biasing said retaining element towards said slot, said smaller diameter portion being visible within said bore to provide said visual indication.
13. A torque pin according to claim 12 wherein said smaller diameter portion is generally flush with an end of said body when said cam is in said locking condition.
14. A torque pin according to claim 13 wherein said spring element is a coil spring and wherein said annular abutment surface contacts said cam when said cam is in said unlocking condition and contacts an internal shoulder within said body when said cam is in said locking position.
15. A turbine comprising:
a rotatable shaft;
a plurality of disks on said shaft, adjacent disks having facing recesses formed therein to define torque pin cavities; and
torque pins accommodated in said torque pin cavities, each of said torque pins including:
an elongate body having a slot provided in a sidewall thereof;
a locking element coupled to said body and being moveable relative to said body between a retracted condition where said locking element is accommodated in said slot and an extended condition where said locking element extends outwardly beyond said sidewall; and
a retaining mechanism disposed in said body, said retaining mechanism being biased towards said slot to maintain said locking element in said extended condition.
16. A turbine according to claim 15 when said retaining mechanism acts on said locking element when said locking element is accommodated by said slot and moves into said slot when said locking element is in said extended position to inhibit said cam from moving back into said slot.
17. A turbine according to claim 16 wherein said retaining mechanism provides a visual indication of the condition of said cam.
18. A turbine according to claim 17 wherein said retaining mechanism includes a retaining element having a larger diameter portion and a smaller diameter portion, the junction between said larger and smaller diameter portions defining an annular abutment surface; and a spring element acting on said retaining element and biasing said retaining element towards said slot, said smaller diameter portion being visible within said bore to provide said visual indication.
19. A turbine according to claim 18 wherein said smaller diameter portion is generally flush with an end of said body when said cam is in said locking condition.
20. A turbine according to claim 19 wherein said spring element is a coil spring and wherein said annular abutment surface contacts said cam when said cam is in said unlocking condition and contacts an internal shoulder within said body when said cam is in said locking position.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multilayer wiring substrate comprising: a principal plane of the substrate; a rear plane of the substrate; a plurality of resin insulating layers; a plurality of conductor layers, both of the plurality of resin insulating layers and the plurality of conductor layers being laminated; and a plurality of chip component connecting terminals to which chip components are connectable, wherein one of the plurality of resin insulating layers which is an outermost layer and is exposed at the principal plane side of the substrate is provided with a recognition mark formed according to a difference between shades of a color of a resin surface.
2. The multilayer wiring substrate as claimed in claim 1, wherein a conductor section is exposed at an outer edge section of the principal plane side of the substrate and the multilayer wiring substrate further comprises a positioning mark which is recognized according to a difference in an optical reflectance between the resin surface of the outermost resin insulating layer and the surface of the conductor section.
3. The multilayer wiring substrate as claimed in claim 1, wherein, on the resin insulating layer which is the outermost layer and is exposed at the principal plane side of the substrate, a pattern formed according to the difference in the shades of the color of the resin surface and in which a picture of a predetermined pattern is regularly arrayed is provided.
4. A method of manufacturing the multilayer wiring substrate described in claim 1, comprising:
a plating layer forming process for forming product plating layers which provide the plurality of chip component connecting terminals on a surface of the outermost resin insulating layer which is exposed at the principal plane side of the substrate and forming a dummy plating layer having a shape corresponding to the recognition mark;
a recognition mark forming process for changing a color of the surface of the outermost insulating layer by a heat treatment for the outermost resin insulating layer; and
a dummy plating layer removing process for removing the dummy plating layer through an etching after forming etching resists to cover the product plating layers at the principal plane side of the substrate.
5. A method of manufacturing a multilayer wiring substrate, the multilayer wiring substrate having a principal plane of the substrate and a rear plane of the substrate, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and having a plurality of chip component connecting terminals to which chip components are connectable, the method comprising a plating layer forming process for forming product plating layers which provide the plurality of chip component connecting terminals on a surface of one of the resin insulating layers which is an outermost layer and is exposed at the principal plane side of the substrate and forming a dummy plating layer on surroundings of the product plating layers.
6. The method of manufacturing the multilayer wiring substrate as claimed in claim 5, wherein the method further comprises: a resist forming process for forming etching resists to cover the product plating layers on the principal plane side of the substrate; and a plating layer removing process for removing the dummy plating layer exposed at the principal plane side of the substrate through an etching.
7. The method of manufacturing the multilayer wiring substrate as claimed in claim 5, wherein, in the plating layer forming process, the dummy plating layer such that a rate of area of the plating layers to a surface area of the principal plane of the substrate is equal to or larger than 60% but equal to or smaller than 95% is formed.
8. The method of manufacturing the multilayer wiring substrate as claimed in claim 6, wherein the method further comprises: a lamination process for laminating the plurality of resin insulating layers and the plurality of conductor layers on a supporting base material via a metal foil; and a base material separating process for separating the supporting base material at an interface of the metal foil to expose the metal foil at the rear plane side of the substrate and wherein the plating layer removing process follows the base material separating process and, at the same time when the dummy plating layer on the principal plane side of the substrate is removed through the etching, the metal foil on the rear plane side of the substrate is removed through the etching.
9. The method of manufacturing the multilayer wiring substrate as claimed in claim 5, wherein, in the plating layer forming process, in a case where a rate of area of the dummy plating layer occupied in a dummy plating layer forming region defined by an outer edge of the dummy plating layer is equal to or larger than 30% but is equal to or smaller than 100%, the dummy plating layer such that a distance between each of the product plating layers and the dummy plating layer is equal to or larger than 0.1 mm but is equal to or smaller than 10 mm is formed.
10. The method of manufacturing the multilayer wiring substrate as claimed in claim 9, wherein, in a case where the plurality of chip component connecting terminals are a plurality of IC chip connecting terminals to which an IC chip constituting one of the chip components is connectable, a longitudinal dimension of a rectangular chip mounting region in which the plurality of IC chip connecting terminals are arrayed and a lateral dimension thereof are X (cm) and Y (cm), and a design value of a thickness of the product plating layers at the plurality of the IC chip connecting terminals is Z(\u03bcm), a standard deviation \u03c3(\u03bcm) of actual measurement values of the thickness of the product plating layers is expressed as described in the following equation:
\u03c3
\u2266
1.5
\xd7
(
Z
15
)
\xd7
(
X
2
+
Y
2
2
)
.