What is claimed is:
1. A method of transferring a laminate comprising:
forming an object to be peeled over a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled, and bonding the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled.
2. A method of transferring a laminate comprising:
forming an object to be peeled over a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled, and bonding one side of the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled, and bonding another side of the object to be peeled to a second transferring member.
3. A method of transferring a laminate comprising:
forming an object to be peeled over a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled by physical means, and bonding the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled.
4. A method of transferring a laminate comprising:
forming an object to be peeled on a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled by physical means, and bonding one side of the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled, and bonding the other side of the object to be peeled to a second transferring member.
5. A method of transferring a laminate according to any one of claims 1 to 4, wherein the object to be peeled has a semiconductor element comprising at least one selected from a thin film transistor, an organic thin film transistor, a thin film diode, a photoelectric conversion element, and a resistive element.
6. A method of transferring a laminate according to any one of claims 1 to 4, wherein the object to be peeled has an oxide layer comprising at least one selected from silicon oxide or metal oxide, and the oxide layer is in contact with contacting the peeling layer.
7. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peeling layer comprises a metal film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium.
8. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peeling layer comprises a nitride film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium.
9. A method of transferring a laminate according to any one of claims 1 to 4, wherein an adhesive of the peelable adhesive medium comprises an adhesive that is peeled by heat.
10. A method of transferring a laminate according to any one of claims 1 to 4, wherein an adhesive of the peelable adhesive medium comprises an adhesive that is peeled by ultraviolet light.
11. A method of transferring a laminate according to any one of claims 1 to 4, wherein one adhesive of the peelable adhesive medium comprises an adhesive that is peeled by heat, and another adhesive of the peelable adhesive medium comprises an adhesive that is peeled by ultraviolet light.
12. A method of transferring a laminate according to any one of claims 1 to 4, wherein the first transferring member comprises a plastic.
13. A method of transferring a laminate according to any one of claims 2 and 4, wherein the second transferring member comprises a plastic.
14. A method of transferring a laminate according to any one of claims 1 to 4, wherein the peelable adhesive medium comprises a two-sided tape.
15. A method of manufacturing a semiconductor device comprising:
forming an object to be peeled comprising a semiconductor element over a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled, and bonding the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled.
16. A method of manufacturing a semiconductor device comprising:
forming an object to be peeled comprising a semiconductor element, on a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled, and bonding one side of the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled, and bonding the other side of the object to be peeled to a second transferring member.
17. A method of manufacturing a semiconductor device comprising:
forming an object to be peeled comprising a semiconductor element, on a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled by physical means, and bonding the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled.
18. A method of manufacturing a semiconductor device comprising:
forming an object to be peeled comprising a semiconductor element, on a first substrate through a peeling layer;
bonding a support to the object to be peeled through a peelable adhesive medium;
peeling the peeling layer and the object to be peeled by physical means, and bonding one side of the object to be peeled to a first transferring member; and
peeling the support and the peelable adhesive medium from the object to be peeled, and bonding the other side of the object to be peeled to a second transferring member.
19. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the object to be peeled has a semiconductor element comprising at least one selected from a thin film transistor, an organic thin film transistor, a thin film diode, a photoelectric conversion element, and a resistive element.
20. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the object to be peeled has an oxide layer comprising at least one selected from silicon oxide or metal oxide, and the oxide layer is in contact with contacting the peeling layer.
21. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the peeling layer comprises a metal film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium.
22. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the peeling layer comprises a nitride film containing at least one element selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium, osmium, and iridium.
23. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein an adhesive of the peelable adhesive medium comprises an adhesive that is peeled by heat.
24. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein an adhesive of the peelable adhesive medium comprises an adhesive that is peeled by ultraviolet light.
25. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein one adhesive of the peelable adhesive medium comprises an adhesive that is peeled by heat, and another adhesive of the peelable adhesive medium comprises an adhesive that is peeled by ultraviolet light.
26. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the first transferring member comprises a plastic.
27. A method of manufacturing a semiconductor device according to any one of claims 16 and 18, wherein the second transferring member comprises a plastic.
28. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the peelable adhesive medium comprises a two-sided tape.
29. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the semiconductor device is at least one selected from the group consisting of a personal computer, a video camera, a mobile computer, a goggle-type display, a player using a recording medium, a digital camera, a mobile telephone, and an electronic book.
30. A method of manufacturing a semiconductor device according to any one of claims 15 to 18, wherein the peelable adhesive medium comprises a two-sided tape.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A bag comprising:
a) a flat rectangular piece of flexible material having two long side edges and a short top edge and a bottom edge;
b) wherein a the two long side edges are joined by one hip side seam;
c) wherein the bottom edge is attached along a pleating seam and secures pleats along the bottom edge, thus forming a bag assembly;
d) wherein the short top edge encloses one or more flexible loop rings and attaches to the rectangular piece of flexible material by use of a retention seam thus forming a hip loop assembly;
e) wherein a belt is attached to a hip side section of the bag body by use of a belt retaining patch; and
f) wherein a handle is attached within the pleating seam.
2. The bag of claim 1 wherein the one or more flexible loop rings deflect in a linear fashion when pressed.
3. The bag of claim 1 wherein the flexible loop rings within the hip loop assembly form an oval shape of approximately 20 to 24 cm measured from a hip side to an outer side of the hip loop assembly and of approximately 23 to 28 cm measured from a rear side and the front side of the hip loop assembly.
4. The bag of item 3 wherein a 0.5 kg of weight applied to the hip side of the hip loop assembly causes the hip side of the hip loop assembly to travel 1 to 3 cm toward the outer side of the hip loop assembly.
5. The bag of claim 4 wherein a 1.0 kg of weight applied to the hip side of the of the hip loop assembly causes the hip side of the hip loop assembly to travel 6 to 10 cm toward the outer side of the hip loop assembly.
6. The bag of claim 5 wherein a 1.5 kg of weight applied to the hip side of the of the hip loop assembly causes the hip side of the hip loop assembly to travel 13 to 117 cm toward the outer side 102 of the hip loop assembly.