1. An apparatus for modifying the stride of a baseball batter’s swing motion, comprising:
a stirrup sized for capturing a lower portion of a baseball batter’s foremost ambulatory appendage;
an elastomeric tethering strap comprising an end attached to said stirrup and an anchoring end connected to a substratum by means for releasably anchoring said tethering strap to said substratum affixed atop the ground surface, said strap sized for elastomerically tethering the baseball batter’s captured appendage to said substratum, said elastomericity including biasing favoring the return of said strap to its original shorter length and providing elastomeric constraint essentially equally in all directions during elastomeric lengthening of said strap, said elastomeric constraint being insufficient to prevent the batter’s foot from leaving said substratum;
said releasable anchoring means releasing when said elastomeric constraint constitutes substantial destabilizing hindrance.
2. An apparatus described in claim 1 hereinabove, said means for releasably anchoring said tethering strap to said substratum selected from the group consisting of matable halves of a snap and a hook and loop fastening system, and combinations thereof, one half attached to said substratum and the other half attached to said tethering strap anchoring end.
3. An apparatus described in claim 2 hereinabove, said means for releasably anchoring said tethering strap to said substratum comprising one matable half of a snap attached to said substratum and the other matable half of said snap attached to said tethering strap anchoring end.
4. An apparatus described in claim 1 hereinabove, said stirrup comprising a stirrup strap sized to circumnavigate at least a lower portion of a baseball batter’s foremost ambulatory appendage.
5. An apparatus described in claim 4 hereinabove, wherein said stirrup strap is long enough to capture the arch portion of the batter’s foot.
6. An apparatus described in claim 4 hereinabove, wherein said stirrup strap is long enough to capture the batter’s lowermost leg.
7. An apparatus described in claim 4 hereinabove, said stirrup strap comprising:
a first terminus and a second portion, said first terminus including one matable part of a fastening assembly selected from the group consisting of a hook-and-loop fastening system, an interlocking quick-release buckle system, at least one snap system, a standard buckling system, and combinations thereof;
said second portion comprising a cooperating mate-part of said fastening assembly, capable of ready capturing and uncapturing.
8. An apparatus described in claim 7 hereinabove, wherein:
said first terminus comprises an aperture sized to accept said stirrup strap inserted therethrough;
said stirrup strap further comprising a second terminus including one matable part of a hook-and-loop fastening system, and further comprising an intermediate portion including the cooperating mate-part of said hook-and-loop fastening system, said second terminus insertable through said aperture and doubling back against said intermediate portion for cooperative mating of said hook-and-loop fastening system.
9. An apparatus described in claim 4 hereinabove, wherein said tethering strap end attachment to said stirrup strap further comprising a second anchoring means for releasably attaching said tethering strap to said stirrup strap, selected from the group consisting of a hook-and-loop fastening system, an interlocking quick-release buckle system, at least one snap system, a standard buckling system, and combinations thereof.
10. An apparatus described in claim 9 hereinabove, wherein said second anchoring means comprises one matable part of an interlocking quick-release buckle system attached to said first terminus of said stirrup, and the other matable part of an interlocking quick-release buckle system attached to said and end of said tethering strap.
11. An apparatus described in claim 1 hereinabove, wherein said substratum comprises carpet.
12. An apparatus described in claim 11 hereinabove, further comprising at least one grommet along a foremost margin of said substratum, capable of accepting impalement by a means for staking said substratum to the underlying surface.
13. An apparatus described in claim 11 hereinabove, further comprising a plurality of marginal grommets, spaced to assure the desired level of staking of said substratum.
14. An apparatus described in claim 1 hereinabove, comprising a plurality of separate stirrups, one worn by one batter while tethered to said substratum and another worn by a prospective batter off of said substratum.
15. An apparatus described in claim 14 hereinabove, wherein each separate stirrup comprises a separate tethering strap having the length, width, thickness and elasticity suitable for optimal modification of the batting swing motion of the particular wearer.
16. An apparatus for modifying the stride of a baseball batter’s swing motion, comprising:
a stirrup strap sized for capturing the arch portion of a baseball batter’s foremost foot while standing on a substratum affixed atop the ground surface, comprising a first terminus and a second portion, said first terminus including one matable part of a hook-and-loop fastening system and said second portion comprising a cooperating mate-part of said fastening assembly, said first terminus further comprising an aperture sized to accept said stirrup strap inserted therethrough and doubling back against said second for cooperative mating of said hook-and-loop fastening system, said stirrup strap further comprising a second terminus including one matable part of a quick release buckle;
an elastomeric tethering strap comprising an end snapped to said substratum, and a second end comprising the other matable part of said quick release buckle.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
a substrate having a main surface and a back surface opposite to the main surface;
a first semiconductor chip having an upper surface and a lower surface opposite to a first surface with a side surface provided therebetween, the first semiconductor chip being mounted on the main surface of the substrate;
a plurality of bumps provided between the main surface of the substrate and the lower surface of the first semiconductor chip;
a second semiconductor chip having an upper surface and a lower surface opposite to the first surface with a side surface provided therebetween, the second semiconductor chip being mounted on the upper surface of the first semiconductor chip such that the side surface of the second semiconductor chip is positioned outward from the side surface of the first semiconductor chip;
an insulating resin covering the first semiconductor chip; and
a sealing resin formed on the main surface of the substrate and covering the second semiconductor chip and the insulating resin,
wherein a lower surface of the second semiconductor chip is larger than an upper surface of the first semiconductor chip and, in a plan view, the first semiconductor chip is entirely covered with the second semiconductor chip, and
wherein the insulating resin formed between the upper surface of the first semiconductor chip and the lower surface of the second semiconductor chip and between the main surface of the substrate and the lower surface of the second semiconductor chip.
2. The semiconductor device according to claim 1,
wherein the sealing resin touches the insulating resin and the side surface of the second semiconductor chip and the upper surface of the second semiconductor chip.
3. The semiconductor device according to claim 1,
wherein the sealing resin does not touch the side surface of the first semiconductor chip and the lower surface of the second semiconductor chip.
4. The semiconductor device according to claim 1,
wherein a height of the first semiconductor chip is not less than 15 \u03bcm and not greater then 100 \u03bcm.
5. The semiconductor device according to claim 1,
wherein the insulating resin and the sealing resin include carbon black respectively, and a content of the carbon black in the insulating resin is smaller than a content of the carbon black in the sealing resin.
6. The semiconductor device according to claim 1,
wherein the second semiconductor chip includes a bonding pad formed on the upper surface, and a bonding wire which connects the bonding pad to the substrate.
7. The semiconductor device according to claim 6,
wherein the bonding pad overlaps the insulating resin, in a plan view.