1. An imaging device mounting apparatus, comprising:
a mounting plate including first mounting structure for mounting said mounting plate to a mounting surface, and second mounting structure for mounting an imaging device to said mounting plate; and
stabilizing structure secured to said mounting plate and including three adjustable fasteners movably positionable with respect to said mounting plate, each of said three adjustable fasteners including a deformnable cap adapted for contacting an imaging device mounted to said mounting plate and positioning said imaging device into a three-point stabilization position.
2. The apparatus of claim I wherein said mounting plate defines a central axis positioned perpendicular to said mounting plate, and wherein said second mounting structure is positioned a distance closer to said central axis than said stabilizing structure.
3. The apparatus of claim 1 wherein said three adjustable fasteners of said stabilizing structure includes three all-thread fasteners each secured within a threaded aperture of said mounting plate.
4. The apparatus of claim 1 wherein each of said deformable cap comprises a flexible bumper.
5. The apparatus of claim 1 wherein said first mounting structure comprises four threaded fasteners each positioned within an aperture of said mounting plate.
6. The apparatus of claim 1 wherein said second mounting structure comprises three threaded fasteners each positioned within an aperture of said mounting plate.
7. The apparatus of claim 1 wherein said mounting surface is chosen from one of the group including a ceiling surface, a wall surface, and a surface of a movable arm.
8. The apparatus of claim 1 wherein said mounting plate further comprises a central aperture adapted to allow an imaging device cable to pass therethrough.
9. The apparatus of claim 1 wherein said deformable caps are manufactured of one of rubber, silicone, neoprene, and foam.
10. A method of making an imaging device mounting structure, comprising:
providing a mounting member;
forming first mounting structure on said mounting member, said first mounting structure adapted to secure said mounting member to a mounting surface;
forming second mounting structure on said mounting member, said second mounting structure adapted for securing an imaging device to said mounting member; and
securing stabilizing structure on said mounting member, said stabilizing structure consisting of three adjustable fasteners each including a flexible end cap adapted for contacting an imaging device mounted to said mounting member and securing said imaging device in a three-point stabilization position.
11. The method of claim 10 wherein said forming said first mounting structure comprises forming a plurality of apertures in said mounting member, said apertures adapted to receive fasteners therethrough to secure said mounting member to a mounting surface.
12. The method of claim 10 wherein said forming said second mounting structure comprises forming a plurality of apertures in said mounting member, said apertures adapted to receive fasteners therethrough to secure said imaging device to said mounting member.
13. The method of claim 10 wherein said securing said stabilizing structure on said mounting member comprises securing three all-thread fasteners to said mounting member such that each of said flexible end caps is forced against an imaging device mounted on said mounting member.
14. The method of claim 13 wherein said securing comprises adjusting a height of an end region of each of said all-thread fasteners with respect to a top surface of said mounting member.
15. The method of claim 10 further comprising forming an aperture in said mounting member, said aperture adapted to allow passage of an imaging device cable therethrough.
16. A method of using an imaging device mounting structure, comprising:
mounting an imaging device to a mounting plate;
adjusting a position of each of three stabilizing devices with respect to said mounting plate such that a deformable end bumper of each stabilizing device pushes against said imaging device and forces said imaging device into a three-point stabilized position;
mounting said mounting plate to a mounting surface.
17. The method of claim 16 wherein said adjusting a position of each of said three stabilizing devices comprises adjusting a height of an end region of each of said deformable end bumpers above a first surface of said mounting plate.
18. The method of claim 16 wherein said mounting said imaging device to said mounting plate comprises securing said imaging device to said mounting plate with threaded fasteners each positioned closer to a central axis of said mounting plate than said three stabilizing devices.
19. The method of claim 16 further comprising securing each of said three stabilizing devices in said three-point stabilized position.
20. The method of claim 19 wherein said three stabilizing devices each comprise a threaded fastener and wherein said securing comprising securing a lock nut on each of said three threaded fasteners.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-band antenna for sendingreceiving wireless communication signals in a plurality of frequency bands comprising:
a feed element for sendingreceiving signals associated with the wireless communication signals; and,
a stepped-impedance structure connected to the feed element, the stepped-impedance structure having a plurality of concatenated stepped-impedance elements, each stepped-impedance element having a predetermined impedance and a predetermined electrical length associated with a resonance mode for sendingreceiving wireless communication signals in a respective frequency band of the plurality of frequency bands.
2. A multi-band antenna as defined in claim 1, wherein the stepped-impedance structure comprises a plurality of folded stripe lines with each stripe line being associated with a respective stepped-impedance element.
3. A multi-band antenna as defined in claim 2, comprising a shorted element connected to one of the stepped-impedance elements at a first end and connected to a ground plane at a second end.
4. A multi-band antenna as defined in claim 2, wherein the feed element comprises an interdigitated coupler.
5. A multi-band antenna as defined in claim 2, wherein the multi-band antenna forms a planar inverted F-antenna.
6. A multi-band antenna as defined in claim 1, wherein the stepped-impedance structure comprises more than two stepped-impedance elements for sendingreceiving wireless communication signals in more than two frequency bands.
7. A multi-band antenna for sendingreceiving wireless communication signals in a plurality of frequency bands comprising:
an interdigitated coupled feed element disposed on a dielectric substrate, the interdigitated coupled feed element for transmitting signals associated with the wireless communication signals;
a stepped-impedance structure disposed on the dielectric substrate and connected to the feed element, the stepped-impedance structure having a plurality of concatenated folded stripe lines, each folded stripe line having a predetermined impedance and a predetermined electrical length associated with a resonance mode for sendingreceiving wireless communication signals in a respective frequency band of the plurality of frequency bands; and
a shorted element disposed on the dielectric substrate, the shorted element being connected to one of the folded stripe lines at a first end and connected to a ground plane at a second end.
8. A multi-band antenna as defined in claim 7, wherein the interdigitated coupled feed element and the stepped-impedance structure are disposed on a first surface of the dielectric substrate, and wherein the ground plane is disposed on a second opposite surface of the dielectric substrate.
9. A multi-band antenna as defined in claim 8, wherein the stepped-impedance structure comprises more than two folded stripe lines for sendingreceiving wireless communication signals in more than two frequency bands.
10. A multi-band antenna as defined in claim 8, wherein the stepped-impedance structure comprises five folded stripe lines for sendingreceiving wireless communication signals in frequency bands centered at 915 MHz, 1575 MHz, 2400 MHz, 3200 MHz and 5800 MHz.