1. A golf swing training device worn by a golfer to properly develop a golf swing and counter a tendency toward an overpowered back-swing resulting in an uncontrolled out-of-plane downswing, while simultaneously training correct club rotation during a downswing, said training device comprising:
a strap, said strap having a first end and a second end;
a latch plate, said latch plate being adjustably securable in proximity to said strap first end;
a latch, said latch being capable of releasably receiving a portion of said latch plate;
at least one bungee cord, said at least one bungee cord having a first end and a second end, said first end of said at least one bungee cord being attached to said strap at a position relative to said latch;
a shaft attachment means, said shaft attachment means being located proximate to said second end of said at least one bungee cord.
2. The golf swing training device according to claim 1, wherein said shaft attachment means comprises said at least one bungee cord being adjustably secured within a cinch device.
3. The golf swing training device according to claim 2, wherein said cinch device comprises a housing and a button disposed therein being spring biased to cause a portion of said button to engage a portion of said at least one bungee cord against said housing to prevent relative movement therebetween.
4. The golf swing training device according to claim 3, wherein said bungee attachment position on said strap being relative to said latch comprises a position being approximately in the range of 0 to 12 inches to either side of said latch.
5. The golf swing training device according to claim 4, wherein said bungee attachment position on said strap being relative to said latch comprises a position being approximately 4 to 6 inches away from said latch.
6. The golf swing training device according to claim 5, wherein said properly developed golf swing comprises developing a person’s muscle memory for a controlled, slowing back-swing in preparation for reversing swing direction into a smooth, on-plane downswing.
7. The golf swing training device according to claim 6, wherein said at least one bungee cord comprises a first cord portion, and a second cord portion being joined to said first cord.
8. The golf swing training device according to claim 7, wherein said first cord portion has a first elastic modulus, and said second cord portion has a second elastic modulus, said second elastic modulus being greater than said first elastic modulus.
9. The golf swing training device according to claim 8, wherein said second cord portion is pre-stretched.
10. The golf swing training device according to claim 9, wherein said first cord reached full elongation at least part way to said full backswing, and wherein said pre-stretched second cord elongates to causes a \u2018bounce\u2019 as said full back swing position is reached.
11. The golf swing training device according to claim 10, wherein said at least one bungee cord comprises said second end of said bungee cord being looped around to attach to said strap.
12. A golf swing training device worn by a golfer to properly develop a golf swing and counter a tendency toward an overpowered back-swing resulting in an uncontrolled out-of-plane downswing, while simultaneously training correct club rotation during a downswing, said training device comprising:
a strap, said strap having a first end and a second end;
a latch plate, said latch plate being adjustably securable in proximity to said strap first end;
a latch, said latch being capable of releasably receiving a portion of said latch plate;
at least one elastic resistance band, said at least elastic resistance band cord having a first end and a second end, said first end of said at least one elastic resistance band being attached to said strap at a position relative to said latch;
a shaft attachment means, said shaft attachment means being located proximate to said second end of said at least one elastic resistance band.
13. The golf swing training device according to claim 12, wherein said shaft attachment means comprises said at least one elastic resistance band being adjustably secured within a cinch device to provide for adjustments to an effective length of said resistance band.
14. The golf swing training device according to claim 13, wherein said cinch device comprises a housing and a button slidably disposed therein being spring biased to cause a portion of said button to engage a portion of said at least one elastic resistance band against said housing to prevent relative movement therebetween.
15. The golf swing training device according to claim 12, wherein said bungee attachment position on said strap being relative to said latch comprises a position being approximately in the range of 0 inches to 18 inches away from said latch.
16. The golf swing training device according to claim 15, wherein said resistance band attachment position on said strap being relative to said latch comprises a position being approximately 4 to 6 inches away from said latch.
17. The golf swing training device according to claim 12, wherein said properly developed golf swing comprises developing a person’s muscle memory for a controlled, slowing back-swing in preparation for reversing swing direction into a smooth, on-plane downswing.
18. The golf swing training device according to claim 17, wherein said at least one elastic resistance band comprises at least one bungee cord.
19. The golf swing training device according to claim 18, wherein said at least one bungee cord comprises a first cord portion, and a second cord portion being joined to said first cord; and wherein said first cord portion has a first elastic modulus, and said second cord portion has a second elastic modulus, said second elastic modulus being greater than said first elastic modulus.
20. The golf swing training device according to claim 19, wherein said second cord portion is pre-stretched.
21. The golf swing training device according to claim 20, wherein said first cord reached full elongation at least part way to said full backswing, and wherein said pre-stretched second cord elongates to cause a \u2018bounce\u2019 as said full back swing position is reached.
22. The golf swing training device according to claim 20, wherein said at least one bungee cord comprises said second end of said bungee cord being looped around to attach to said strap.
23. A swing training device worn by a user to properly develop a racquet swing and counter a tendency toward an overpowered back-swing resulting in an uncontrolled out-of-plane forward-swing, while simultaneously training correct racquet rotation during a forward-swing, said training device comprising:
a strap, said strap having a first end and a second end;
a latch plate, said latch plate being adjustably securable in proximity to said strap first end;
a latch, said latch being capable of releasably receiving a portion of said latch plate;
at least one bungee cord, said at least one bungee cord having a first end and a second end, said first end of said at least one bungee cord being attached to said strap at a position relative to said latch;
a racquet shaft attachment means, said racquet shaft attachment means being located proximate to said second end of said at least one bungee cord.
24. The swing training device according to claim 23, wherein said shaft attachment means comprises said at least one bungee cord being adjustably secured within a cinch device.
25. The swing training device according to claim 24, wherein said cinch device comprises a housing and a button disposed therein being spring biased to cause a portion of said button to engage a portion of said at least one bungee cord against said housing to prevent relative movement therebetween.
26. The swing training device according to claim 25, wherein said bungee attachment position on said strap being relative to said latch comprises a position being approximately in the range of 12 inches to either side of said latch.
27. The swing training device according to claim 26, wherein said properly developed swing comprises developing a person’s muscle memory for a controlled, slowing back-swing in preparation for reversing swing direction into a smooth, on-plane forward-swing.
28. The swing training device according to claim 27, wherein said at least one bungee cord comprises a first cord portion, and a second cord portion being joined to said first cord.
29. The swing training device according to claim 28, wherein said first cord portion has a first elastic modulus, and said second cord portion has a second elastic modulus, said second elastic modulus being greater than said first elastic modulus.
30. The swing training device according to claim 29, wherein said second cord portion is pre-stretched.
31. The swing training device according to claim 30, wherein said first cord reaches full elongation at least part way to said full backswing, and wherein said pre-stretched second cord elongates to cause a \u2018bounce\u2019 as said full back swing position is reached.
32. A golf swing training device worn by a golfer to properly develop a golf swing and counter a tendency toward an overpowered back-swing resulting in an uncontrolled out-of-plane downswing, while simultaneously training correct club rotation during a downswing, said training device comprising:
a strap, said strap being adapted to be positioned about a user’s waist
at least one bungee cord, said at least one bungee cord having a first end and a second end, said first end of said at least one bungee cord being attached to said strap and extending therefrom;
a shaft attachment means, said shaft attachment means being located proximate to said second end of said at least one bungee cord.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A waferscale package system comprising:
forming a protection structure comprises:
forming a wafer,
fabricating a device element on the wafer,
forming a waferscale spacer around the device element and having a thickness greater than a width thereof and greater than the thickness of the device element, and
attaching a waferscale cap to the waferscale spacer to cover the device element;
attaching a carrier to the protection structure;
electrically connecting the wafer outside the waferscale spacer to the carrier with bond wires; and
molding an encapsulant around the protection structure to the carrier.
2. The system as claimed in claim 1 wherein fabricating the device element on the wafer comprises fabricating a microelectromechanical system element.
3. The system as claimed in claim 1 wherein fabricating the device element on the wafer comprises fabricating an optical element with the waferscale cap optically transparent.
4. The system as claimed in claim 1 wherein forming the waferscale spacer around the device element comprises forming a dam type waferscale spacer with the waferscale cap for preventing the encapsulant from interfering with the device element.
5. The system as claimed in claim 1 wherein forming the waferscale spacer around the device element comprises forming a step-dam type waferscale spacer with the waferscale cap, on a step of the step-dam waferscale spacer, for preventing the encapsulant from interfering with the device element.
6. A waferscale package system comprising:
forming a protection structure comprises:
forming a wafer,
fabricating a device element on the wafer,
forming a waferscale spacer around the device element and having a thickness greater than width thereof and greater than the thickness of the device element,
attaching a waferscale cap to the waferscale spacer to cover the device element, and singulating the wafer to form a number of a semiconductor die;
attaching a carrier to the protection structure;
electrically connecting the semiconductor die outside the waferscale spacer to the carrier with bond wires; and
molding an encapsulant around the protection structure to the carrier.
7. The system as claimed in claim 6 wherein molding the encapsulant around the protection structure to the carrier comprises exposing a top of the waferscale cap.
8. The system as claimed in claim 6 wherein molding the encapsulant around the protection structure to the carrier comprises forming a hermetic seal of the protection structure.
9. The system as claimed in claim 6 wherein forming the wafer comprises forming an optical structure.
10. The system as claimed in claim 6 further comprising attaching electrical interconnects between carrier and bonding pads of the semiconductor die.
11. A waferscale package system comprising:
a protection structure comprises:
a semiconductor die,
a device element on the semiconductor die,
a waferscale spacer around the device element and having a thickness greater than a width thereof and greater than the thickness of the device element, and
a waferscale cap attached to the waferscale spacer to cover the device element;
a carrier attached to the protection structure;
bond wires electrically connecting the wafer outside the waferscale spacer to the carrier; and
an encapsulant around the protection structure to the carrier.
12. The system as claimed in claim 11 wherein the device element on the semiconductor die is a microelectromechanical system element.
13. The system as claimed in claim 11 wherein the device element on the semiconductor die is an optical element with the waferscale cap optically transparent.
14. The system as claimed in claim 11 wherein the waferscale spacer around the device element is a dam type waferscale spacer with the waferscale cap for preventing the encapsulant from interfering with the device element.
15. The system as claimed in claim 11 wherein the waferscale spacer around the device element is a step-dam type waferscale spacer with the waferscale cap, on a step of the step-dam waferscale spacer, for preventing the encapsulant from interfering with the device element.
16. The system as claimed in claim 11 wherein the carrier is a substrate or lead frame.
17. The system as claimed in claim 16 wherein the encapsulant around the protection structure to the carrier comprises a top of the waferscale cap exposed.
18. The system as claimed in claim 16 wherein the encapsulant around the protection structure to the carrier forms a hermetic seal by the encapsulant of the protection structure.
19. The system as claimed in claim 16 wherein the semiconductor die supports an optical structure.
20. The system as claimed in claim 16 further comprising electrical interconnects between carrier and bonding pads of the semiconductor die.