1. A computer program product, comprising a non-transitory computer usable medium having a computer readable program code embodied therein, the computer readable program code adapted to be executed to implement a method for creating an object within a system, utilizing a template, the method comprising:
receiving a request to create an object within a system;
creating the object within the system, utilizing a template; and
distributing the object to all tenants of the system.
2. The computer program product of claim 1, wherein the system includes a multi-tenant on-demand database system.
3. The computer program product of claim 1, wherein the template includes a standard template object with one or more low-level parameters and standard system fields.
4. The computer program product of claim 3, wherein one or more standard system fields of the template are predefined.
5. The computer program product of claim 1, wherein one or more platform features of the system are supported by the template.
6. The computer program product of claim 1, wherein the template is used as the basis for the object.
7. The computer program product of claim 1, wherein the object inherits one or more characteristics from the template.
8. The computer program product of claim 1, wherein the object inherits one or more of standard fields and standard features from the template.
9. The computer program product of claim 1, wherein the object includes an identifier.
10. The computer program product of claim 1, wherein the object includes a distinct key prefix.
11. The computer program product of claim 1, wherein the computer program product is operable such that the object is stored in a database of the system once it is created.
12. The computer program product of claim 11, wherein the object is stored within a single database table that stores all objects created within the system.
13. The computer program product of claim 1, wherein creating the object includes creating a subclass for the object.
14. The computer program product of claim 13, wherein a concrete subclass is created for the object that handles the loading of the object and the saving of the object.
15. The computer program product of claim 1, wherein the object includes a plurality of fields.
16. The computer program product of claim 15, wherein a pool of standard fields is implemented for the object.
17. The computer program product of claim 16, wherein one or more of the plurality fields are initialized utilizing metadata.
18. The computer program product of claim 1, wherein distributing the object to all tenants of the system includes making the object available for use by all tenants of the system.
19. A method, comprising:
receiving a request to create an object within a system;
creating the object within the system, utilizing a template and a processor; and
distributing the object to all tenants of the system.
20. An apparatus, comprising:
a processor for:
receiving a request to create an object within a system;
creating the object within the system, utilizing a template; and
distributing the object to all tenants of the system.
21. A method for transmitting code for use in a multi-tenant database system on a transmission medium, the method comprising:
transmitting code for receiving a request to create an object within a system;
transmitting code for creating the object within the system, utilizing a template and a processor; and
transmitting code for distributing the object to all tenants of the system.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of improving thermal dissipation from a module assembly, the method comprising:
attaching a first side of at least one chip to a single chip carrier or multi chip carrier, the at least one chip having a second side opposite of the first side;
grinding the second side of the at least one chip to a desired surface profile;
selectively thinning a portion of the second side beyond the desired surface profile;
applying a heat transfer medium on at least one of a heat sink, including a pedestal, and the second side of the at least one chip; and
disposing the heat sink on the second side of the at least one chip with the pedestal positioned proximate to the selectively thinned portion and with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip,
wherein the gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.
2. The method of claim 1, wherein the chip carrier is one of a ceramic chip carrier or an organic chip carrier.
3. The method of claim 1, further comprising mounting a discrete device to the single chip carrier before the grinding.
4. The method of claim 3, wherein the discrete device is selected from the group consisting of semiconductors, inductors, capacitors, resistors and thermistors.
5. The method of claim 1, wherein the grinding includes grinding and polishing the second side of the at least one chip after being attached to the chip carrier to be one of in a coplanar or nonplanar configuration.
6. The method of claim 1, further comprising:
mounting a first side of at least one dummy device on the chip carrier, each dummy device having a second side opposite of the first side; and
grinding the second side of each dummy device to be one of coplanar with the second side of the at least one chip or surface ground as a standoff to register the at least one chip and dummy device to the heat sink.
7. The method of claim 1, further comprising dispensing an underfill at least one of around and under the at least one chip before the grinding.
8. The method of claim 1, wherein the heat transfer medium is one of a thermal paste or thermal grease.
9. The method of claim 1, wherein the grinding includes a dry grinding process carried out at an operating temperature above or below room temperature.
10. The method of claim 1, further comprising one of heating, cooling or clamping the chip carrier during the grinding to customize a shape of the chip carrier at an operation temperature thereof.
11. A module assembly comprising:
a chip carrier substrate;
a first side of at least one chip permanently mounted to the chip carrier, each chip having a second side opposite of the first side and including a locally thinned portion; and
a heat sink, including a pedestal, disposed on the second side of each chip with the pedestal positioned proximate to the locally thinned portion to define a gap between the second side of the chip and the heat sink, the gap being filled with a heat transfer medium,
wherein the gap is defined by grinding the second side of each chip to a desired surface profile after permanently mounting the at least one chip to the chip carrier substrate to control heat transfer from the second side of each chip to the heat sink.
12. The module assembly of claim 11, wherein the chip carrier substrate is one of a ceramic chip carrier substrate or an organic chip carrier substrate.
13. The module assembly of claim 11, further comprising at least one discrete device mounted to the chip carrier substrate.
14. The module assembly of claim 13, wherein the discrete device is selected from the group consisting of semiconductors, inductors, capacitors, resistors and thermistors.
15. The module assembly of claim 11, further comprising:
a first side of at least one dummy device mounted on the chip carrier, each dummy device having a second side opposite of the first side; and
the second side of each dummy device is ground to be one of coplanar with the second side of each chip or surface ground as a standoff to register each chip and dummy device to the heat sink.
16. The module assembly of claim 11, an underfill at least one of around and under the at least one chip.
17. The module assembly of claim 11, wherein the heat transfer medium is one of a thermal paste or thermal grease.
18. The module assembly of claim 11, wherein the gap is uniform.
19. A method of manufacturing an electronic packaging structure to enhance heat transfer performance, the method comprising:
providing a chip carrier;
providing at least one semiconductor device having a first side and a second side;
permanently attaching the semiconductor device to the chip carrier with the first side facing the chip carrier;
grinding the second side to a desired surface profile;
selectively thinning a portion of the second side beyond the desired surface profile; and
attaching a heat sink, including a pedestal, to the chip carrier with the pedestal positioned proximate to the selectively thinned portion of the second side of the semiconductor device and with a heat transfer paste disposed between the heat sink and the second side,
wherein a gap between the second side and the heat sink is controlled via the grinding to improve heat transfer between the semiconductor device and the heat sink.
20. The method of claim 18, wherein the heat spreader is a package lid.