1. A method for assembling an integrated circuit package, comprising:
applying, on an integrated circuit die having opposing first and second surfaces and mounted to a first surface of a substrate, a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
applying a second TIM to the first surface of the substrate to be separated from the die by a gap, the second TIM having a second thermal resistance that is greater than the first thermal resistance; and
mounting an open end of a heat spreader lid to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM and the second TIM each being in contact with an inner surface of the heat spreader lid.
2. The method of claim 1, wherein the second TIM has a mechanical rigidity that is greater than a mechanical rigidity of the first TIM.
3. The method of claim 1, further comprising:
applying the second TIM to the inner surface of the heat spreader lid, the second TIM being connected between the first surface of the substrate and the inner surface of the heat spreader lid.
4. The method of claim 1, wherein the first TIM is positioned on the second surface of the die on at least one determined hot spot of the die.
5. The method of claim 1, further comprising:
applying at least one additional TIM on the second surface of the die to be in contact with the inner surface of the heat spreader lid,
wherein the at least one additional TIM has a thermal resistance that is less than the first thermal resistance and the second thermal resistance, and
wherein the at least one additional TIM has a mechanical rigidity that is greater than a mechanical rigidity of the first TIM and the second TIM.
6. The method of claim 5, wherein the at least one additional TIM is positioned on the second surface of the die on a respective at least one determined hot spot of the die.
7. The method of claim 1, further comprising at least one of:
applying the second TIM to the first surface of the substrate to form a ring around the die that is separated from the edge of the die by the gap; or
applying the second TIM to the first surface of the substrate to form a ring around the die that is separated from the edge of the die by the gap, wherein the ring around the die formed by the second TIM comprises at least one opening.
8. The method of claim 1, wherein said applying a second TIM to a surface comprises:
mounting a first surface of a stiffener ring to the first surface of the substrate by the second TIM, the stiffener ring forming a ring around the die; and
applying the second TIM to the second surface of the stiffener ring to connect the second surface of the stiffener ring to the inner surface of the heat spreader lid.
9. An integrated circuit package assembled according to the method of claim 1.
10. An integrated circuit (IC) package, comprising:
a substrate having opposing first and second surfaces;
an IC die having opposing first and second surfaces, wherein the first surface of the die is flip chip mounted to the first surface of the substrate;
a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
a heat spreader lid having a open end mounted to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM being in contact with an inner surface of the heat spreader lid; and
a second TIM coupled between the first surface of the substrate and the inner surface of the heat spreader lid, and is separated from an edge of the die by a gap, the second TIM having a second thermal resistance that is greater than the first thermal resistance.
11. The IC package of claim 10, wherein the second TIM has a mechanical rigidity that is greater than a mechanical rigidity of the first TIM.
12. The IC package of claim 11, wherein the second TIM connects the first surface of the substrate to the inner surface of the heat spreader lid.
13. The IC package of claim 10, wherein the first TIM is positioned on the second surface of the die on at least one determined hot spot of the die.
14. The IC package of claim 10, further comprising:
at least one additional TIM on the second surface of the die and in contact with the inner surface of the heat spreader lid, the at least one additional TIM having a thermal resistance that is different than the first thermal resistance and the second thermal resistance.
15. The IC package of claim 14, wherein the thermal resistance of the at least one additional TIM is less than the thermal resistance of the first TIM and the second TIM.
16. The IC package of claim 14, wherein the at least one additional TIM has a mechanical rigidity that is greater than a mechanical rigidity of the first TIM and the second TIM.
17. The IC package of claim 14, wherein the at least one additional TIM is positioned on the second surface of the die on a respective at least one determined hot spot of the die.
18. The IC package of claim 10, wherein the second TIM forms a ring around the die that is separated from the edge of the die by the gap.
19. The IC package of claim 18, wherein the ring around the die formed by the second TIM comprises at least one opening.
20. An integrated circuit (IC) package, comprising:
a substrate having opposing first and second surfaces;
an IC die having opposing first and second surfaces, wherein the first surface of the die is flip chip mounted to the first surface of the substrate;
a first thermal interface material (TIM) on the second surface of the die, the first TIM having a first thermal resistance;
a heat spreader lid having an open end mounted to the first surface of the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate, the first TIM being in contact with an inner surface of the heat spreader lid;
a second TIM coupled between the first surface of the substrate and the inner surface of the heat spreader lid, and separated from an edge of the die by a gap, the second TIM having a second thermal resistance that is greater than the first thermal resistance; and
a stiffener ring mounted to the first surface of the substrate by the second TIM and attached to the inner surface of the heat spreader lid by the second TIM, the stiffener ring forming a ring around the die.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-28. (canceled)
29. A method of detecting particles, comprising:
providing a sample comprising particles to be detected and a fluid in which said particles are at least one of suspended or dissolved;
concentrating said sample by removing at least a portion of said fluid using a microfluidic device to provide a concentrated sample;
mixing said concentrated sample with a reagent to label said particles to be detected using said microfluidic device; and
detecting said particles after said mixing based on a response of said labels,
wherein said sample is greater than about 1 \u03bcl and less than about 1 ml, and said concentrated sample is reduced in volume by a factor of at least 100.
30. The method of detecting particles according to claim 29, wherein said concentrated sample is less than 100 nl.
31. The method of detecting particles according to claim 29, wherein said particles are single molecules.
32. The method of detecting particles according to claim 29, wherein said mixing said concentrated sample with said reagent labels said particles to be detected with fluorescent molecules, and
wherein said detecting comprises illuminating said particles to be detected to cause said fluorescent molecules to emit fluorescent light to be detected.
33. The method of detecting particles according to claim 32, wherein said illuminating comprises illuminating said sample with a substantially planar beam of light to perform cylindrical illumination confocal spectroscopy.