1. A spiked leg for being attached to a musical instrument or a musical instrument stand, the spiked leg comprising:
a leg member to be coupled to the musical instrument or the musical instrument stand;
a stopper fixed to a distal end of the leg member, wherein the stopper is formed of rubber and is adapted to contact a set-up surface for the musical instrument or the musical instrument stand;
a spike accommodated in a longitudinal hole of the stopper, wherein the spike has a proximal end and a distal end, the proximal end of the spike is opposite to the distal end of the spike, the proximal end of the spike is closer to the leg member than the distal end of the spike, and the distal end of the spike is adapted to abut against the set-up surface, and
a cylindrical holder located between a wall surface of the longitudinal hole and the spike, wherein
the cylindrical holder is rigid and is fitted in the longitudinal hole,
the longitudinal hole has a distal opening at a lower end of the stopper, and a cross-sectional shape of the distal opening is approximately the same as that of the cylindrical holder to permit the cylindrical holder to be installed in the stopper through the distal opening,
the proximal end of the spike is spaced apart from the distal end of the leg member, and a part of the stopper is located between the proximal end of the spike and the distal end of the leg member,
the spike and the cylindrical holder form a unit, and
the cylindrical holder is spaced apart from the distal end of the leg member, and the part of the stopper is located between the holder and the distal end of the leg member, to prevent direct contact between the leg member and the unit for limiting transmission of vibrations between the leg member and the unit.
2. The spiked leg according to claim 1, wherein
the stopper includes a first longitudinal hole, in which the distal end of the leg member is fixed, and a second longitudinal hole, in which the spike is accommodated, and
the distal end of the leg member is fixed in the first longitudinal hole by a first fixing member, and the holder is fixed in the second longitudinal hole by a second fixing member.
3. The spiked leg according to claim 1, wherein
the spike is supported to be movable along an axis of the spike with respect to the stopper,
the stopper includes an adjusting screw for adjusting a position of the spike with respect to the stopper, and
a head of the adjusting screw is arranged toward outside of the musical instrument or the musical instrument stand.
4. The spiked leg according to claim 1, wherein the spiked leg is attached to the musical instrument, the leg member is coupled to the musical instrument, and the set up surface is for the musical instrument.
5. The spiked leg according to claim 1, wherein the spiked leg is attached to the musical instrument stand, the leg member is coupled to the musical instrument stand, and the set up surface is for the musical instrument stand.
6. A spiked leg adapted for attachment to a musical instrument or a musical instrument stand, the spiked leg comprising:
a leg member adapted to be coupled to the musical instrument or the musical instrument stand;
a stopper fixed to a distal end of the leg member, wherein the stopper is formed of rubber and is adapted to contact a set-up surface;
a spike accommodated in a longitudinal hole of the stopper, wherein the spike has a proximal end and a distal end, the proximal end of the spike is opposite to the distal end of the spike, the proximal end of the spike is closer to the leg member than the distal end of the spike, and a distal end of the spike is adapted to abut against the set-up surface, and
a cylindrical holder located between a wall surface of the longitudinal hole and the spike, wherein
the cylindrical holder is rigid and is fitted in the longitudinal hole,
the longitudinal hole has a distal opening at a lower end of the stopper, and a cross-sectional shape of the distal opening permits the cylindrical holder to be installed in the stopper through the distal opening,
the spike is spaced apart from the leg member, and a part of the stopper is located between the proximal end of the spike and the distal end of the leg member,
the spike and the cylindrical holder form a unit,
the cylindrical holder is spaced apart from the distal end of the lea member, and the part of the stopper is located between the holder and the distal end of the leg member, to prevent direct contact between the leg member and the unit for limiting transmission of vibrations between the leg member and the unit.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of mounting a semiconductor device having bumps on a board having pads so that each of said bumps is joined to a corresponding one of said pads, an adhesive to be hardened by heat being provided between said semiconductor device and said board, said method comprising the steps of:
(a) pressing said bumps of said semiconductor device on said pads of said board; and
(b) heating a portion in which each of said bumps and a corresponding one of said pads are in contact with each other, wherein pressure of said bumps against said pads reaches a predetermined value before a temperature of said adhesive to which heat is supplied in step (b) reaches temperature at which said adhesive is hardened.
2. A method of mounting a semiconductor device having bumps on a board having pads so that each of said bumps is joined to a corresponding one of said pads, an adhesive to be hardened by heat being provided between said semiconductor device and said board, said method comprising the steps of:
(a) causing a head heated at a temperature at which said adhesive is hardened to press said semiconductor device on said board so that each of said bumps is pressed on a corresponding one of said pads, wherein pressure of said bumps against said pads reaches a predetermined value before a temperature of said adhesive to which heat is supplied from said head reaches temperature at which said adhesive is hardened; and
(b) releasing said head from pressing said semiconductor device after said adhesive is completely hardened.
3. A method of mounting a semiconductor device having bumps on a board having pads so that each of said bumps is joined to a corresponding one of said pads, an adhesive to be hardened by heat being provided between said semiconductor device and said board, said method comprising the steps of:
(a) providing a member between said semiconductor device and said board, said member having a thermal characteristic of delaying transmission of heat;
(b) causing a head heated at a temperature at which said adhesive is hardened to press said semiconductor device against said board via said member so that each of said bumps is pressed against a corresponding one of said pads, wherein the transmission of the heat from said head to said adhesive is delayed by said member so that pressure of said bumps against said pads reaches a predetermined value before a temperature of said adhesive to which heat is supplied from said head reaches a temperature at which said adhesive is hardened; and
(c) releasing said head from pressing said semiconductor device after said adhesive is completely hardened.
4. The method as claimed in claim 3,
wherein said member is a sheet, and wherein said step (a) has a step of:
(a-1) moving said sheet by one step after said step (c) so that a new part of said sheet which has not yet used is fed into a space between said semiconductor device and said board.
5. The method as claimed in claim 3,
wherein said member is selected from among a group including a polyimide film sheet, a polyester film sheet and a silicon film sheet.