1. A bed having a bed frame and a patient support surface, the patient support surface having an upper surface and supported at the bed frame, and a siderail mounted at the bed frame for deployment from a stowed position to a deployed position wherein the siderail extends alongside the patient support surface and above the upper surface of the patient support surface, and wherein the siderail comprises:
an upper horizontal rail;
a lower horizontal rail; and
a pair of support arms pivotally connecting and generally aligning the upper and lower horizontal rails in a common plane, the common plane being generally vertically aligned when the siderail is in the deployed position, the support arms pivotally connecting the upper and lower horizontal rails at the bed frame and being arranged to collapse the siderail in the manner of a four-bar linkage, and the siderail being configured to rotate under the bed frame in the stowed position wherein the upper horizontal rail and the lower horizontal rail generally remain in the common plane when the siderail is collapsed and rotated but with the common plane moving under the bed frame.
2. The bed of claim 1, wherein the siderail is connected to the bed frame by a gear drive mechanism, whereby the collapsing of the siderail simultaneously rotates the siderail under the bed frame.
3. The bed according to claim 1, wherein the siderail is connected to the bed frame by a pair of gear drive mechanisms, each of the gear drive mechanisms including a first gear mounted to a respective support arm and a second gear mounted at or adjacent the bed frame.
4. The bed according to claim 3, wherein each of the support arms is pivotally mounted about a respective second gear about a first axis of rotation and about a second axis of rotation, the second axes of rotation rotating about the first axes of rotation when the first gears are driven about the second gears.
5. The bed according to claim 4, wherein each of the first and second gears comprises a helical gear.
6. The bed according to claim 1, wherein the siderail is configured to move downwardly and inwardly under the bed frame simultaneously.
7. The bed according to claim 1, wherein the upper and lower horizontal rails rotate from a spaced apart generally vertical orientation when the siderail is in its deployed position to a compact generally horizontal orientation when the siderail is in its stowed position.
8. A bed having a bed frame and a siderail mounted at the bed frame for deployment from a stowed position to a deployed position wherein the siderail extends along the bed frame, the bed frame having a longitudinal central axis extending from a head end of the bed frame to a foot end of the bed frame, the siderail comprising:
an upper rail;
a lower rail; and
a pair of support arms pivotally connected to the upper rail and the lower rail, the upper rail, the lower rail, and the support arms being configured as a four-bar linkage wherein the upper and lower rails are arranged to collapse when the support arms are moved relative to the bed frame, and each of the support arms being pivotally mounted for pivotal movement relative to the bed frame about a first pivot axis and about a second pivot axis, and the second pivot axes rotating about the first pivot axes when the siderail is pivoted relative to the bed frame, wherein when the upper rail is moved relative to the lower rail, the upper and lower rails move from their deployed position to a collapsed and rotated configuration wherein the upper rail and the lower rail are adjacent each other and generally lie in a common plane generally parallel to and below the bed frame.
9. The bed according to claim 8, wherein the support arms pivot about the first and second axes simultaneously.
10. The bed according to claim 8, wherein each of the first pivot axes is generally orthogonal to a respective second pivot axis.
11. The bed according to claim 8, wherein the support arms are pivotally mounted at or adjacent the bed frame by gear mechanisms.
12. The bed according to claim 11, wherein the siderail simultaneously pivots about the first and second pivot axes when the siderail moves relative to the bed frame.
13. The bed according to claim 11, wherein the gear mechanisms includes a first gear mounted to each of the support arms and a pair of second gears mounted at the bed frame.
14. The bed according to claim 13, wherein each of said support arms is pivotally mounted by a first pivot shaft defining the first pivot axis and by a second pivot shaft defining the second pivot axis, the first gears being mounted about the second gears by the first pivot shafts.
15. The bed according to claim 13, wherein the first gears are pivotally mounted about the second gears by first and second pivot shafts, and each of the second pivot axes pivoting about a respective first pivot axis when the first gears are driven about the second gears.
16. A patient support having a frame and a siderail connected at or adjacent the frame for deployment from a stowed position to a deployed position wherein the siderail extends along side the frame, the siderail comprising:
a rail;
a pair of support arms mounted for pivotal movement relative to the frame, each of the support arms pivotally connected to the rail about an upper pivot axis and being pivotally connected at the frame about a first pivot axis generally perpendicular to a respective upper pivot axis and about a second pivot axis, and the rail and the arms generally lying in a common plane, with the common plane being generally vertical when in the deployed position, and when the rail is moved and the arms pivot relative to the frame the second pivot axes rotate about the first pivot axes and the rail and the arms collapse into the common plane which rotates and extends under the frame when in the stowed position.
17. The patient support according to claim 16, wherein the siderail has a range of motion and the siderail is configured to move inward relative to the frame over at least a portion of the range of motion.
18. The patient support according to claim 17, wherein the siderail is configured to move simultaneously downward and inward relative to the frame over at least a portion of the range of portion.
19. The patient support according to claim 16, wherein each of the support arms includes a first gear, the frame supporting a pair of second gears, the first gears pivotally mounted about the second gears about the first pivot axes, and the first gears being driven about the second gears when the siderail is moved relative to the frame.
20. The patient support according to claim 19, wherein each of the first gears is pivotally mounted about a respective second gear by a pivot shaft, and each of the first gears being pivotally mounted to a respective pivot shaft.
21. A patient support comprising:
a frame defining a generally horizontal plane for supporting a patient support surface; and
a siderail supported at the frame, the siderail having an upper rail and a lower rail, the upper rail and the lower rail being spaced apart when in a deployed position and being interconnected by at least two arms, each arm pivotally connected at the frame and to the upper rail and to the lower rail wherein the rails and the support arms form a four bar linkage, wherein when the upper rail is moved relative to the lower rail, the upper and lower rails move from their spaced apart configuration to a collapsed and rotated configuration wherein the upper rail, the lower rail, and the support arms are adjacent each other and generally lie in a common plane below the horizontal plane of the frame.
22. The patient support according to claim 21, further comprising a plurality of spindles extending between the lower rail and the upper rail between the support arms, the spindles being pivotally mounted to the upper rail at one end thereof and pivotally mounted to the lower rail at an opposed end thereof.
23. The patient support according to claim 21, wherein each of the support arms is pivotally mounted at the frame about a first pivot shaft, the frame having a generally central longitudinal axis extending from a head end of the frame to a foot end of the frame, and each of the first pivot shafts having a pivot axis being generally parallel to the central longitudinal axis.
24. The patient support according to claim 23, wherein each of the support arms is pivotally mounted at the frame by a second pivot shaft, each of the second pivot shafts being generally orthogonal to a respective first pivot shaft.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of forming a package comprising:
forming a circuit pattern on a first carrier;
embedding the circuit pattern in a first surface of a dielectric material, a second surface of the dielectric material opposite the first surface being directly mounted on a second carrier, the embedding comprising causing the dielectric material to directly contact the first carrier and the second carrier, wherein the dielectric material remains between the circuit pattern and the second carrier;
removing the first carrier;
mounting a buildup dielectric material to the dielectric material and the circuit pattern;
forming laser-ablated artifacts in the buildup dielectric material;
filling the laser-ablated artifacts with an electrically conductive material to form a buildup circuit pattern; and
subsequent to the embedding, patterning the second carrier into a stiffener.
2. The method of claim 1 further comprising forming bond finger openings in the dielectric material, the bond finger openings exposing and defining lands of the circuit pattern.
3. The method of claim 2 further comprising attaching a die to the dielectric material.
4. The method of claim 3 wherein the attaching a die to the dielectric material comprises attaching an inactive surface of the die to the dielectric material with a die attach adhesive, the die further comprising an active surface comprising bond pads.
5. The method of claim 4 further comprising electrically connecting the bond pads to the lands with bond wires.
6. The method of claim 5 further comprising forming at least one electrically conductive blind via between the circuit pattern and the second carrier.
7. The method of claim 6 wherein the blind via is electrically connected to the stiffener, the stiffener comprising an electrically conductive material.
8. The method of claim 7 wherein the stiffener is connected to a reference voltage source through the blind via.
9. The method of claim 8 wherein the stiffener functions as a reference voltage source ring.
10. The method of claim 9 wherein the electrically connecting the bond pads to the lands with bond wires further comprises electrically connecting one or more of the bond pads to the stiffener with the bond wires.
11. The method of claim 5 further comprising encapsulating the stiffener, the die, the bond wires and an exposed portion of the dielectric material in a package body.
12. The method of claim 1 further comprising forming interconnection balls on the buildup circuit pattern.
13. The method of claim 1 further comprising:
forming bond finger openings in the dielectric material, the bond finger openings exposing and defining lands of the circuit pattern;
attaching an inactive surface of an image sensor die to the dielectric material with a die attach adhesive, the image sensor die further comprising an active surface comprising bond pads and an active area responsive to electromagnetic radiation;
electrically connecting the bond pads to the lands with bond wires; and
attaching a transparent window to the stiffener.
14. The method of claim 1 further comprising:
forming bond finger openings in the dielectric material, the bond finger openings exposing and defining lands of the circuit pattern; and
flip chip die attaching bond pads of a die to the lands with flip chip bumps.
15. The method of claim 7 wherein the electrically conductive material is selected from the group consisting of copper, copper invar copper, copper aluminum copper and copper alloys.
16. A method of forming a package comprising:
forming a circuit pattern on a first carrier;
embedding the circuit pattern in a first surface of a dielectric material, a second surface of the dielectric material opposite the first surface being directly mounted on a second carrier, the embedding comprising causing the dielectric material to directly contact the first carrier and the second carrier, wherein the dielectric material remains between the circuit pattern and the second carrier;
removing the first carrier;
mounting a buildup dielectric material to the dielectric material and the circuit pattern;
forming laser-ablated artifacts in the buildup dielectric material;
filling the laser-ablated artifacts with an electrically conductive material to form a buildup circuit pattern; and
subsequent to the embedding, patterning the second carrier into a stiffener, the stiffener comprising:
a rectangular body around a periphery of the package; and
fingers protruding inwards from the body towards a center of the package.
17. The method of claim 16 wherein the body comprises four sides and four corners.
18. The method of claim 17 wherein one of the fingers protrudes inwards from a middle of each of the sides.
19. The method of claim 18 wherein one of the fingers protrudes inwards from each of the corners.
20. The method of claim 19 wherein the fingers consist of eight fingers.
21. The method of claim 16 wherein each of the fingers extends from the body with a uniform width.
22. A method of forming a package comprising:
forming a circuit pattern on a first carrier;
embedding the circuit pattern in a first surface of a dielectric material, a second surface of the dielectric material opposite the first surface being directly mounted on a second carrier, the embedding comprising causing the dielectric material to directly contact the first carrier and the second carrier, wherein the dielectric material remains between the circuit pattern and the second carrier;
removing the first carrier;
mounting a buildup dielectric material to the dielectric material and the circuit pattern;
forming laser-ablated artifacts in the buildup dielectric material;
filling the laser-ablated artifacts with an electrically conductive material to form a buildup circuit pattern; and
subsequent to the embedding, patterning the second carrier into a stiffener, the stiffener comprising:
a rectangular body around a periphery of the package; and
fingers protruding inwards from the body, the fingers comprising:
a first finger having a uniform width; and
at least one tapered finger.
23. The method of claim 22 wherein the body comprises:
a first side having the first finger extending from a middle of the first side;
a second side having three of the tapered fingers extending inward therefrom;
a third side having three of the tapered fingers extending inward therefrom; and
a fourth side having an absence of the fingers.